Supervisory Circuits CPU SUP WITH 16K EEPROM
| 参数名称 | 属性值 |
| Brand Name | ON Semiconductor |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 8 |
| 制造商包装代码 | 646AA |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | RESET THRESHOLD VOLTAGE IS 2.625V |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDIP-T8 |
| JESD-609代码 | e4 |
| 长度 | 9.27 mm |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.33 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| CAT1162LI-25-G | MRC1/210034R4CBLKLF | CAT1162WI-45-GT3 | CAT1162WI-42-GT3 | CAT1162LI-30-G | CAT1162LI-45-G | CAT1162LI-42-G | CAT1162LI-28-G | CAT1162WI-25-GT3 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Supervisory Circuits CPU SUP WITH 16K EEPROM | Fixed Resistor, Metal Glaze/thick Film, 0.5W, 34.4ohm, 200V, 0.25% +/-Tol, 100ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT | Supervisory Circuits CPU w/16K | Supervisory Circuits CPU SUP WITH 16K EEPROM | Supervisory Circuits CPU w/16K | Supervisory Circuits CPU w/16K | Supervisory Circuits CPU SUP WITH 16K EEPROM | Supervisory Circuits CPU w/16K | Supervisory Circuits CPU w/16K |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | DIP, | MELF, 1206 | SOP, | SOP, | DIP, | DIP, | DIP, | DIP, | SOP, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Brand Name | ON Semiconductor | - | ON Semiconductor | ON Semiconductor | ON Semiconductor | ON Semiconductor | ON Semiconductor | ON Semiconductor | ON Semiconductor |
| 厂商名称 | ON Semiconductor(安森美) | - | - | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
| 零件包装代码 | DIP | - | SOIC | SOIC | DIP | DIP | DIP | DIP | SOIC |
| 针数 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 制造商包装代码 | 646AA | - | 751BD | 751BD | 646AA | 646AA | 646AA | 646AA | 751BD |
| 其他特性 | RESET THRESHOLD VOLTAGE IS 2.625V | - | - | RESET THRESHOLD VOLTAGE IS 4.375V | RESET THRESHOLD VOLTAGE IS 3.075V | RESET THRESHOLD VOLTAGE IS 4.625V | RESET THRESHOLD VOLTAGE IS 4.375V | RESET THRESHOLD VOLTAGE IS 2.925V | RESET THRESHOLD VOLTAGE IS 2.625V |
| 可调阈值 | NO | - | - | NO | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDIP-T8 | - | - | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 |
| JESD-609代码 | e4 | e1 | - | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 9.27 mm | - | - | 4.9 mm | 9.27 mm | 9.27 mm | 9.27 mm | 9.27 mm | 4.9 mm |
| 信道数量 | 1 | - | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | - | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 2 | - | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 150 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | - | SOP | DIP | DIP | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | CYLINDRICAL PACKAGE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | MELF | - | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.33 mm | - | - | 1.75 mm | 5.33 mm | 5.33 mm | 5.33 mm | 5.33 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V | - | - | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2.7 V | - | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | YES | - | YES | NO | NO | NO | NO | YES |
| 技术 | CMOS | METAL GLAZE/THICK FILM | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE | - | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | - | - | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | - | - | 3.9 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 3.9 mm |
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