DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BCC8
双 1通道, 单刀单掷开关, BCC8
| 参数名称 | 属性值 |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 最小工作温度 | -40 Cel |
| 最大工作温度 | 85 Cel |
| 额定供电电压 | 2.7 V |
| 最小供电/工作电压 | 1.65 V |
| 最大供电/工作电压 | 5.5 V |
| 加工封装描述 | 1.60 MM, LEAD FREE, MO-255UAAD, MICROPAK-8 |
| each_compli | Yes |
| 欧盟RoHS规范 | Yes |
| 状态 | Active |
| 模拟IC其它类型 | SPST |
| jesd_30_code | S-XBCC-B8 |
| moisture_sensitivity_level | 1 |
| mal_position__v_ | NC |
| 通道数 | 1 |
| 关闭状态下的隔离额定值 | 70 dB |
| 最大通态电阻 | 4 ohm |
| utput__v_ | SEPARATE OUTPUT |
| 包装材料 | UNSPECIFIED |
| ckage_code | VBCC |
| ckage_equivalence_code | LCC8,.06SQ,20 |
| 包装形状 | SQUARE |
| 包装尺寸 | CHIP CARRIER, VERY THIN PROFILE |
| eak_reflow_temperature__cel_ | 260 |
| wer_supplies__v_ | 1.8/5 |
| qualification_status | COMMERCIAL |
| seated_height_max | 0.5500 mm |
| sub_category | Multiplexer or Switches |
| 表面贴装 | YES |
| 最大关断时间 | 30 ns |
| 最大接通时间 | 60 ns |
| switching__v_ | BREAK-BEFORE-MAKE |
| 工艺 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子涂层 | NOT SPECIFIED |
| 端子形式 | BUTT |
| 端子间距 | 0.5000 mm |
| 端子位置 | BOTTOM |
| ime_peak_reflow_temperature_max__s_ | 30 |
| length | 1.6 mm |
| width | 1.6 mm |
| FSA1258A | FSA1256_0504 | FSA1257 | FSA1256A | FSA1258AL8X | FSA1258 | FSA1257A | FSA1257L8X | |
|---|---|---|---|---|---|---|---|---|
| 描述 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BCC8 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BCC8 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BCC8 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BCC8 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BCC8 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BCC8 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BCC8 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BCC8 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BUTT | BUTT | BUTT | BUTT | BUTT | BUTT | BUTT | BUTT |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 最小工作温度 | -40 Cel | -40 Cel | -40 Cel | -40 Cel | - | -40 Cel | -40 Cel | - |
| 最大工作温度 | 85 Cel | 85 Cel | 85 Cel | 85 Cel | - | 85 Cel | 85 Cel | - |
| 额定供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | - |
| 最小供电/工作电压 | 1.65 V | 1.65 V | 1.65 V | 1.65 V | - | 1.65 V | 1.65 V | - |
| 最大供电/工作电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | - |
| 加工封装描述 | 1.60 MM, LEAD FREE, MO-255UAAD, MICROPAK-8 | 1.60 MM, LEAD FREE, MO-255UAAD, MICROPAK-8 | 1.60 MM, LEAD FREE, MO-255UAAD, MICROPAK-8 | 1.60 MM, LEAD FREE, MO-255UAAD, MICROPAK-8 | - | 1.60 MM, LEAD FREE, MO-255UAAD, MICROPAK-8 | 1.60 MM, LEAD FREE, MO-255UAAD, MICROPAK-8 | - |
| each_compli | Yes | Yes | Yes | Yes | - | Yes | Yes | - |
| 欧盟RoHS规范 | Yes | Yes | Yes | Yes | - | Yes | Yes | - |
| 状态 | Active | Active | Active | Active | - | Active | Active | - |
| 模拟IC其它类型 | SPST | SPST | SPST | SPST | - | SPST | SPST | - |
| jesd_30_code | S-XBCC-B8 | S-XBCC-B8 | S-XBCC-B8 | S-XBCC-B8 | - | S-XBCC-B8 | S-XBCC-B8 | - |
| moisture_sensitivity_level | 1 | 1 | 1 | 1 | - | 1 | 1 | - |
| mal_position__v_ | NC | NC | NC | NC | - | NC | NC | - |
| 通道数 | 1 | 1 | 1 | 1 | - | 1 | 1 | - |
| 关闭状态下的隔离额定值 | 70 dB | 70 dB | 70 dB | 70 dB | - | 70 dB | 70 dB | - |
| 最大通态电阻 | 4 ohm | 4 ohm | 4 ohm | 4 ohm | - | 4 ohm | 4 ohm | - |
| utput__v_ | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | - | SEPARATE OUTPUT | SEPARATE OUTPUT | - |
| 包装材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED | UNSPECIFIED | - |
| ckage_code | VBCC | VBCC | VBCC | VBCC | - | VBCC | VBCC | - |
| ckage_equivalence_code | LCC8,.06SQ,20 | LCC8,.06SQ,20 | LCC8,.06SQ,20 | LCC8,.06SQ,20 | - | LCC8,.06SQ,20 | LCC8,.06SQ,20 | - |
| 包装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - | SQUARE | SQUARE | - |
| 包装尺寸 | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | - | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | - |
| eak_reflow_temperature__cel_ | 260 | 260 | 260 | 260 | - | 260 | 260 | - |
| wer_supplies__v_ | 1.8/5 | 1.8/5 | 1.8/5 | 1.8/5 | - | 1.8/5 | 1.8/5 | - |
| qualification_status | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | - |
| seated_height_max | 0.5500 mm | 0.5500 mm | 0.5500 mm | 0.5500 mm | - | 0.5500 mm | 0.5500 mm | - |
| sub_category | Multiplexer or Switches | Multiplexer or Switches | Multiplexer or Switches | Multiplexer or Switches | - | Multiplexer or Switches | Multiplexer or Switches | - |
| 最大关断时间 | 30 ns | 30 ns | 30 ns | 30 ns | - | 30 ns | 30 ns | - |
| 最大接通时间 | 60 ns | 60 ns | 60 ns | 60 ns | - | 60 ns | 60 ns | - |
| switching__v_ | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - |
| 工艺 | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | - |
| 端子涂层 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 端子间距 | 0.5000 mm | 0.5000 mm | 0.5000 mm | 0.5000 mm | - | 0.5000 mm | 0.5000 mm | - |
| ime_peak_reflow_temperature_max__s_ | 30 | 30 | 30 | 30 | - | 30 | 30 | - |
| length | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | - | 1.6 mm | 1.6 mm | - |
| width | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | - | 1.6 mm | 1.6 mm | - |
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