EEPROM 64K-Bit CMOS PARA EEPROM
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 零件包装代码 | SOIC |
| 包装说明 | 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, MS-013, SOIC-28 |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 250 ns |
| 命令用户界面 | NO |
| 数据轮询 | YES |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e3 |
| 长度 | 17.905 mm |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP28,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 页面大小 | 32 words |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 3.3 V |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.008 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 切换位 | YES |
| 宽度 | 7.47 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| Base Number Matches | 1 |
| CAT28LV64WI-25T | CAT28LV64G-20T | CAT28LV64G-25T | CAT5114YI-00-T3 | CAT28LV64J-25 | CAT28LV64GI-25T | CAT28LV64WI25 | |
|---|---|---|---|---|---|---|---|
| 描述 | EEPROM 64K-Bit CMOS PARA EEPROM | EEPROM 64K-Bit CMOS PARA EEPROM | EEPROM 64K-Bit CMOS PARA EEPROM | Digital Potentiometer ICs DPP,NV 32 taps Up/Down | EEPROM (8kx8) 64K 3V | EEPROM 64K-Bit CMOS PARA EEPROM | EEPROM (8kx8) 64k 3V 250ns |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 不符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | QFJ | QFJ | - | SOIC | LCC | SOIC |
| 包装说明 | 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, MS-013, SOIC-28 | LEAD AND HALOGEN FREE, PLASTIC, LCC-32 | LEAD AND HALOGEN FREE, PLASTIC, LCC-32 | - | SOP, SOP28,.4 | HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, MS-016, LCC-32 | SOP, SOP28,.4 |
| 针数 | 28 | 32 | 32 | - | 28 | 32 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | - | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | - | EAR99 | EAR99 |
| 最长访问时间 | 250 ns | 200 ns | 250 ns | - | 250 ns | 250 ns | 250 ns |
| 命令用户界面 | NO | NO | NO | - | NO | NO | NO |
| 数据轮询 | YES | YES | YES | - | YES | YES | YES |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G28 | R-PQCC-J32 | R-PQCC-J32 | - | R-PDSO-G28 | R-PQCC-J32 | R-PDSO-G28 |
| JESD-609代码 | e3 | e3 | e3 | - | - | e3 | e3 |
| 长度 | 17.905 mm | 13.97 mm | 13.97 mm | - | 17.9 mm | 13.97 mm | 17.9 mm |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | - | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | - | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | - | 8 | 8 | 8 |
| 湿度敏感等级 | 1 | 3 | - | - | 1 | - | 1 |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 28 | 32 | 32 | - | 28 | 32 | 28 |
| 字数 | 8192 words | 8192 words | 8192 words | - | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | - | 8000 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | - | 70 °C | 85 °C | 85 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | - | 8KX8 | 8KX8 | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | QCCJ | QCCJ | - | SOP | QCCJ | SOP |
| 封装等效代码 | SOP28,.4 | LDCC32,.5X.6 | LDCC32,.5X.6 | - | SOP28,.4 | LDCC32,.5X.6 | SOP28,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | CHIP CARRIER | CHIP CARRIER | - | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE |
| 页面大小 | 32 words | 32 words | 32 words | - | 32 words | 32 words | 32 words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | 245 | - | 225 | 245 | - |
| 电源 | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| 编程电压 | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 3.55 mm | 3.55 mm | - | 2.65 mm | 3.55 mm | 2.65 mm |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | - | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.008 mA | 0.008 mA | 0.008 mA | - | 0.008 mA | 0.008 mA | 0.008 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | - | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | - | - | Tin (Sn) | Tin (Sn) |
| 端子形式 | GULL WING | J BEND | J BEND | - | GULL WING | J BEND | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | QUAD | - | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 40 | - | NOT SPECIFIED | 40 | - |
| 切换位 | YES | YES | YES | - | YES | YES | YES |
| 宽度 | 7.47 mm | 11.43 mm | 11.43 mm | - | 7.5 mm | 11.43 mm | 7.5 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | - | 5 ms | 5 ms | 5 ms |
| Base Number Matches | 1 | 1 | 1 | - | - | 1 | 1 |
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