Si823x
0.5
AND
4 . 0 A
MP
I S O
D R I V E R S
(2.5
AND
5
K
V
RMS
)
Features
Two completely isolated drivers
60 ns propagation delay (max)
in one package
Independent HS and LS inputs or
Up to 5 kV
RMS
input-to-output
PWM input versions
isolation
Transient immunity >45 kV/µs
Up to 1500 V
DC
peak driver-to-
Overlap protection and
driver differential voltage
programmable dead time
HS/LS and dual driver versions
AEC-Q100 qualification
Up to 8 MHz switching frequency
Wide operating range
0.5 A peak output (Si8230/1/2/7)
–40 to +125 °C
RoHS-compliant packages
4.0 A peak output
(Si8233/4/5/6/8)
SOIC-16 wide body
High electromagnetic immunity
SOIC-16
LGA-14
narrow body
Applications
Power delivery systems
Motor control systems
Isolated dc-dc power supplies
Lighting control systems
Plasma displays
Solar and industrial inverters
Safety Approval
UL 1577 recognized
Up
VDE certification conformity
IEC
to 5000 Vrms for 1 minute
CSA component notice 5A
approval
IEC
60747-5-5 (VDE 0884 Part 5)
EN 60950-1 (reinforced
insulation)
60950-1, 61010-1, 60601-1
(reinforced insulation)
CQC certification approval
GB4943.1
Description
The Si823x isolated driver family combines two independent, isolated
drivers into a single package. The Si8230/1/3/4 are high-side/low-side
drivers, and the Si8232/5/6/7/8 are dual drivers. Versions with peak
output currents of 0.5 A (Si8230/1/2/7) and 4.0 A (Si8233/4/5/6/8) are
available. All drivers operate with a maximum supply voltage of 24 V.
The Si823x drivers utilize Silicon Labs' proprietary silicon isolation
technology, which provides up to 5 kV
RMS
withstand voltage per UL1577
and fast 60 ns propagation times. Driver outputs can be grounded to the
same or separate grounds or connected to a positive or negative voltage.
The TTL level compatible inputs with >400 mV hysteresis are available in
individual control input (Si8230/2/3/5/6/7/8) or PWM input (Si8231/4)
configurations. High integration, low propagation delay, small installed
size, flexibility, and cost-effectiveness make the Si823x family ideal for a
wide range of isolated MOSFET/IGBT gate drive applications.
Ordering Information:
See page 39.
Rev. 1.6 4/14
Copyright © 2014 by Silicon Laboratories
Si823x
Si823x
T
ABLE
Section
OF
C
ONTENTS
Page
1. Top-Level Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
2.1. Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1. Typical Operating Characteristics (0.5 Amp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.2. Typical Operating Characteristics (4.0 Amp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.3. Family Overview and Logic Operation During Startup . . . . . . . . . . . . . . . . . . . . . . . 21
3.4. Power Supply Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.5. Power Dissipation Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
3.6. Layout Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.7. Undervoltage Lockout Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.8. Programmable Dead Time and Overlap Protection . . . . . . . . . . . . . . . . . . . . . . . . . 28
4. Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.1. High-Side/Low-Side Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.2. Dual Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.3. Dual Driver with Thermally Enhanced Package (Si8236) . . . . . . . . . . . . . . . . . . . . .31
5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
7. Package Outline: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8. Land Pattern: 16-Pin Wide Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
9. Package Outline: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
10. Land Pattern: 16-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
11. Package Outline: 14 LD LGA (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
12. Land Pattern: 14 LD LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
13. Package Outline: 14 LD LGA with Thermal Pad (5 x 5 mm) . . . . . . . . . . . . . . . . . . . . .50
14. Land Pattern: 14 LD LGA with Thermal Pad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
15. Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
15.1. Si823x Top Marking (16-Pin Wide Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
15.2. Top Marking Explanation (16-Pin Wide Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . 52
15.3. Si823x Top Marking (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . . . . 53
15.4. Top Marking Explanation (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . . . 53
15.5. Si823x Top Marking (14 LD LGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
15.6. Top Marking Explanation (14 LD LGA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Rev. 1.6
3
嵌入式系统
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