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MAX9175EUB-T

产品描述LVDS Interface IC
产品类别逻辑    逻辑   
文件大小820KB,共14页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
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MAX9175EUB-T概述

LVDS Interface IC

MAX9175EUB-T规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码TSSOP
包装说明MO-187C-BA, MICROMAX-10
针数10
Reach Compliance Codenot_compliant
输入调节DIFFERENTIAL
JESD-30 代码S-PDSO-G10
JESD-609代码e0
长度3 mm
逻辑集成电路类型LOW SKEW CLOCK DRIVER
湿度敏感等级1
功能数量1
反相输出次数
端子数量10
实输出次数2
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状SQUARE
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)245
传播延迟(tpd)3.23 ns
认证状态Not Qualified
Same Edge Skew-Max(tskwd)0.045 ns
座面最大高度1.1 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度3 mm

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19-2827; Rev 1; 4/04
670MHz LVDS-to-LVDS and Anything-to-LVDS
1:2 Splitters
General Description
The MAX9174/MAX9175 are 670MHz, low-jitter, low-
skew 1:2 splitters ideal for protection switching, loop-
back, and clock and signal distribution. The devices
feature ultra-low 1.0ps
(RMS)
random jitter (max) that
ensures reliable operation in high-speed links that are
highly sensitive to timing errors.
The MAX9174 has a fail-safe LVDS input and LVDS out-
puts. The MAX9175 has an anything differential input
(CML/LVDS/LVPECL) and LVDS outputs. The outputs
can be put into high impedance using the power-down
inputs. The MAX9174 features a fail-safe circuit that dri-
ves the outputs high when the input is open, undriven
and shorted, or undriven and terminated. The MAX9175
has a bias circuit that forces the outputs high when the
input is open. The power-down inputs are compatible
with standard LVTTL/LVCMOS logic. The power-down
inputs tolerate undershoot of -1V and overshoot of V
CC
+ 1V. The MAX9174/MAX9175 are available in 10-pin
µMAX and 10-lead thin QFN with exposed pad pack-
ages, and operate from a single +3.3V supply over the
-40°C to +85°C temperature range.
1.0ps
(RMS)
Jitter (max) at 670MHz
80ps
(P-P)
Jitter (max) at 800Mbps Data Rate
+3.3V Supply
LVDS Fail-Safe Inputs (MAX9174)
Anything Input (MAX9175) Accepts Differential
CML/LVDS/LVPECL
Power-Down Inputs Tolerate -1.0V and V
CC
+ 1.0V
Low-Power CMOS Design
10-Lead µMAX and Thin QFN Packages
-40°C to +85°C Operating Temperature Range
Conform to ANSI TIA/EIA-644 LVDS Standard
IEC 61000-4-2 Level 4 ESD Rating
Features
MAX9174/MAX9175
Ordering Information
PART
MAX9174EUB
MAX9174ETB*
MAX9175EUB
MAX9175ETB*
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
10 µMAX
10 Thin QFN-EP**
10 µMAX
10 Thin QFN-EP**
Applications
Protection Switching
Loopback
Clock Distribution
Functional Diagram and Pin Configurations appear at end
of data sheet.
*Future
product—contact factory for availability.
**EP
= Exposed paddle.
Typical Application Circuit
CLOCK DISTRIBUTION
ASIC
MAX9174
MAX9176
CLK IN
CLK1
ASIC
MAX9174
MAX9176
CLK IN
CLK2
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX9175EUB-T相似产品对比

MAX9175EUB-T MAX9175ETB MAX9175EUB MAX9174EUB MAX9174ETB MAX9174EUB+
描述 LVDS Interface IC LVDS Interface IC LVDS Interface IC LVDS Interface IC LVDS Interface IC IC MULTIPLEXER LVDS 1CH 10UMAX
是否无铅 含铅 含铅 含铅 含铅 含铅 不含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 TSSOP SON TSSOP TSSOP SON TSSOP
包装说明 MO-187C-BA, MICROMAX-10 3 X 3 MM, 0.80 MM HEIGHT, MO-229, QFN-10 TSSOP, TSSOP10,.19,20 MO-187C-BA, MICROMAX-10 3 X 3 MM, 0.80 MM HEIGHT, MO-229, QFN-10 TSSOP, TSSOP10,.19,20
针数 10 10 10 10 10 10
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant compliant
输入调节 DIFFERENTIAL DIFFERENTIAL DIFFERENTIAL DIFFERENTIAL DIFFERENTIAL DIFFERENTIAL
JESD-30 代码 S-PDSO-G10 S-XQCC-N10 S-PDSO-G10 S-PDSO-G10 S-XQCC-N10 S-PDSO-G10
JESD-609代码 e0 e0 e0 e0 e0 e3
长度 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
逻辑集成电路类型 LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER CLOCK DRIVER LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER
湿度敏感等级 1 1 1 1 1 1
功能数量 1 1 1 1 1 1
端子数量 10 10 10 10 10 10
实输出次数 2 2 2 2 2 2
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY
封装代码 TSSOP HVQCCN TSSOP TSSOP HVQCCN TSSOP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 245 240 245 245 240 260
传播延迟(tpd) 3.23 ns 3.23 ns 3.23 ns 3.23 ns 3.23 ns 3.23 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Same Edge Skew-Max(tskwd) 0.045 ns 0.045 ns 0.045 ns 0.045 ns 0.045 ns 0.045 ns
座面最大高度 1.1 mm 0.8 mm 1.1 mm 1.1 mm 0.8 mm 1.1 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn)
端子形式 GULL WING NO LEAD GULL WING GULL WING NO LEAD GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 DUAL QUAD DUAL DUAL QUAD DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 3 mm 3 mm 3 mm 3 mm 3 mm 3 mm
封装等效代码 - SOLCC10,.11,20 TSSOP10,.19,20 TSSOP10,.19,20 SOLCC10,.11,20 TSSOP10,.19,20
电源 - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Sup - 3.23 ns 3.23 ns 3.23 ns 3.23 ns 3.23 ns
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