PD - 96919B
IRF7904PbF
HEXFET
®
Power MOSFET
Applications
l
Dual SO-8 MOSFET for POL
Converters in Notebook Computers, Servers,
Graphics Cards, Game Consoles
and Set-Top Box
V
DSS
30V
Q1 16.2m
:
@V
GS
= 10V
Q2 10.8m
:
@V
GS
= 10V
R
DS(on)
max
I
D
7.6A
11A
Benefits
l
Very Low R
DS(on)
at 4.5V V
GS
l
Low Gate Charge
l
Fully Characterized Avalanche Voltage
and Current
l
20V V
GS
Max. Gate Rating
l
Improved Body Diode Reverse Recovery
l
100% Tested for R
G
l
Lead-Free
B
9
T ÃÃ9!
T ÃÃ9!
T ÃÃ9!
SO-8
T!
T!
B!
Absolute Maximum Ratings
Parameter
V
DS
V
GS
I
D
@ T
A
= 25°C
I
D
@ T
A
= 70°C
I
DM
P
D
@T
A
= 25°C
P
D
@T
A
= 70°C
T
J
T
STG
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Operating Junction and
Storage Temperature Range
7.6
6.1
61
1.4
0.9
0.011
-55 to + 150
Q1 Max.
30
± 20
Q2 Max.
Units
V
11
8.9
89
2.0
1.3
0.016
W/°C
°C
W
A
c
Thermal Resistance
R
θJL
R
θJA
Parameter
Junction-to-Drain Lead
g
Junction-to-Ambient
fg
Q1 Max.
20
90
Q2 Max.
20
62.5
Units
°C/W
www.irf.com
1
07/10/06
IRF7904PbF
Static @ T
J
= 25°C (unless otherwise specified)
BV
DSS
∆ΒV
DSS
/∆T
J
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Q1&Q2
Q1
Q2
Q1
Q2
V
GS(th)
∆V
GS(th)
/∆T
J
I
DSS
I
GSS
gfs
Q
g
Q
gs1
Q
gs2
Q
gd
Q
godr
Q
sw
Q
oss
R
G
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
Pre-Vth Gate-to-Source Charge
Post-Vth Gate-to-Source Charge
Gate-to-Drain Charge
Gate Charge Overdrive
Switch Charge (Q
gs2
+ Q
gd
)
Output Charge
Q1&Q2
Q1
Q2
Q1&Q2
Q1&Q2
Q1&Q2
Q1&Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Min.
30
–––
–––
–––
–––
–––
–––
1.35
–––
–––
–––
–––
–––
–––
17
23
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
0.024
0.024
11.4
14.5
8.6
10
–––
-5.0
-5.0
–––
–––
–––
–––
–––
–––
7.5
14
2.2
3.7
0.6
1.1
2.5
4.8
2.2
4.4
3.1
5.9
4.5
9.1
3.2
2.9
6.9
7.8
7.3
10
10
15
3.2
4.6
910
1780
190
390
94
180
Max.
–––
–––
–––
16.2
20.5
10.8
13
2.25
–––
–––
1.0
150
100
-100
–––
–––
11
21
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
4.8
4.4
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
–––
Min.
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
–––
–––
–––
–––
–––
11
16
2.6
6.9
Max.
1.8
2.5
61
88
1.0
1.0
17
24
3.9
10
Conditions
Units
V
GS
= 0V, I
D
= 250µA
V
V/°C Reference to 25°C, I
D
= 1mA
V
GS
= 10V, I
D
= 7.6A
mΩ V
GS
= 4.5V, I
D
= 6.1A
V
GS
= 10V, I
D
= 11A
V
GS
= 4.5V, I
D
= 8.8A
Q1: V
DS
= V
GS
, I
D
= 25µA
V
mV/°C Q2: V
DS
= V
GS
, I
D
= 50µA
µA
nA
S
V
DS
= 24V, V
GS
= 0V
V
DS
= 24V, V
GS
= 0V, T
J
= 125°C
V
GS
= 20V
V
GS
= -20V
V
DS
= 15V, I
D
= 6.1A
V
DS
= 15V, I
D
= 8.8A
R
DS(on)
Static Drain-to-Source On-Resistance
e
e
e
e
nC
Q1
V
DS
= 15V
V
GS
= 4.5V, I
D
= 6.1A
Q2
V
DS
= 15V
V
GS
= 4.5V, I
D
= 8.8A
nC
V
DS
= 16V, V
GS
= 0V
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Ω
Q1
V
DD
= 15V, V
GS
= 4.5V
I
D
= 6.1A
ns
Q2
V
DD
= 15V, V
GS
= 4.5V
I
D
= 8.8A
Clamped Inductive Load
V
GS
= 0V
V
DS
= 15V
ƒ = 1.0MHz
pF
Avalanche Characteristics
E
AS
I
AR
Parameter
Single Pulse Avalanche Energy
Avalanche Current
d
Q1 Max.
140
6.1
Q2 Max.
250
8.8
Units
mJ
A
Diode Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Units
Conditions
A
MOSFET symbol
showing the
integral reverse
A
p-n junction diode.
T
J
= 25°C, I
S
= 6.1A, V
GS
= 0V
V
T
J
= 25°C, I
S
= 8.8A, V
GS
= 0V
Q1 T
J
= 25°C, I
F
= 6.1A,
ns
V
DD
= 15V, di/dt = 100A/µs
Q2 T
J
= 25°C, I
F
= 8.8A,
nC
V
DD
= 15V, di/dt = 100A/µs
Ã
Reverse Recovery Time
Reverse Recovery Charge
e
e
e
e
2
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Typical Characteristics
Q1 - Control FET
100
TOP
IRF7904PbF
Q2 - Synchronous FET
100
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
10
BOTTOM
VGS
10V
8.0V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
10
TOP
1
1
2.5V
BOTTOM
VGS
10V
8.0V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
2.5V
≤
60µs PULSE WIDTH
Tj = 25°C
10
100
≤
60µs PULSE WIDTH
Tj = 25°C
0.1
0.1
1
10
100
0.1
0.1
1
VDS, Drain-to-Source Voltage (V)
VDS, Drain-to-Source Voltage (V)
Fig 1.
Typical Output Characteristics
100
TOP
Fig 2.
Typical Output Characteristics
100
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
BOTTOM
VGS
10V
8.0V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
TOP
10
10
2.5V
BOTTOM
VGS
10V
8.0V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
2.5V
≤
60µs PULSE WIDTH
Tj = 150°C
1
0.1
1
10
100
≤
60µs PULSE WIDTH
Tj = 150°C
1
0.1
1
10
100
VDS, Drain-to-Source Voltage (V)
VDS, Drain-to-Source Voltage (V)
Fig 3.
Typical Output Characteristics
100.0
100.0
Fig 4.
Typical Output Characteristics
ID, Drain-to-Source Current
(Α)
10.0
ID, Drain-to-Source Current
(Α)
10.0
TJ = 150°C
TJ = 150°C
1.0
TJ = 25°C
1.0
TJ = 25°C
VDS = 15V
≤
60µs PULSE WIDTH
0.1
1.0
2.0
3.0
4.0
5.0
VDS = 15V
≤
60µs PULSE WIDTH
0.1
1.0
2.0
3.0
4.0
5.0
VGS, Gate-to-Source Voltage (V)
VGS, Gate-to-Source Voltage (V)
Fig 5.
Typical Transfer Characteristics
Fig 6.
Typical Transfer Characteristics
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3
IRF7904PbF
Q1 - Control FET
10000
VGS = 0V,
f = 1 MHZ
Ciss = Cgs + Cgd, Cds SHORTED
Crss = Cgd
Typical Characteristics
Q2 - Synchronous FET
10000
VGS = 0V,
f = 1 MHZ
Ciss = Cgs + Cgd, Cds SHORTED
Crss = Cgd
Coss = Cds + Cgd
C, Capacitance (pF)
1000
Ciss
C, Capacitance (pF)
Coss = Cds + Cgd
Ciss
1000
Coss
100
Crss
Coss
Crss
10
1
10
100
100
1
10
100
VDS, Drain-to-Source Voltage (V)
VDS , Drain-to-Source Voltage (V)
Fig 7.
Typical Capacitance vs. Drain-to-Source Voltage
Fig 8.
Typical Capacitance vs. Drain-to-Source Voltage
12
VGS, Gate-to-Source Voltage (V)
12
ID= 6.1A
10
8
6
4
2
0
0
5
VGS, Gate-to-Source Voltage (V)
VDS = 24V
VDS= 15V
ID= 8.8A
10
8
6
4
2
0
VDS= 24V
VDS= 15V
10
15
20
0
5
10
15
20
25
30
35
QG Total Gate Charge (nC)
QG Total Gate Charge (nC)
Fig 9.
Typical Gate Charge vs. Gate-to-Source Voltage
1000
Fig 10.
Typical Gate Charge vs. Gate-to-Source
Voltage
1000
ID, Drain-to-Source Current (A)
ID, Drain-to-Source Current (A)
OPERATION IN THIS AREA
LIMITED BY R DS (on)
100
1msec
10
10msec
1
100msec
0.1
TA = 25°C
Tj = 150°C
Single Pulse
0.10
1.00
10.00
100.00
100µsec
OPERATION IN THIS AREA
LIMITED BY R DS(on)
100
1msec
10
10msec
1
100msec
0.1
TA = 25°C
Tj = 150°C
Single Pulse
0.10
1.00
10.00
100.00
100µsec
0.01
0.01
0.01
0.01
VDS , Drain-toSource Voltage (V)
VDS , Drain-toSource Voltage (V)
Fig 11.
Maximum Safe Operating Area
Fig 12.
Maximum Safe Operating Area
4
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Typical Characteristics
Q1 - Control FET
1.5
IRF7904PbF
Q2 - Synchronous FET
1.5
RDS(on) , Drain-to-Source On Resistance
(Normalized)
RDS(on) , Drain-to-Source On Resistance
(Normalized)
ID = 7.6A
VGS = 10V
ID = 11A
VGS = 10V
1.0
1.0
0.5
-60 -40 -20
0
20
40
60
80 100 120 140 160
0.5
-60 -40 -20
0
20
40
60
80 100 120 140 160
TJ , Junction Temperature (°C)
TJ , Junction Temperature (°C)
Fig 13.
Normalized On-Resistance vs. Temperature
100.0
Fig 14.
Normalized On-Resistance vs. Temperature
100.0
ISD, Reverse Drain Current (A)
ISD, Reverse Drain Current (A)
10.0
TJ = 150°C
TJ = 150°C
10.0
1.0
1.0
TJ = 25°C
TJ = 25°C
VGS = 0V
0.1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
VGS = 0V
0.1
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
VSD, Source-to-Drain Voltage (V)
VSD, Source-to-Drain Voltage (V)
Fig 15.
Typical Source-Drain Diode Forward Voltage
(
RDS (on), Drain-to -Source On Resistance m
Ω)
40
Fig 16.
Typical Source-Drain Diode Forward Voltage
(
RDS (on), Drain-to -Source On Resistance m
Ω)
25
ID = 7.6A
35
ID = 11A
20
30
25
15
TJ = 125°C
20
TJ = 125°C
10
15
TJ = 25°C
5
2.0
4.0
6.0
8.0
10.0
10
2.0
4.0
6.0
TJ = 25°C
8.0
10.0
VGS, Gate-to-Source Voltage (V)
VGS, Gate-to-Source Voltage (V)
Fig 17.
Typical On-Resistance vs.Gate Voltage
Fig 18.
Typical On-Resistance vs.Gate Voltage
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