NXP Semiconductors
Data Sheet: Technical Data
K22P121M100SF9
Rev. 7, 08/2016
Kinetis K22F 128KB Flash
100 MHz ARM® Cortex®-M4 Based Microcontroller with FPU
The Kinetis K22 product family members are optimized for cost-
sensitive applications requiring low-power, USB connectivity,
high peripheral integration and processing efficiency with a
floating-point unit. These devices share the comprehensive
enablement and scalability of the Kinetis family.
This product offers:
• Run power consumption down to 120 μA/MHz. Static
power consumption down to 2.6 μA with full state retention
and 6 μs wakeup. Lowest static mode down to 120 nA.
• USB LS/FS OTG 2.0 with embedded 3.3 V, USB FS device
crystal-less functionality.
MK22FN128VDC10
MK22FN128VLL10
MK22FN128VMP10
MK22FN128VLH10
121 XFBGA (DC)
8 x 8 x 0.5 Pitch 0.65
mm
100 LQFP (LL)
14 x 14 x 1.4 Pitch 0.5
mm
64 MAPBGA (MP)
5 x 5 x 1.2 Pitch 0.5
mm
64 LQFP (LH)
10 x 10 x 1.4 Pitch 0.5
mm
Performance
• 100 MHz ARM Cortex-M4 core with DSP instructions
delivering 1.25 Dhrystone MIPS per MHz
Memories and memory interfaces
• 128 KB of embedded flash and 24 KB of RAM
• Serial programming interface(EzPort)
• Pre-programmed Kinetis flashloader for one-time, in-
system factory programming
System peripherals
• Flexible low-power modes, multiple wakeup sources
• 4-channel DMA controller
• Independent External and Software Watchdog monitor
Clocks
• Two crystal oscillators: 32 kHz (RTC) and 32-40 kHz or
3-32 MHz
• Three internal oscillators: 32 kHz, 4 MHz, and 48 MHz
• Multi-purpose clock generator with FLL
Security and integrity modules
• Hardware CRC module
• 128-bit unique identification (ID) number per chip
• Flash access control to protect proprietary software
Human-machine interface
• Up to 67 general-purpose I/O (GPIO)
Analog modules
• Two 16-bit SAR ADCs (1.2 MS/s in 12bit mode)
• One 12-bit DAC
• Two analog comparators (CMP) with 6-bit DAC
• Accurate internal voltage reference
Communication interfaces
• USB LS/FS OTG 2.0 with on-chip transceiver
• USB full-speed device crystal-less operation
• Two SPI modules
• Three UART modules and one low-power UART
• Two I2C: Support for up to 1 Mbps operation
• I2S module
Timers
• One 8-channel general-purpose/PWM timer
• Two 2-channel general-purpose timers with
quadrature decoder functionality
• Periodic interrupt timers
• 16-bit low-power timer
• Real-time clock with independent power domain
• Programmable delay block
Operating Characteristics
• Voltage range (including flash writes): 1.71 to 3.6 V
• Temperature range (ambient): -40 to 105°C
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Ordering Information
Part Number
Flash (KB)
MK22FN128VDC10
MK22FN128VLL10
MK22FN128VMP10
MK22FN128VLH10
128
128
128
128
Memory
SRAM (KB)
24
24
24
24
67
66
40
40
Number of GPIOs
Device Revision Number
Device Mask Set Number
0N74K
SIM_SDID[REVID]
0000
JTAG ID Register[PRN]
0000
Related Resources
Type
Selector
Guide
Product Brief
Reference
Manual
Data Sheet
Chip Errata
Package
drawing
Description
The NXP Solution Advisor is a web-based tool that features interactive
application wizards and a dynamic product selector
The Product Brief contains concise overview/summary information to
enable quick evaluation of a device for design suitability.
The Reference Manual contains a comprehensive description of the
structure and function (operation) of a device.
The Data Sheet is this document. It includes electrical characteristics
and signal connections.
Resource
KINETISKMCUSELGD
K22FPB
K22P121M100SF9RM
K22P121M100SF9
The chip mask set Errata provides additional or corrective information for KINETIS_K_xN74K
1
a particular device mask set.
Package dimensions are provided by part number:
• MK22FN128VDC10
• MK22FN128VLL10
• MK22FN128VMP10
• MK22FN128VLH10
Package drawing:
•
98ASA00595D
•
98ASS23308W
•
98ASA00420D
•
98ASS23234W
1. To find the associated resource, go to
nxp.com
and perform a search using this term with the
x
replaced by the revision
of the device you are using.
Figure 1
shows the functional modules in the chip.
2
NXP Semiconductors
Kinetis K22F 128KB Flash, Rev. 7, 08/2016
ARM
®
Cortex™-M4
Core
Debug
interfaces
Interrupt
controller
DSP
System
DMA (4 ch)
Memories and Memory Interfaces
Program
flash
(128 KB)
Serial
programming
interface
(EzPort)
RAM
(24 KB)
Clocks
Frequency-
locked loop
Low/high
frequency
oscillators
FPU
Low-leakage
wakeup
Internal
and external
watchdogs
Internal
reference
clocks
and Integrity
CRC
Security
Analog
16-bit
SAR ADC x2
Comparator
with 6-bit DAC
x2
12-bit DAC
x1
High
performance
voltage ref
Timers
Timers
x1 (8ch)
x2 (2ch)
Programmable
Communication Interfaces
I
C
x2
UART
x3
LPUART
x1
2
Human-Machine
Interface (HMI)
Up to
67 GPIOs
I
S
2
Flash access
control
delay block
USB OTG
LS/FS
USB LS/FS
transceiver
Periodic
interrupt
timers
16-bit
low-power
timer
Independent
real-time
clock
SPI
x2
Figure 1. Functional block diagram
Kinetis K22F 128KB Flash, Rev. 7, 08/2016
3
NXP Semiconductors
Table of Contents
1 Ratings.................................................................................... 5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings....................................................... 5
1.4 Voltage and current operating ratings............................. 5
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................6
2.2.1 Voltage and current operating requirements....... 6
2.2.2 LVD and POR operating requirements................7
2.2.3 Voltage and current operating behaviors.............8
2.2.4 Power mode transition operating behaviors........ 9
2.2.5 Power consumption operating behaviors............ 10
2.2.6 EMC radiated emissions operating behaviors..... 17
2.2.7 Designing with radiated emissions in mind..........18
2.2.8 Capacitance attributes.........................................18
2.3 Switching specifications...................................................18
2.3.1 Device clock specifications..................................18
2.3.2 General switching specifications......................... 19
2.4 Thermal specifications..................................................... 20
2.4.1 Thermal operating requirements......................... 20
2.4.2 Thermal attributes................................................20
3 Peripheral operating requirements and behaviors.................. 21
3.1 Core modules.................................................................. 21
3.1.1 SWD electricals .................................................. 21
3.1.2 JTAG electricals.................................................. 22
3.2 System modules.............................................................. 25
3.3 Clock modules................................................................. 25
3.3.1 MCG specifications..............................................25
3.3.2 IRC48M specifications.........................................27
3.3.3 Oscillator electrical specifications........................28
3.3.4 32 kHz oscillator electrical characteristics........... 30
3.4 Memories and memory interfaces................................... 31
3.4.1 Flash electrical specifications.............................. 31
3.4.2 EzPort switching specifications........................... 32
3.5 Security and integrity modules........................................ 33
3.6 Analog............................................................................. 33
3.6.1
3.6.2
ADC electrical specifications............................... 34
CMP and 6-bit DAC electrical specifications....... 38
3.6.3 12-bit DAC electrical characteristics....................40
3.6.4 Voltage reference electrical specifications.......... 43
3.7 Timers..............................................................................44
3.8 Communication interfaces............................................... 44
3.8.1 USB electrical specifications............................... 45
3.8.2 DSPI switching specifications (limited voltage
range).................................................................. 45
3.8.3 DSPI switching specifications (full voltage
range).................................................................. 47
3.8.4 Inter-Integrated Circuit Interface (I2C) timing...... 48
3.8.5 UART switching specifications............................ 50
3.8.6 I2S/SAI switching specifications.......................... 50
Dimensions............................................................................. 56
4.1 Obtaining package dimensions....................................... 56
Pinout...................................................................................... 57
5.1 K22 Signal Multiplexing and Pin Assignments.................57
5.2 Recommended connection for unused analog and
digital pins........................................................................62
5.3 K22 Pinouts..................................................................... 63
Part identification.....................................................................67
6.1 Description.......................................................................67
6.2 Format............................................................................. 67
6.3 Fields............................................................................... 68
6.4 Example...........................................................................68
6.5 121-pin XFBGA part marking.......................................... 69
6.6 64-pin MAPBGA part marking......................................... 69
Terminology and guidelines.................................................... 69
7.1 Definitions........................................................................ 69
7.2 Examples......................................................................... 70
7.3 Typical-value conditions.................................................. 70
7.4 Relationship between ratings and operating
requirements....................................................................71
4
5
6
7
7.5 Guidelines for ratings and operating requirements..........71
8 Revision History...................................................................... 71
4
NXP Semiconductors
Kinetis K22F 128KB Flash, Rev. 7, 08/2016
Ratings
1 Ratings
1.1 Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105°C
Min.
-2000
-500
-100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
1.4 Voltage and current operating ratings
Kinetis K22F 128KB Flash, Rev. 7, 08/2016
5
NXP Semiconductors
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