Supervisory Circuits Low Power MicroMonitor Chip
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP8,.19 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | PUSHBUTTON RESET |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电流 (Isup) | 0.5 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 阈值电压标称 | +4.37/4.62V |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| DS1232LPU+ | DS1232LPS | DS1232LPN- | DS1232LPN | DS1232LPSN-2+T&R | DS1232LPS-2+T&R | DS1232LPS-2 | DS1232LPSN | CPF-2391JT-1R36 | DS1232LPS+ | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Supervisory Circuits Low Power MicroMonitor Chip | Supervisory Circuits Low Power MicroMonitor Chip | Supervisory Circuits Low Power MicroMonitor Chip | Supervisory Circuits Low Power MicroMonitor Chip | Supervisory Circuits Low Power MicroMonitor Chip | Supervisory Circuits Low Power MicroMonitor Chip | Supervisory Circuits Low Power MicroMonitor Chip | Supervisory Circuits Low Power MicroMonitor Chip | Fixed Resistor, Metal Film, 2W, 390ohm, 350V, 5% +/-Tol, -100,100ppm/Cel, | Supervisory Circuits Low Power MicroMonitor Chip |
| 是否无铅 | 不含铅 | - | - | 含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | - | 不含铅 |
| 是否Rohs认证 | 符合 | - | - | 不符合 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | 符合 |
| 零件包装代码 | SOIC | - | - | DIP | SOIC | SOIC | SOIC | SOIC | - | SOIC |
| 包装说明 | TSSOP, TSSOP8,.19 | - | - | 0.300 INCH, DIP-8 | SOP, SOP8,.25 | SOP, SOP8,.25 | 0.150 INCH, SOIC-8 | 0.300 INCH, SOIC-16 | - | SOP, SOP16,.4 |
| 针数 | 8 | - | - | 8 | 8 | 8 | 8 | 16 | - | 16 |
| Reach Compliance Code | compliant | - | - | not_compliant | compliant | compliant | not_compliant | not_compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | PUSHBUTTON RESET | - | - | PUSHBUTTON RESET OPTION | PUSHBUTTON RESET OPTION | PUSHBUTTON RESET OPTION | PUSHBUTTON RESET OPTION | PUSHBUTTON RESET OPTION | - | PUSHBUTTON RESET OPTION |
| 可调阈值 | NO | - | - | NO | NO | NO | NO | NO | - | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G8 | - | - | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G16 | - | R-PDSO-G16 |
| JESD-609代码 | e3 | - | - | e0 | e3 | e3 | e0 | e0 | e0 | e3 |
| 长度 | 3 mm | - | - | 9.375 mm | 4.9 mm | 4.9 mm | 4.9 mm | 10.3 mm | - | 10.3 mm |
| 湿度敏感等级 | 1 | - | - | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 信道数量 | 1 | - | - | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 功能数量 | 1 | - | - | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 8 | - | - | 8 | 8 | 8 | 8 | 16 | 2 | 16 |
| 最高工作温度 | 70 °C | - | - | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 230 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | TSSOP | - | - | DIP | SOP | SOP | SOP | SOP | - | SOP |
| 封装等效代码 | TSSOP8,.19 | - | - | DIP8,.3 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP16,.4 | - | SOP16,.4 |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | Axial | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | - | - | 240 | 260 | 260 | 245 | 245 | - | 260 |
| 电源 | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1.1 mm | - | - | 4.572 mm | 1.75 mm | 1.75 mm | 1.75 mm | 2.65 mm | - | 2.65 mm |
| 最大供电电流 (Isup) | 0.5 mA | - | - | 0.5 mA | 0.5 mA | 0.5 mA | 0.5 mA | 0.5 mA | - | 0.5 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | YES | - | - | NO | YES | YES | YES | YES | - | YES |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | METAL FILM | CMOS |
| 温度等级 | COMMERCIAL | - | - | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | - | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | - | - | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
| 端子形式 | GULL WING | - | - | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | - | GULL WING |
| 端子节距 | 0.65 mm | - | - | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | DUAL | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL |
| 阈值电压标称 | +4.37/4.62V | - | - | +4.37/4.62V | +4.37/4.62V | +4.37/4.62V | +4.37/4.62V | +4.37/4.62V | - | +4.37/4.62V |
| 处于峰值回流温度下的最长时间 | 30 | - | - | 20 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 3 mm | - | - | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.5 mm | - | 7.5 mm |
| Base Number Matches | 1 | - | - | - | 1 | 1 | 1 | 1 | - | 1 |
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