Operating Temperature Range ........................ -40NC to +105NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
PACKAGE THERMAL CHARACTERISTICS (Note 1)
64 TQFP
Junction-to-Ambient Thermal Resistance (B
JA
) .......31.9NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................1NC/W
56 TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ..........21NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................1NC/W
56 QFND
Junction-to-Ambient Thermal Resistance (B
JA
) .......23.4NC/W
Junction-to-Case Thermal Resistance (B
JC
) ..............1.6NC/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-lay-
er board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
MAX9259 DC ELECTRICAL CHARACTERISTICS
(V
DVDD
= V
AVDD
= 1.7V to 1.9V, V
IOVDD
= 1.7V to 3.6V, R
L
= 100I
Q1%
(differential), T
A
= -40NC to +105NC, unless otherwise noted.
Typical values are at V
DVDD
= V
AVDD
= V
IOVDD
= 1.8V, T
A
= +25NC.)
PARAMETER
SYMBOL
CONDITIONS
MIN
0.65 x
V
IOVDD
0.35 x
V
IOVDD
V
IN
= 0 to V
IOVDD
I
CL
= -18mA
V
IOVDD
- 0.2
0.2
V
IOVDD
= 3.0V to 3.6V
V
IOVDD
= 1.7V to 1.9V
16
3
35
12
64
21
-10
+10
-1.5
TYP
MAX
UNITS
SINGLE-ENDED INPUTS (DIN_, PCLKIN,
PWDN,
SSEN, BWS, ES, DRS, MS, CDS,
AUTOS,
SD, SCK, WS)
High-Level Input Voltage
Low-Level Input Voltage
Input Current
Input Clamp Voltage
SINGLE-ENDED OUTPUT (INT)
High-Level Output Voltage
Low-Level Output Voltage
Output Short-Circuit Current
V
OH1
V
OL1
I
OS
I
OH
= -2mA
I
OL
= 2mA
V
O
= 0V
V
V
mA
V
IH1
V
IL1
I
IN1
V
CL
V
V
FA
V
2
Maxim Integrated
MAX9259/MAX9260
Gigabit Multimedia Serial Link with Spread
Spectrum and Full-Duplex Control Channel
MAX9259 DC ELECTRICAL CHARACTERISTICS (continued)
(V
DVDD
= V
AVDD
= 1.7V to 1.9V, V
IOVDD
= 1.7V to 3.6V, R
L
= 100I
Q1%
(differential), T
A
= -40NC to +105NC, unless otherwise noted.
Typical values are at V
DVDD
= V
AVDD
= V
IOVDD
= 1.8V, T
A
= +25NC.)
PARAMETER
SYMBOL
CONDITIONS
MIN
0.7 x
V
IOVDD
0.3 x
V
IOVDD
V
IN
= 0 to V
IOVDD
(Note 2)
I
OL
= 3mA
V
IOVDD
= 1.7V to 1.9V
V
IOVDD
= 3.0V to 3.6V
300
350
240
400
-110
+5
0.4
0.3
500
610
425
15
Preemphasis off
1.1
1.4
1.56
15
V
OUT+
or V
OUT-
= 0V
V
OUT+
or V
OUT-
= 1.9V
-60
25
25
45
54
63
27
-27
Figure 3
Figure 3
Figure 3
Figure 3
Figure 3
f
PCLKIN
= 16.6MHz
Worst-Case Supply Current
(Figure 4)
Sleep-Mode Supply Current
Power-Down Supply Current
Maxim Integrated
TYP
MAX
UNITS
I
2
C AND UART I/O, OPEN-DRAIN OUTPUTS (RX/SDA, TX/SCL,
FPGA/CPLD
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