73644-3208: 产品描述High Speed / Modular Connectors HDM BP GP Pol Pn BE GP Pol Pn BE 144Ckt; 产品类别连接器连接器; 文件大小22KB，共2页; 制造商Molex; 官网地址https://www.molex.com/molex/home; 标准

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73644-3208在线购买

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73644-3208概述

High Speed / Modular Connectors HDM BP GP Pol Pn BE GP Pol Pn BE 144Ckt

73644-3208规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
Reach Compliance Code	compliant
ECCN代码	EAR99
Is Samacsys	N
其他特性	POLARIZED,HDM
板上安装选件	COMPLIANT BOARDLOCK
主体宽度	0.618 inch
主体深度	0.461 inch
主体长度	2.189 inch
主体/外壳类型	RECEPTACLE
连接器类型	BOARD CONNECTOR
联系完成配合	NOT SPECIFIED
联系完成终止	TIN OVER NICKEL
触点性别	MALE
触点材料	NOT SPECIFIED
触点模式	RECTANGULAR
触点电阻	10 mΩ
触点样式	SQ PIN-SKT
DIN 符合性	NO
滤波功能	NO
IEC 符合性	NO
最大插入力	.6116 N
绝缘电阻	5000000000 Ω
绝缘体颜色	BLACK
绝缘体材料	GLASS FILLED LIQUID CRYSTAL POLYMER
JESD-609代码	e3
MIL 符合性	NO
制造商序列号	73644
插接触点节距	0.079 inch
匹配触点行间距	0.079 inch
插接信息	MULTIPLE MATING PARTS AVAILABLE
混合触点	NO
安装选项1	GUIDE PIN
安装选项2	LOCKING
安装方式	STRAIGHT
安装类型	BOARD
连接器数	ONE
PCB行数	6
装载的行数	6
最高工作温度	105 °C
最低工作温度	-55 °C
选件	GENERAL PURPOSE
PCB接触模式	RECTANGULAR
PCB触点行间距	2.0066 mm
电镀厚度	30u inch
额定电流（信号）	1 A
参考标准	UL
可靠性	COMMERCIAL
端子长度	0.138 inch
端子节距	2 mm
端接类型	PRESS FIT
触点总数	144
UL 易燃性代码	94V-0
Base Number Matches	1

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This document was generated on 05/15/2018

PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

Part Number:

Status:

Overview:

Description:

0736443208

Active

HDM Backplane Connector System

HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location

B, Polarizing Key Position E, 144 Circuits

Documents:

3D Model

Drawing (PDF)

Agency Certification

CSA

General

Product Family

Series

Application

Comments

Component Type

Overview

Product Name

UPC

Physical

Circuits (Loaded)

Circuits (maximum)

Color - Resin

Durability (mating cycles max)

First Mate / Last Break

Flammability

Guide to Mating Part

Keying to Mating Part

Material - Metal

Material - Plating Mating

Material - Plating Termination

Material - Resin

Net Weight

Number of Columns

Number of Pairs

Number of Rows

Orientation

PC Tail Length

PCB Locator

PCB Retention

PCB Thickness - Recommended

Packaging Type

Pitch - Mating Interface

Pitch - Termination Interface

Plating min - Mating

Plating min - Termination

Polarized to PCB

Stackable

Surface Mount Compatible (SMC)

Temperature Range - Operating

Termination Interface: Style

Packaging Specification PK-70873-0818 (PDF)

RoHS Certificate of Compliance (PDF)

Series image - Reference only

LR19980

E29179

Backplane Connectors

73644

Backplane

Standard Press-Fit, Tin/Lead (SnPb)

PCB Header

HDM Backplane Connector System

HDM

800753003538

144

Black, Natural

250

94V-0

Yes

Phosphor Bronze, Stainless Steel

Gold

Tin

High Temperature Thermoplastic

9.729/g

Open Pin Field

Vertical

3.50mm

Yes

2.50mm

Tube

2.00mm

0.762µm

0.381µm

Yes

-55°C to +105°C

Through Hole - Compliant Pin

EU ELV

Not Relevant

EU RoHS

China RoHS

Compliant

REACH SVHC

Not Contained Per

-ED/01/2018 (15

January 2018)

Halogen-Free

Status

Low-Halogen

Need more information on product

environmental compliance?

Email productcompliance@molex.com

Please visit the Contact Us section for any

non-product compliance questions.

China ROHS

ELV

RoHS Phthalates

Green Image

Not Relevant

Not Contained

Search Parts in this Series

73644 Series

Mates With

73632 HDM+ Board-to-Board Daughtercard

Receptacle. 73780 HDM Board-to-Board

Daughtercard Receptacle

73644-3208

73644-3208在线购买

73644-3208概述

73644-3208规格参数

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