电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-T0303AS-01-2002-J

产品描述Resistor Networks & Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics
下载文档 详细参数 全文预览

WBC-T0303AS-01-2002-J在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-T0303AS-01-2002-J - - 点击查看 点击购买

WBC-T0303AS-01-2002-J概述

Resistor Networks & Arrays

WBC-T0303AS-01-2002-J规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
Resistor Networks & Arrays

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
嵌入式 初学者问题!!
我学过c,java, 理解还可以!我想学嵌入式!曾经学过单片机,但基础很差!有人告诉我 先从单片机学起! 我需要 买板子吗?是不是 需要两块板子!一个先学单片机,一个学arm! 有没有 一块板 ......
twobyte 嵌入式系统
(转)semihost/ITM机制浅析以及使用JLINK通过ITM调试stm32单片机
本帖最后由 白丁 于 2015-11-1 22:54 编辑 ----------------------------------------------------------------------------------------------- 作者:prife 感谢:hexlog@gmail.com --- ......
白丁 ARM技术
Qorvo 眼里的 WiFi 6 应对之策
作为射频领域的领先厂商,早在 2 年多前当 Wi-Fi 6 还处于早期标准制定阶段,Qorvo 已经与坊间主流的 Wi-Fi 主芯片厂商如高通与博通等进行前期的产品规格制定与技术交流。经过多次的改良与设 ......
Jacktang 无线连接
以拆会友-拆解九阳豆浆机AP-D09
以拆会友前几天在小区垃圾桶边上看到这个,想想还没有拆过豆浆机呢,于是就捡回来拆拆拆! 363257363258 原来比较脏,稍微擦了一下。九阳的豆浆机,型号 AP-D09 363259 分开来是这样的,大 ......
lbbook 以拆会友
【免费下载】2008年全国11城市STM32技术研讨会演讲稿已经上线
请访问ST中文网页:http://www.stmicroelectronics.com.cn/在最左边“产品”栏目点击“微控制器”在“大中华地区相关信息”栏目点击“中国大陆地区”在“STM32微控制器系列”栏目下可以看 ......
flylmind stm32/stm8

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1580  2880  2631  458  1698  35  44  5  41  45 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved