Buffers & Line Drivers 1.65-5.5V Single Non-Inverting TTL
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 包装说明 | LEAD FREE, SC-70, SC-88A, SOT-353, 5 PIN |
| Reach Compliance Code | compliant |
| Factory Lead Time | 1 week |
| 系列 | AHC/VHC/H/U/V |
| JESD-30 代码 | R-PDSO-G5 |
| JESD-609代码 | e3 |
| 长度 | 2 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUFFER |
| 最大I（ol） | 0.008 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 输入次数 | 1 |
| 端子数量 | 5 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP5/6,.08 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 电源 | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 9.5 ns |
| 传播延迟（tpd） | 25.5 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 1.25 mm |
| MC74VHC1GT50DF1G | MC74VHC1GT50DFT1 | MC74VHC1GT50DF2G | MC74VHC1GT50DTT1 | MC74VHC1GT50DT1G | NL17VHC1GT50DFT1 | |
|---|---|---|---|---|---|---|
| 描述 | Buffers & Line Drivers 1.65-5.5V Single Non-Inverting TTL | Buffers & Line Drivers 1.65-5.5V Single | Buffers & Line Drivers 1.65-5.5V Single Non-Inverting TTL | Buffers & Line Drivers 1.65-5.5V Single | Buffers & Line Drivers 1.65-5.5V Single Non-Inverting TTL | Buffers & Line Drivers 1.65-5.5V Single |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 符合 | - |
| 厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | - |
| 包装说明 | LEAD FREE, SC-70, SC-88A, SOT-353, 5 PIN | SC-70, SC-88A, SOT-353, 5 PIN | LEAD FREE, SC-70, SC-88A, SOT-353, 5 PIN | SC-59, SOT-23, TSOP-5 | LEAD FREE, SC-59, SOT-23, TSOP-5 | - |
| Reach Compliance Code | compliant | not_compliant | compliant | not_compliant | unknown | - |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week | 1 week | - |
| 系列 | AHC/VHC/H/U/V | AHC/VHC | AHC/VHC/H/U/V | AHC/VHC | AHC/VHC/H/U/V | - |
| JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | - |
| JESD-609代码 | e3 | e0 | e3 | e0 | e3 | - |
| 长度 | 2 mm | 2 mm | 2 mm | 3 mm | 3 mm | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - |
| 逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | - |
| 最大I（ol） | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - |
| 输入次数 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 5 | 5 | 5 | 5 | 5 | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | - |
| 封装等效代码 | TSSOP5/6,.08 | TSSOP5/6,.08 | TSSOP5/6,.08 | TSOP5/6,.11,37 | TSSOP6,.08 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | - |
| 电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | - |
| Prop。Delay @ Nom-Sup | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | - |
| 传播延迟（tpd） | 25.5 ns | 25.5 ns | 25.5 ns | 25.5 ns | 25.5 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 施密特触发器 | NO | NO | NO | NO | NO | - |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | - |
| 标称供电电压 (Vsup) | 5 V | 1.8 V | 5 V | 1.8 V | 5 V | - |
| 表面贴装 | YES | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - |
| 端子面层 | Tin (Sn) | Tin/Lead (Sn/Pb) | Tin (Sn) | Tin/Lead (Sn/Pb) | Tin (Sn) | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.95 mm | 0.95 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| 宽度 | 1.25 mm | 1.25 mm | 1.25 mm | 1.5 mm | 2 mm | - |
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