Latches ECL Dual Latch
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | ON Semiconductor(安森美) |
零件包装代码 | DIP |
包装说明 | LEAD FREE, PLASTIC, DIP-16 |
针数 | 16 |
Reach Compliance Code | unknown |
系列 | 10H |
JESD-30 代码 | R-PDIP-T16 |
JESD-609代码 | e3 |
长度 | 19.175 mm |
逻辑集成电路类型 | D LATCH |
位数 | 2 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 75 °C |
最低工作温度 | |
输出特性 | OPEN-EMITTER |
输出极性 | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 260 |
Prop。Delay @ Nom-Sup | 1.9 ns |
传播延迟(tpd) | 1.7 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.44 mm |
表面贴装 | NO |
技术 | ECL |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | Tin (Sn) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
触发器类型 | LOW LEVEL |
宽度 | 7.62 mm |
MC10H130PG | MC10H130FNG | MC10H130FN | MC10H130FNR2 | |
---|---|---|---|---|
描述 | Latches ECL Dual Latch | Latches ECL Dual Latch | Latches ECL Dual Latch | Latches ECL Dual Latch |
是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 |
厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
零件包装代码 | DIP | QFN | QFN | QFN |
包装说明 | LEAD FREE, PLASTIC, DIP-16 | LEAD FREE, PLASTIC, LLC-20 | PLASTIC, LLC-20 | PLASTIC, LLC-20 |
针数 | 16 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | not_compliant | not_compliant |
系列 | 10H | 10H | 10H | 10H |
JESD-30 代码 | R-PDIP-T16 | S-PQCC-J20 | S-PQCC-J20 | S-PQCC-J20 |
JESD-609代码 | e3 | e3 | e0 | e0 |
长度 | 19.175 mm | 8.965 mm | 8.965 mm | 8.965 mm |
逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | D LATCH |
位数 | 2 | 2 | 2 | 2 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 20 | 20 | 20 |
最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C |
输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | QCCJ | QCCJ | QCCJ |
封装等效代码 | DIP16,.3 | LDCC20,.4SQ | LDCC20,.4SQ | LDCC20,.4SQ |
封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE |
封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
峰值回流温度(摄氏度) | 260 | 260 | 240 | 240 |
Prop。Delay @ Nom-Sup | 1.9 ns | 1.9 ns | 1.9 ns | 1.9 ns |
传播延迟(tpd) | 1.7 ns | 1.7 ns | 1.7 ns | 1.7 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.44 mm | 4.57 mm | 4.57 mm | 4.57 mm |
表面贴装 | NO | YES | YES | YES |
技术 | ECL | ECL | ECL | ECL |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子面层 | Tin (Sn) | Tin (Sn) | Tin/Lead (Sn80Pb20) | Tin/Lead (Sn80Pb20) |
端子形式 | THROUGH-HOLE | J BEND | J BEND | J BEND |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 40 | 40 | 30 | 30 |
触发器类型 | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL |
宽度 | 7.62 mm | 8.965 mm | 8.965 mm | 8.965 mm |
Is Samacsys | - | N | N | N |
Base Number Matches | - | 1 | 1 | 1 |
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