RFM products are now
Murata products.
SF2017E
• Low Loss L-Band SAW Filter
• 200 ohm Balanced Input and Output Ports
• Complies with Directive 2002/95/EC (RoHS)
Pb
Maximum Rating
Rating
Input Power Level
DC Voltage on any Non-ground Terminal
Operating Temperature Range
Storage Temperature Range in Tape and Reel
Suitable for Lead-free Soldering - Maximum Soldering Profile
Value
0
3
-40 to +85
-40 to +85
Units
dBm
V
°C
°C
1220 MHz
SAW Filter
260 °C for 30 s
SM3030-8
Electrical Characteristics
Characteristic
Center Frequency
Insertion Loss, 1216 to 1224 MHz
Amplitude Ripple, 1216 to 1224 MHz
Attenuation, Referenced to 0 dB
500 to 1129 MHz
1129 to 1135 MHz
1144 to 1152 MHz
1132 MHz
1148 MHz
1176 MHz
1184 MHz
1290 to 2000 MHz
Group Delay Ripple, 1216 to 1224 MHz
Balanced Source Impedance
Balanced Load Impedance
Case Style
Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 indicator
Standard Reel Quantity
Reel Size 7 Inch
Reel Size 13 Inch
50
50
46
50
48
50
46
50
57
57
57
57
57
56
55
55
12
200
200
SM3030-8 3.0 x 3.0 mm Nominal Footprint
898, YWWS
500 Pieces/Reel
3000 Pieces/Reel
ns
P-P
ohms
ohms
dB
Sym
f
C
IL
Notes
Min
Typ
1220
3.4
0.6
5.3
1.8
Max
Units
MHz
dB
dB
P-P
Port 1
Port 2
Dot Indicates Pin 1
Connection
Balanced Input
Balanced Output
Ground
Terminals
1,2
5,6
All Others
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
NOTES:
1.
2.
US and international patents may apply.
Murata, stylized Murata logo, and Murata N.A., Inc. are registered trademarks of Murata Manufacturing Co., Ltd.
©2010-2014
© Murata
Electronics N.A., Inc.
Ltd. All Rights Reserved 2010
Copyright
by Murata
Manufacturing Co.,
SF2017E (R) 3/26/14
Page 1 of 5
www.murata.com
8-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
Dimension
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
mm
Nom
3.0
3.0
1.27
0.92
0.75
0.60
0.60
1.20
3.19
0.81
0.96
0.81
1.39
0.23
0.38
Inches
Nom
0.118
0.118
0.050
0.036
0.029
0.024
0.024
0.047
0.126
0.032
0.038
0.032
0.055
0.009
0.015
Min
2.87
2.87
1.14
0.79
0.62
0.47
0.47
1.07
Max
3.13
3.13
1.40
1.05
0.88
0.73
0.73
1.33
Min
0.113
0.113
0.045
0.031
0.024
0.018
0.018
0.042
Max
0.123
0.123
0.055
0.041
0.034
0.029
0.029
0.052
J
K
J
I
J
N
L
N
M
I
Case Materials
Materials
Solder Pad
Plating
K
O
O
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
2.0 to 3.0 µm Nickel
Al
2
O
3
Ceramic
Pb Free
Lid Plating
Body
PCB Footprint Top View
TOP VIEW
B
8
1
7
H
6
6
C
7
E
BOTTOM VIEW
8
1
898
YWWS
A
2
2
G
3
5
5
4
D
F
3
4
©2010-2014 by Murata
Manufacturing Co.,
Copyright © Murata
Electronics N.A., Inc.
Ltd. All Rights Reserved 2010
SF2017E (R) 3/26/14
Page 4 of 5
www.murata.com
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