电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-B0202AG-01-56R2-J

产品描述Resistor Networks & Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics
下载文档 详细参数 全文预览

WBC-B0202AG-01-56R2-J在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-B0202AG-01-56R2-J - - 点击查看 点击购买

WBC-B0202AG-01-56R2-J概述

Resistor Networks & Arrays

WBC-B0202AG-01-56R2-J规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
Resistor Networks & Arrays

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
二极管测量CPU温度的原理
一般来说,时钟频率跑的越快,则CPU每秒所能完成的运算次数就越多,性能自然更好,但是,随着时钟频率的增加,CPU就会变得越来越热,这是CPU内部CMOS管耗散功率加大的体现,过高的温度会影 ......
fish001 模拟与混合信号
求助!上电后,芯片发烫是怎么回事?
我用5402开发了一个系统,上电后,DSP能正常复位,但外扩的FLASH和电源转换芯片TPS767D318却发烫,片子已测过没短路.不知问题出在哪,请各位大虾指点!不胜感激!...
monica150373637 模拟与混合信号
请问实现一个gprs终端和pc间的通信,怎么做
请问实现一个gprs终端和pc间的通信,具体应该怎么做 我知道如果在pc上接一个gprs模块终端可以实现,如果pc可以上网是不是就可以直接通信了呢? 请大家帮忙,先谢谢大家le。 如果不通过gprs模 ......
yushulei 嵌入式系统
ARM最新资料[c语言嵌入式语法]
c语言嵌入式语法...
呱呱 单片机
请问28335的EPWM计数器什么时候开始计数啊?
请问28335的EPWM计数器什么时候开始计数啊? 假如我现在初始化了Epwm,计数器TBCTR的值清零,比较寄存器CMPA,CMPB的值清0,周期寄存器TBPRD的值清0。 这个时候会有PWM波吗? 还是必须 ......
ShungChess 微控制器 MCU
Kinetis-K40FreeRTOS_V7.1.0移植学习记录
2012-3-6参照FreeRTOS_V7.1.0中的K601.复制CORTEX_Kinetis_K60_Tower_IAR并改名为CORTEX_Kinetis_K40X256_IAR;打开工程,编译提示找不到很多头文件工程选项中添加头文件路径C/C++compile/Prepr ......
bluehacker NXP MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1903  2669  2543  721  2598  3  9  50  25  47 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved