This document was generated on 02/20/2018
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
Documents:
3D Model
Drawing (PDF)
Agency Certification
CSA
UL
General
Product Family
Series
Application
Comments
Component Type
Overview
Product Name
UPC
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Flammability
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Net Weight
Number of Columns
Number of Pairs
Number of Rows
Orientation
PC Tail Length
PCB Locator
PCB Retention
PCB Thickness - Recommended
Packaging Type
Pitch - Mating Interface
Pitch - Termination Interface
Plating min - Mating
Plating min - Termination
Stackable
Surface Mount Compatible (SMC)
Temperature Range - Operating
Termination Interface: Style
Electrical
Current - Maximum per Contact
0739427000
Active
HDM Backplane Connector System
HDM Board-to-Board Backplane Header, Vertical, Solder Tail, Open End, 144 Circuits
Packaging Specification PK-70873-0818 (PDF)
RoHS Certificate of Compliance (PDF)
LR19980
E29179
Backplane Connectors
73942
Backplane
Solder Tail
PCB Header
HDM Backplane Connector System
HDM
800754802895
144
144
Black, Natural
250
No
94V-0
No
None
Phosphor Bronze
Gold
Tin
High Temperature Thermoplastic
6.273/g
24
Open Pin Field
6
Vertical
3.50mm
No
None
2.50mm
Tube
2.00mm
2.00mm
0.762µm
2.540µm
Yes
Yes
-55°C to +105°C
Through Hole
1.0A
Series image - Reference only
EU ELV
Not Relevant
EU RoHS
China RoHS
Compliant
REACH SVHC
Not Contained Per
-ED/01/2018 (15
January 2018)
Halogen-Free
Status
Low-Halogen
Need more information on product
environmental compliance?
Email productcompliance@molex.com
Please visit the Contact Us section for any
non-product compliance questions.
China ROHS
ELV
RoHS Phthalates
Green Image
Not Relevant
Not Contained
Search Parts in this Series
73942 Series
Mates With
73632 HDM+ Board-to-Board Daughtercard
Receptacle. 73780 HDM Board-to-Board
Daughtercard Receptacle
Data Rate
Voltage - Maximum
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-freeProcess Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
Material Info
Reference - Drawing Numbers
Packaging Specification
Sales Drawing
1.0 Gbps
250V AC
040
SMC&WAVE
003
260
PK-70873-0818
SD-73942-001
This document was generated on 02/20/2018
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION