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70V18L15PF

产品描述SRAM 64Kx9 LOW-PWR 3.3V DUAL-PORT RAM
产品类别存储    存储   
文件大小157KB,共19页
制造商IDT (Integrated Device Technology)
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70V18L15PF概述

SRAM 64Kx9 LOW-PWR 3.3V DUAL-PORT RAM

70V18L15PF规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
零件包装代码TQFP
包装说明14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
针数100
制造商包装代码PN100
Reach Compliance Codenot_compliant
ECCN代码3A991.B.2.B
最长访问时间15 ns
I/O 类型COMMON
JESD-30 代码S-PQFP-G100
JESD-609代码e0
长度14 mm
内存密度589824 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度9
湿度敏感等级3
功能数量1
端口数量2
端子数量100
字数65536 words
字数代码64000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织64KX9
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装等效代码QFP100,.63SQ,20
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)240
电源3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.003 A
最小待机电流3 V
最大压摆率0.235 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度14 mm
Base Number Matches1

文档预览

下载PDF文档
HIGH-SPEED 3.3V
64K x 9 DUAL-PORT
STATIC RAM
IDT70V18L
LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018
Features
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
High-speed access
– Commercial: 15/20ns (max.)
– Industrial: 20ns (max.)
Low-power operation
– IDT70V18L
Active: 440mW (typ.)
Standby: 660µW (typ.)
Dual chip enables allow for depth expansion without
external logic
Busy and Interrupt Flags
On-chip port arbitration logic
IDT70V18 easily expands data bus width to 18 bits or
more using the Master/Slave select when cascading more
than one device
M/S = V
IH
for
BUSY
output flag on Master,
M/S = V
IL
for
BUSY
input on Slave
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
LVTTL-compatible, single 3.3V (±0.3V) power supply
Available in a 100-pin TQFP
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
Functional Block Diagram
R/W
L
CE
0L
CE
1L
OE
L
R/W
R
CE
0R
CE
1R
OE
R
I/O
0-8L
I/O
Control
(1,2)
I/O
Control
I/O
0-8R
(1,2)
BUSY
L
A
15L
A
0L
BUSY
R
64Kx9
MEMORY
ARRAY
70V18
16
16
Address
Decoder
Address
Decoder
A
15R
A
0R
CE
0L
CE
1L
OE
L
R/W
L
SEM
L
(2)
INT
L
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE
0R
CE
1R
OE
R
R/W
R
SEM
R
(2)
INT
R
4854 drw 01
(1)
M/S
NOTES:
1.
BUSY
is an input as a Slave (M/S=V
IL
) and an output when it is a Master (M/S=V
IH
).
2.
BUSY
and
INT
are non-tri-state totem-pole outputs (push-pull).
DECEMBER 2017
DSC-4854/7
©2017 Integrated Device Technology, Inc.

70V18L15PF相似产品对比

70V18L15PF 70V18L20PF 70V18L20PFI8 70V18L15PF8
描述 SRAM 64Kx9 LOW-PWR 3.3V DUAL-PORT RAM SRAM 64Kx9 LOW-PWR 3.3V DUAL-PORT RAM SRAM 64Kx9 LOW-PWR 3.3V DUAL-PORT RAM SRAM 64Kx9 LOW-PWR 3.3V DUAL-PORT RAM
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合
零件包装代码 TQFP TQFP TQFP TQFP
包装说明 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 TQFP-100 TQFP-100
针数 100 100 100 100
制造商包装代码 PN100 PN100 PN100 PN100
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant
ECCN代码 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
最长访问时间 15 ns 20 ns 20 ns 15 ns
I/O 类型 COMMON COMMON COMMON COMMON
JESD-30 代码 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100
JESD-609代码 e0 e0 e0 e0
长度 14 mm 14 mm 14 mm 14 mm
内存密度 589824 bit 589824 bit 589824 bit 589824 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 9 9 9 9
湿度敏感等级 3 3 3 3
功能数量 1 1 1 1
端口数量 2 2 2 2
端子数量 100 100 100 100
字数 65536 words 65536 words 65536 words 65536 words
字数代码 64000 64000 64000 64000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 85 °C 70 °C
组织 64KX9 64KX9 64KX9 64KX9
输出特性 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP LFQFP
封装等效代码 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 240 240 240 240
电源 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大待机电流 0.003 A 0.003 A 0.003 A 0.003 A
最小待机电流 3 V 3 V 3 V 3 V
最大压摆率 0.235 mA 0.205 mA 0.22 mA 0.235 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 20 20 20 20
宽度 14 mm 14 mm 14 mm 14 mm
Base Number Matches 1 - 1 1
厂商名称 - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)

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