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24FC512-I/PG

产品描述EEPROM 64kx8 - 2.5V Hi Spd Lead Free Package
产品类别存储    存储   
文件大小668KB,共37页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
下载文档 详细参数 选型对比 全文预览

24FC512-I/PG概述

EEPROM 64kx8 - 2.5V Hi Spd Lead Free Package

24FC512-I/PG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码DIP
包装说明0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
针数8
Reach Compliance Codecompliant
ECCN代码EAR99
最大时钟频率 (fCLK)1 MHz
数据保留时间-最小值200
耐久性1000000 Write/Erase Cycles
I2C控制字节1010DDDR
JESD-30 代码R-PDIP-T8
JESD-609代码e3
长度9.271 mm
内存密度524288 bit
内存集成电路类型EEPROM
内存宽度8
功能数量1
端子数量8
字数65536 words
字数代码64000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织64KX8
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP8,.3
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行SERIAL
峰值回流温度(摄氏度)NOT SPECIFIED
电源3/5 V
认证状态Not Qualified
座面最大高度5.334 mm
串行总线类型I2C
最大待机电流0.000001 A
最大压摆率0.003 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)2.5 V
表面贴装NO
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.62 mm
最长写入周期时间 (tWC)5 ms
写保护HARDWARE
Base Number Matches1

文档预览

下载PDF文档
24AA512/24LC512/24FC512
512K I
2
C
Serial EEPROM
Device Selection Table
Part
Number
24AA512
24LC512
24FC512
Note 1:
2:
V
CC
Range
1.7-5.5V
2.5-5.5V
1.7-5.5V
Max. Clock
Frequency
400 kHz
(1)
400 kHz
1 MHz
(2)
Temp.
Ranges
I
I, E
I
Description:
The Microchip Technology Inc. 24AA512/24LC512/
24FC512 (24XX512*) is a 64K x 8 (512 Kbit) Serial
Electrically Erasable PROM, capable of operation
across a broad voltage range (1.7V to 5.5V). It has
been developed for advanced, low-power applications
such as personal communications and data acquisi-
tion. This device also has a page write capability of up
to 128 bytes of data. This device is capable of both
random and sequential reads up to the 512K boundary.
Functional address lines allow up to eight devices on
the same bus, for up to 4 Mbit address space. This
device is available in the standard 8-pin plastic DIP,
SOIJ, SOIC, TSSOP, DFN, and 14-lead TSSOP
packages. The 24AA512 is also available in the 8-lead
Chip Scale package.
100 kHz for V
CC
< 2.5V
400 kHz for V
CC
< 2.5V
Features:
• Single Supply with Operation down to 1.7V for
24AA512 and 24FC512 Devices, 2.5V for
24LC512 Devices
• Low-Power CMOS Technology:
- Active current 400 uA, typical
- Standby current 100 nA, typical
• 2-Wire Serial Interface, I
2
C
Compatible
• Cascadable for up to Eight Devices
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• Page Write Time 5 ms max.
• Self-Timed Erase/Write Cycle
• 128-Byte Page Write Buffer
• Hardware Write-Protect
• ESD Protection >4000V
• More than 1 Million Erase/Write Cycles
• Data Retention > 200 years
• Packages Include 8-lead PDIP, SOIJ, SOIC,
TSSOP, DFN, Chip Scale and 14-lead TSSOP
• Pb-Free and RoHS Compliant
• Temperature Ranges:
- Industrial (I): -40C to +85C
- Automotive (E):-40C to +125C
Block Diagram
A0 A1 A2 WP
HV Generator
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
Page Latches
I/O
SCL
YDEC
SDA
V
CC
V
SS
Sense Amp.
R/W Control
Package Type
PDIP/SOIJ/SOIC/TSSOP
A0
A1
A2
V
SS
1
24XX512
2
3
4
8
7
6
5
V
CC
WP
SCL
SDA
A0
A1
NC
NC
NC
A2
V
SS
1
2
3
4
5
6
7
TSSOP
14
13
12
11
10
9
8
V
CC
WP
NC
NC
NC
SCL
SDA
A0
A1
A2
V
SS
1
2
3
4
24XX512
DFN
8 V
CC
7 WP
6 SCL
5 SDA
WP
6
CS (Chip Scale)
(1)
V
CC
A1 A0
1
4
7
2
5
8
3
A2
24XX512
SDA SCL V
SS
(TOP DOWN VIEW,
BALLS NOT VISIBLE)
Note 1:
Available in I-temp, “AA” only.
* 24XX512 is used in this document as a generic part number for the 24AA512/24LC512/24FC512 devices.
2010 Microchip Technology Inc.
DS21754M-page 1

24FC512-I/PG相似产品对比

24FC512-I/PG 24LC512T-I-ST14G 24AA512-I/PG
描述 EEPROM 64kx8 - 2.5V Hi Spd Lead Free Package EEPROM 64kx8 - 2.5V Lead Free Package 电可擦除可编程只读存储器 64kx8 - 1.8V Lead Free Package
是否无铅 不含铅 - 不含铅
是否Rohs认证 符合 - 符合
零件包装代码 DIP - DIP
包装说明 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 - DIP, DIP8,.3
针数 8 - 8
Reach Compliance Code compliant - compliant
ECCN代码 EAR99 - EAR99
最大时钟频率 (fCLK) 1 MHz - 0.4 MHz
数据保留时间-最小值 200 - 200
耐久性 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles
I2C控制字节 1010DDDR - 1010DDDR
JESD-30 代码 R-PDIP-T8 - R-PDIP-T8
JESD-609代码 e3 - e3
长度 9.271 mm - 9.271 mm
内存密度 524288 bit - 524288 bit
内存集成电路类型 EEPROM - EEPROM
内存宽度 8 - 8
功能数量 1 - 1
端子数量 8 - 8
字数 65536 words - 65536 words
字数代码 64000 - 64000
工作模式 SYNCHRONOUS - SYNCHRONOUS
最高工作温度 85 °C - 85 °C
最低工作温度 -40 °C - -40 °C
组织 64KX8 - 64KX8
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 DIP - DIP
封装等效代码 DIP8,.3 - DIP8,.3
封装形状 RECTANGULAR - RECTANGULAR
封装形式 IN-LINE - IN-LINE
并行/串行 SERIAL - SERIAL
峰值回流温度(摄氏度) NOT SPECIFIED - NOT SPECIFIED
电源 3/5 V - 2/5 V
认证状态 Not Qualified - Not Qualified
座面最大高度 5.334 mm - 5.334 mm
串行总线类型 I2C - I2C
最大待机电流 0.000001 A - 0.000001 A
最大压摆率 0.003 mA - 0.003 mA
最大供电电压 (Vsup) 5.5 V - 5.5 V
最小供电电压 (Vsup) 1.7 V - 1.7 V
标称供电电压 (Vsup) 2.5 V - 2.5 V
表面贴装 NO - NO
技术 CMOS - CMOS
温度等级 INDUSTRIAL - INDUSTRIAL
端子面层 Matte Tin (Sn) - Matte Tin (Sn)
端子形式 THROUGH-HOLE - THROUGH-HOLE
端子节距 2.54 mm - 2.54 mm
端子位置 DUAL - DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED
宽度 7.62 mm - 7.62 mm
最长写入周期时间 (tWC) 5 ms - 5 ms
写保护 HARDWARE - HARDWARE
Base Number Matches 1 - 1

 
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