电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-T0303AS-03-5113-J

产品描述Resistor Networks & Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics
下载文档 详细参数 全文预览

WBC-T0303AS-03-5113-J在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-T0303AS-03-5113-J - - 点击查看 点击购买

WBC-T0303AS-03-5113-J概述

Resistor Networks & Arrays

WBC-T0303AS-03-5113-J规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
Resistor Networks & Arrays

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
【颁奖礼】你评论,我送礼《玩转TI MSP430 Launchpad》获奖名单公布!
活动详情:https://bbs.eeworld.com.cn/TI/201303_MSP430_Launchpad/index.html 感谢大家的热情支持与参与,大家都在很认真的阅读《玩转TI MSP430 Launchpad》电子书,仔细的对电子书做出了 ......
EEWORLD社区 微控制器 MCU
太阳能电源改变生活,方便千万家
  你不是是还在为手机出门在外,因没在电而烦恼吗? 你还在为身在野外因没电源,而愁眉不展呢?如你随身携带的笔记本、数码相机、摄象机、便携式DVD、MP4、GPS、保暖设备等;我们身边有太 ......
badamu 电源技术
PCB设计规范
一.PCB 设计的布局规范 (一) 布局设计原则 1. 距板边距离应大于 5mm。 2. 先放置与结构关系密切的元件,如接插件、开关、电源插座等。 3. 优先摆放电路功能块的核心元件及体 ......
qin552011373 ADI 工业技术
【EEWORLD带你DIY】示波器V2.0 HSMC转接板打样归来!
HSMC转接板打样归来 上图 打样是在“从头再来”那里打的 他的QQ:429238978 在这里也谢谢他。 现在还有部分器件购买中,小批量啊 哎~~ 50671 50672...
莫恩 DIY/开源硬件专区
U盘维修方法
U盘的常见故障主要有: 1、电脑不能识别,也就是U盘插到机器上没有任何反应, 2、电脑将U盘识别为“无法识别的设备”, 3、U盘容量为0,电脑提示格式化却不能格式化,或提示“请插入磁盘”, ......
ddllxxrr 嵌入式系统
十一月打卡
2017余额不多了,大家能跑动的赶紧跑起来吧! 双十一,没几天了,有能来帮忙的吗,购物车就三件,错过机会再等一年!:victory: 328744 static/image/hrline/4.gif 神魂分离的跑,:surrender ......
mzb2012 聊聊、笑笑、闹闹

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2227  1670  1772  1697  1726  1  51  30  34  9 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved