Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> CM8064601618705S R1T6

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CM8064601618705S R1T6: 产品描述CPU - Central Processing Units Celeron G1820TE Dual CR 2.2GHz FCLGA1150; 产品类别半导体嵌入式处理器和控制器; 文件大小3MB，共126页; 制造商Intel(英特尔); 官网地址http://www.intel.com/; 标准

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CM8064601618705S R1T6概述

CPU - Central Processing Units Celeron G1820TE Dual CR 2.2GHz FCLGA1150

CM8064601618705S R1T6规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	Intel(英特尔)
产品种类 Product Category	CPU - Central Processing Units
RoHS	Details
产品 Product	Desktop Processors
封装 / 箱体 Package / Case	FCLGA-1150
Family	Intel Celeron
Core	Intel Celeron
Code Name	Haswell
Processor Series	G1820TE
Embedded Options	Embedded
Number of Cores	2 Core
TDP - Max	35 W
Maximum Clock Frequency	2.2 GHz
Data Bus Width	64 bit
Memory Size	32 GB
Memory Type	DDR3-1333
System Bus Type	DMI
System Bus Speed	5 GT/S
Cache Memory	2 MB
系列 Packaging	Tray
Package / Case Size	37.5 mm x 37.5 mm
安装风格 Mounting Style	SMD/SMT
CPU Configuration - Max	1 Configuration
ECC Memory Supported	Supported
Intel Hyper-Threading Technology	Without HT Technology
Intel Virtualization Technology - VT	With VT
Lithography - Process Technology	22 nm
Number of Displays Supported	3 Display
Number of Memory Channels	2 Channel
Number of PCI Express Lanes	16 Lane
Number of Threads	2 Thread
PCIe Configurations	1x16/2x8/1x8 + 2x4
PCIe Revision	Revision 3.0
工厂包装数量 Factory Pack Quantity	1

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Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and

Desktop Intel

Celeron

Processor

Family

Datasheet – Volume 1 of 2

March 2015

Order No.: 328897-010

Contents—Processor

Contents

Revision History..................................................................................................................9

1.0 Introduction................................................................................................................10

1.1

1.2

1.3

1.4

1.5

1.6

1.7

Supported Technologies.........................................................................................11

Interfaces............................................................................................................ 12

Power Management Support...................................................................................12

Thermal Management Support................................................................................13

Package Support...................................................................................................13

Terminology.........................................................................................................13

Related Documents............................................................................................... 16

2.0 Interfaces................................................................................................................... 18

2.1 System Memory Interface...................................................................................... 18

2.1.1 System Memory Technology Supported.......................................................19

2.1.2 System Memory Timing Support................................................................. 20

2.1.3 System Memory Organization Modes........................................................... 21

2.2 PCI Express* Interface.......................................................................................... 23

2.2.1 PCI Express* Support................................................................................ 23

2.2.2 PCI Express* Architecture.......................................................................... 24

2.2.3 PCI Express* Configuration Mechanism........................................................ 24

2.3 Direct Media Interface (DMI).................................................................................. 26

2.4 Processor Graphics................................................................................................28

2.5 Processor Graphics Controller (GT)..........................................................................28

2.5.1 3D and Video Engines for Graphics Processing.............................................. 29

2.5.2 Multi Graphics Controllers Multi-Monitor Support........................................... 31

2.6 Digital Display Interface (DDI)................................................................................31

2.7 Intel

Flexible Display Interface (Intel

FDI)............................................................ 37

2.8 Platform Environmental Control Interface (PECI)....................................................... 37

2.8.1 PECI Bus Architecture................................................................................37

3.0 Technologies............................................................................................................... 39

3.1 Intel

Virtualization Technology (Intel

VT)............................................................. 39

3.2 Intel

Trusted Execution Technology (Intel

TXT)..................................................... 43

3.3 Intel

Hyper-Threading Technology (Intel

HT Technology)....................................... 44

3.4 Intel

Turbo Boost Technology 2.0..........................................................................45

3.5 Intel

Advanced Vector Extensions 2.0 (Intel

AVX2)................................................45

3.6 Intel

Advanced Encryption Standard New Instructions (Intel

AES-NI).......................46

3.7 Intel

Transactional Synchronization Extensions - New Instructions (Intel

TSX-NI)..... 46

3.8 Intel

64 Architecture x2APIC................................................................................ 47

3.9 Power Aware Interrupt Routing (PAIR).................................................................... 48

3.10 Execute Disable Bit..............................................................................................48

3.11 Supervisor Mode Execution Protection (SMEP)........................................................48

4.0 Power Management.................................................................................................... 49

4.1 Advanced Configuration and Power Interface (ACPI) States Supported......................... 50

4.2 Processor Core Power Management......................................................................... 51

4.2.1 Enhanced Intel

SpeedStep

Technology Key Features..................................51

4.2.2 Low-Power Idle States............................................................................... 52

Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and Desktop Intel

Celeron

Processor Family

March 2015

Datasheet – Volume 1 of 2

Order No.: 328897-010

Processor—Contents

4.3

4.4

4.5

4.6

4.2.3 Requesting Low-Power Idle States...............................................................53

4.2.4 Core C-State Rules....................................................................................54

4.2.5 Package C-States......................................................................................55

4.2.6 Package C-States and Display Resolutions.................................................... 59

Integrated Memory Controller (IMC) Power Management............................................60

4.3.1 Disabling Unused System Memory Outputs................................................... 60

4.3.2 DRAM Power Management and Initialization..................................................61

4.3.3 DRAM Running Average Power Limitation (RAPL) .........................................63

4.3.4 DDR Electrical Power Gating (EPG).............................................................. 63

PCI Express* Power Management............................................................................63

Direct Media Interface (DMI) Power Management...................................................... 63

Graphics Power Management..................................................................................64

4.6.1 Intel

Rapid Memory Power Management (Intel

RMPM)................................64

4.6.2 Graphics Render C-State............................................................................64

4.6.3 Intel

Graphics Dynamic Frequency............................................................ 64

5.0 Thermal Management................................................................................................. 65

5.1 Desktop Processor Thermal Profiles......................................................................... 67

5.1.1 Processor (PCG 2013D and PCG 2014) Thermal Profile................................... 68

5.1.2 Processor (PCG 2013C) Thermal Profile........................................................69

5.1.3 Processor (PCG 2013B) Thermal Profile........................................................ 70

5.1.4 Processor (PCG 2013A) Thermal Profile........................................................ 72

5.2 Thermal Metrology................................................................................................ 73

5.3 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1.............................. 73

5.4 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0.............................. 75

5.5 Thermal Specifications...........................................................................................76

5.6 Processor Temperature..........................................................................................78

5.7 Adaptive Thermal Monitor...................................................................................... 78

5.8 THERMTRIP# Signal.............................................................................................. 81

5.9 Digital Thermal Sensor.......................................................................................... 81

5.9.1 Digital Thermal Sensor Accuracy (Taccuracy)................................................82

5.10 Intel

Turbo Boost Technology Thermal Considerations............................................82

5.10.1 Intel

Turbo Boost Technology Power Control and Reporting.........................82

5.10.2 Package Power Control.............................................................................83

5.10.3 Turbo Time Parameter............................................................................. 84

6.0 Signal Description....................................................................................................... 86

6.1 System Memory Interface Signals........................................................................... 86

6.2 Memory Reference Compensation Signals.................................................................88

6.3 Reset and Miscellaneous Signals............................................................................. 89

6.4 PCI Express* Interface Signals............................................................................... 90

6.5 Display Interface Signals....................................................................................... 90

6.6 Direct Media Interface (DMI).................................................................................. 90

6.7 Phase Locked Loop (PLL) Signals.............................................................................91

6.8 Testability Signals.................................................................................................91

6.9 Error and Thermal Protection Signals....................................................................... 92

6.10 Power Sequencing Signals.................................................................................... 92

6.11 Processor Power Signals.......................................................................................93

6.12 Sense Signals..................................................................................................... 93

6.13 Ground and Non-Critical to Function (NCTF) Signals.................................................93

6.14 Processor Internal Pull-Up / Pull-Down Terminations................................................ 93

Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and Desktop Intel

Celeron

Processor Family

Datasheet – Volume 1 of 2

March 2015

Order No.: 328897-010

Contents—Processor

7.0 Electrical Specifications.............................................................................................. 94

7.1

7.2

7.3

7.4

7.5

7.6

7.7

7.8

Integrated Voltage Regulator..................................................................................94

Power and Ground Lands ...................................................................................... 94

Voltage Identification (VID).............................................................................. 94

Reserved or Unused Signals................................................................................... 99

Signal Groups.......................................................................................................99

Test Access Port (TAP) Connection........................................................................ 101

DC Specifications............................................................................................... 101

Voltage and Current Specifications........................................................................ 102

7.8.1 Platform Environment Control Interface (PECI) DC Characteristics................. 107

7.8.2 Input Device Hysteresis........................................................................... 108

Processor Component Keep-Out Zone.................................................................... 109

Package Loading Specifications............................................................................. 109

Package Handling Guidelines................................................................................ 110

Package Insertion Specifications............................................................................110

Processor Mass Specification.................................................................................110

Processor Materials............................................................................................. 110

Processor Markings............................................................................................. 111

Processor Land Coordinates.................................................................................. 111

Processor Storage Specifications........................................................................... 113

8.0 Package Mechanical Specifications........................................................................... 109

8.1

8.2

8.3

8.4

8.5

8.6

8.7

8.8

8.9

9.0 Processor Ball and Signal Information...................................................................... 115

Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and Desktop Intel

Celeron

Processor Family

March 2015

Datasheet – Volume 1 of 2

Order No.: 328897-010

CM8064601618705S R1T6

CM8064601618705S R1T6概述

CM8064601618705S R1T6规格参数

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