Latches 16-bit Transparent Latch
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | TSSOP |
| 包装说明 | GREEN, TSSOP-48 |
| 针数 | 48 |
| 制造商包装代码 | PAG48 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Date Of Intro | 1992-01-01 |
| Samacsys Description | TSSOP 6.1 MM 0.5MM PITCH |
| 其他特性 | POWER OFF DISABLE O/PS; IOH MAX DURATION < 1S; MAX OUTPUT SKEW = 0.5NS |
| 系列 | FCT |
| JESD-30 代码 | R-PDSO-G48 |
| JESD-609代码 | e3 |
| 长度 | 12.5 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.064 A |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 48 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP48,.3,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 4.2 ns |
| 传播延迟（tpd） | 3.7 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 6.1 mm |
| 74FCT16373CTPAG8 | 74FCT16373CTPVG | 74FCT16373CTPAG | 74FCT16373ATPAG8 | 74FCT16373ATPVG | |
|---|---|---|---|---|---|
| 描述 | Latches 16-bit Transparent Latch | Latches 16-bit Transparent Latch | Latches 16-bit Transparent Latch | Latches 16-bit Transparent Latch | Latches 16-bit Transparent Latch |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | TSSOP | SSOP | TSSOP | TSSOP | SSOP |
| 包装说明 | GREEN, TSSOP-48 | GREEN, SSOP-48 | GREEN, TSSOP-48 | GREEN, TSSOP-48 | SSOP, SSOP48,.4 |
| 针数 | 48 | 48 | 48 | 48 | 48 |
| 制造商包装代码 | PAG48 | PVG48 | PAG48 | PAG48 | PVG48 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 系列 | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 12.5 mm | 15.875 mm | 12.5 mm | 12.5 mm | 15.875 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SSOP | TSSOP | TSSOP | SSOP |
| 封装等效代码 | TSSOP48,.3,20 | SSOP48,.4 | TSSOP48,.3,20 | TSSOP48,.3,20 | SSOP48,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 4.2 ns | 4.2 ns | 4.2 ns | 5.2 ns | 5.2 ns |
| 传播延迟（tpd） | 3.7 ns | 3.7 ns | 3.7 ns | 8.5 ns | 8.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 2.794 mm | 1.1 mm | 1.1 mm | 2.794 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.635 mm | 0.5 mm | 0.5 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 6.1 mm | 7.493 mm | 6.1 mm | 6.1 mm | 7.493 mm |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - |
| Samacsys Description | TSSOP 6.1 MM 0.5MM PITCH | SSOP 300 MIL | TSSOP 6.1 MM 0.5MM PITCH | TSSOP 6.1 MM 0.5MM PITCH | - |
| 其他特性 | POWER OFF DISABLE O/PS; IOH MAX DURATION < 1S; MAX OUTPUT SKEW = 0.5NS | POWER OFF DISABLE O/PS; IOH MAX DURATION < 1S; MAX OUTPUT SKEW = 0.5NS | POWER OFF DISABLE O/PS; IOH MAX DURATION < 1S; MAX OUTPUT SKEW = 0.5NS | - | POWER OFF DISABLE O/PS; IOH MAX DURATION < 1S; MAX OUTPUT SKEW = 0.5NS |
嵌入式系统
RF/无线
电源技术
Microchip MCU
嵌入式系统
RF/无线
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