Buffers & Line Drivers OCT BUF INV 3-S W 30 OHM RES
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | SOP, |
| Reach Compliance Code | compliant |
| 系列 | ABT |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 12.8 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 5.6 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |
| 74ABT2244D-T | 74ABT2244PW | 74ABT2244DB | 74ABT2244PW-T | 74ABT2244DB-T | 74ABT2244D | 74ABT2244N | |
|---|---|---|---|---|---|---|---|
| 描述 | Buffers & Line Drivers OCT BUF INV 3-S W 30 OHM RES | Buffers u0026 Line Drivers OCT BUF 3-S W 30 OHM RES | Buffers u0026 Line Drivers OCT BUF 3-S W 30 OHM RES | Buffers & Line Drivers OCT BUF 3-S W 30 OHM RES | Buffers & Line Drivers OCT BUF 3-S W 30 OHM RES | Buffers & Line Drivers OCT BUF INV 3-S W 30 OHM RES | Buffers & Line Drivers OCT BUF 3-S W 30 OHM RES |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | SOP, | TSSOP, TSSOP20,.25 | SSOP, SSOP20,.3 | TSSOP, | SSOP, | SOP, SOP20,.4 | DIP, DIP20,.3 |
| Reach Compliance Code | compliant | unknown | unknown | unknown | compliant | unknown | unknown |
| 系列 | ABT | ABT | ABT | ABT | ABT | ABT | ABT |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 12.8 mm | 6.5 mm | 7.2 mm | 6.5 mm | 7.2 mm | 12.8 mm | 26.73 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | SSOP | TSSOP | SSOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED |
| 传播延迟（tpd） | 5.6 ns | 5.6 ns | 5.6 ns | 5.6 ns | 5.6 ns | 5.6 ns | 5.6 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 1.1 mm | 2 mm | 1.1 mm | 2 mm | 2.65 mm | 4.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | NO |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | NOT SPECIFIED |
| 宽度 | 7.5 mm | 4.4 mm | 5.3 mm | 4.4 mm | 5.3 mm | 7.5 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Source Url Status Check Date | 2013-06-14 00:00:00 | - | - | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | - | 2013-06-14 00:00:00 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 是否无铅 | - | 不含铅 | 不含铅 | - | - | 不含铅 | 不含铅 |
| 控制类型 | - | ENABLE LOW | ENABLE LOW | - | - | ENABLE LOW | ENABLE LOW |
| 负载电容（CL） | - | 50 pF | 50 pF | - | - | 50 pF | 50 pF |
| 最大I（ol） | - | 0.012 A | 0.012 A | - | - | 0.012 A | 0.012 A |
| 封装等效代码 | - | TSSOP20,.25 | SSOP20,.3 | - | - | SOP20,.4 | DIP20,.3 |
| 电源 | - | 5 V | 5 V | - | - | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | - | 5 ns | 5 ns | - | - | 5 ns | 5 ns |
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