Digital Signal Processors & Controllers - DSP, DSC 200 MHz SHARC/on chipRom EPAD PBfree
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | QFP |
| 包装说明 | ROHS COMPLIANT, MO-026BFB-HD, LQFP-144 |
| 针数 | 144 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.A.2 |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 16 |
| 桶式移位器 | YES |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 33.33 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FLOATING POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PQFP-G144 |
| JESD-609代码 | e3 |
| 长度 | 20 mm |
| 低功率模式 | NO |
| 湿度敏感等级 | 3 |
| 端子数量 | 144 |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装等效代码 | QFP144,.87SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 98304 |
| 座面最大高度 | 1.6 mm |
| 最大供电电压 | 1.05 V |
| 最小供电电压 | 0.95 V |
| 标称供电电压 | 1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 20 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| ADSP-21365YSWZ-2AA | ADSP-21366KBC-1AA | ADSP-21366BBC-1AA | ADSP-21366BBCZ-1AA | ADSP-21362BSWZ-1AA | |
|---|---|---|---|---|---|
| 描述 | Digital Signal Processors & Controllers - DSP, DSC 200 MHz SHARC/on chipRom EPAD PBfree | Digital Signal Processors & Controllers - DSP, DSC 333 MHz SHARC with on chipRom | Digital Signal Processors & Controllers - DSP, DSC 333 MHz SHARC with on chipRom | Digital Signal Processors & Controllers - DSP, DSC 333 MHz SHARC with on chipRom | Digital Signal Processors & Controllers - DSP, DSC High Perf 32B Floating-Point |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | QFP | BGA | BGA | BGA | QFP |
| 包装说明 | ROHS COMPLIANT, MO-026BFB-HD, LQFP-144 | MO-205AE, CSBGA-136 | MO-205AE, CSBGA-136 | ROHS COMPLIANT, MO-205AE, CSBGA-136 | ROHS COMPLIANT, MO-026BFB-HD, LQFP-144 |
| 针数 | 144 | 136 | 136 | 136 | 144 |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 16 | 16 | 16 | 16 | 16 |
| 桶式移位器 | YES | YES | YES | YES | YES |
| 位大小 | 32 | 32 | 32 | 32 | 32 |
| 边界扫描 | YES | YES | YES | YES | YES |
| 最大时钟频率 | 33.33 MHz | 55.55 MHz | 55.55 MHz | 55.55 MHz | 55.55 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PQFP-G144 | S-PBGA-B136 | S-PBGA-B136 | S-PBGA-B136 | S-PQFP-G144 |
| JESD-609代码 | e3 | e0 | e0 | e1 | e3 |
| 长度 | 20 mm | 12 mm | 12 mm | 12 mm | 20 mm |
| 低功率模式 | NO | NO | NO | NO | NO |
| 端子数量 | 144 | 136 | 136 | 136 | 144 |
| 最高工作温度 | 105 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFBGA | LFBGA | LFBGA | LFQFP |
| 封装等效代码 | QFP144,.87SQ,20 | BGA136,14X14,32 | BGA136,14X14,32 | BGA136,14X14,32 | QFP144,.87SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 240 | 240 | 260 | 260 |
| 电源 | 1,3.3 V | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 98304 | 98304 | 98304 | 98304 | 98304 |
| 座面最大高度 | 1.6 mm | 1.7 mm | 1.7 mm | 1.7 mm | 1.6 mm |
| 最大供电电压 | 1.05 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V |
| 最小供电电压 | 0.95 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V |
| 标称供电电压 | 1 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Tin/Lead/Silver (Sn/Pb/Ag) | Tin/Lead/Silver (Sn/Pb/Ag) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) |
| 端子形式 | GULL WING | BALL | BALL | BALL | GULL WING |
| 端子节距 | 0.5 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.5 mm |
| 端子位置 | QUAD | BOTTOM | BOTTOM | BOTTOM | QUAD |
| 处于峰值回流温度下的最长时间 | 40 | 30 | 30 | 40 | 40 |
| 宽度 | 20 mm | 12 mm | 12 mm | 12 mm | 20 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| 湿度敏感等级 | 3 | 3 | 3 | - | 3 |
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