Analog Switch ICs 250mOhm 5.5V CMOS SPST
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-05-01 14:56:38.447 |
| Brand Name | Analog Devices Inc |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | LSSOP, TSOP6,.11,37 |
| 针数 | 6 |
| 制造商包装代码 | RJ-6 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Samacsys Description | Analog Devices ADG801BRTZ-500RL7, Analogue SPST Switch Single SPST, 5 V, 6-Pin SOT-23 |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDSO-G6 |
| JESD-609代码 | e3 |
| 长度 | 2.9 mm |
| 湿度敏感等级 | 1 |
| 正常位置 | NO |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 6 |
| 标称断态隔离度 | 61 dB |
| 最大通态电阻 (Ron) | 0.6 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装等效代码 | TSOP6,.11,37 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.45 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 最长断开时间 | 15 ns |
| 最长接通时间 | 55 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 1.6 mm |
| ADG801BRTZ-500RL7 | ADG801BRT-500RL7 | ADG801BRMZ | ADG801BRT-REEL7 | ADG802BRMZ-REEL7 | ADG801BRTZ-REEL | ADG802BRMZ | ADG802BRTZ-REEL7 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Analog Switch ICs 250mOhm 5.5V CMOS SPST | Analog Switch ICs 250mOhm 5.5V CMOS SPST | Analog Switch ICs 250mOhm 5.5V CMOS SPST | Analog Switch ICs 250mOhm 5.5V CMOS SPST | Analog Switch ICs 250mOhm 5.5V CMOS SPST | Analog Switch ICs 250mOhm 5.5V CMOS SPST | Analog Switch ICs 250mOhm 5.5V CMOS SPST | Analog Switch ICs 250mOhm 5.5V CMOS SPST |
| Brand Name | Analog Devices Inc | - | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | - | 符合 | 不符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | - | TSSOP | SOIC | TSSOP | SOIC | TSSOP | SOIC |
| 包装说明 | LSSOP, TSOP6,.11,37 | - | TSSOP, TSSOP8,.19 | MO-178AB, SOT-23, 6 PIN | TSSOP, TSSOP8,.19 | LSSOP, TSOP6,.11,37 | TSSOP, TSSOP8,.19 | LSSOP, TSOP6,.11,37 |
| 针数 | 6 | - | 8 | 6 | 8 | 6 | 8 | 6 |
| 制造商包装代码 | RJ-6 | - | RM-8 | RJ-6 | RM-8 | RJ-6 | RM-8 | RJ-6 |
| Reach Compliance Code | compliant | - | compliant | not_compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | SPST | - | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-PDSO-G6 | - | S-PDSO-G8 | R-PDSO-G6 | S-PDSO-G8 | R-PDSO-G6 | S-PDSO-G8 | R-PDSO-G6 |
| JESD-609代码 | e3 | - | e3 | e0 | e3 | e3 | e3 | e3 |
| 长度 | 2.9 mm | - | 3 mm | 2.9 mm | 3 mm | 2.9 mm | 3 mm | 2.9 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 正常位置 | NO | - | NO | NO | NC | NO | NC | NC |
| 信道数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 6 | - | 8 | 6 | 8 | 6 | 8 | 6 |
| 标称断态隔离度 | 61 dB | - | 61 dB | 61 dB | 61 dB | 61 dB | 61 dB | 61 dB |
| 最大通态电阻 (Ron) | 0.6 Ω | - | 0.6 Ω | 0.6 Ω | 0.6 Ω | 0.6 Ω | 0.6 Ω | 0.6 Ω |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | - | TSSOP | LSSOP | TSSOP | LSSOP | TSSOP | LSSOP |
| 封装等效代码 | TSOP6,.11,37 | - | TSSOP8,.19 | TSOP6,.11,37 | TSSOP8,.19 | TSOP6,.11,37 | TSSOP8,.19 | TSOP6,.11,37 |
| 封装形状 | RECTANGULAR | - | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 240 | 260 | 260 | 260 | 260 |
| 电源 | 3/5 V | - | 3/5 V | 2/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.45 mm | - | 1.1 mm | 1.45 mm | 1.1 mm | 1.45 mm | 1.1 mm | 1.45 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES | YES |
| 最长断开时间 | 15 ns | - | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns |
| 最长接通时间 | 55 ns | - | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns |
| 切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) | - | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.95 mm | - | 0.65 mm | 0.95 mm | 0.65 mm | 0.95 mm | 0.65 mm | 0.95 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | - | 40 | 30 | 30 | 40 | 30 | 30 |
| 宽度 | 1.6 mm | - | 3 mm | 1.6 mm | 3 mm | 1.6 mm | 3 mm | 1.6 mm |
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