Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> MK22FN256CAH12R

MK22FN256CAH12R: 产品描述ARM Microcontrollers - MCU MK22FN256CAH12/WLCSP64///REEL 13 Q2/T3*STANDARD M; 产品类别半导体嵌入式处理器和控制器; 文件大小989KB，共69页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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MK22FN256CAH12R概述

ARM Microcontrollers - MCU MK22FN256CAH12/WLCSP64///REEL 13 Q2/T3*STANDARD M

MK22FN256CAH12R规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	NXP(恩智浦)
产品种类 Product Category	ARM Microcontrollers - MCU
RoHS	Details
安装风格 Mounting Style	SMD/SMT
封装 / 箱体 Package / Case	WLCSP-64
Core	ARM Cortex M4
Data Bus Width	32 bit
Maximum Clock Frequency	120 MHz
Program Memory Size	256 kB
Data RAM Size	48 kB
ADC Resolution	16 bit
Number of I/Os	40 I/O
工作电源电压 Operating Supply Voltage	1.71 V to 3.6 V
最小工作温度 Minimum Operating Temperature	- 40 C
最大工作温度 Maximum Operating Temperature	+ 85 C
接口类型 Interface Type	I2C, I2S, SPI, UART, USB
产品 Product	MCU+DSP+FPU
Program Memory Type	Flash
Data RAM Type	SRAM
Analog Supply Voltage	1.71 V to 3.6 V
DAC Resolution	12 bit
Development Kit	FRDM-K22F
I/O Voltage	1.71 V to 3.6 V
Number of ADC Channels	2 Channel
Number of Timers/Counters	2 x 16 bit, 1 x 32 bit
Processor Series	K22
工厂包装数量 Factory Pack Quantity	5000
电源电压-最大 Supply Voltage - Max	3.6 V
电源电压-最小 Supply Voltage - Min	1.71 V
看门狗计时器 Watchdog Timers	Watchdog Timer
单位重量 Unit Weight	0.000483 oz

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NXP Semiconductors

Data Sheet: Technical Data

K22P64M120SF8

Rev. 7, 08/2016

Kinetis K22F 128 KB/256 KB

Flash 64-pin WLCSP

120 MHz ARM® Cortex®-M4-Based Microcontroller with FPU

The Kinetis K22 WLCSP product family members are optimized

for space-constrained, cost-sensitive applications requiring low

power, USB connectivity, and processing efficiency with a

floating point unit. These devices share the comprehensive

enablement and scalability of the Kinetis family. This product

offers:

• Run power consumption down to 153 μA/MHz and static

power consumption down to 2.6 μA with full state retention

and 6 μs wakeup. Lowest static mode down to 120 nA

• USB LS/FS OTG 2.0 w/ embedded 3.3 V, 120 mA LDO

voltage regulator. USB FS device crystal-less functionality.

MK22FN256CAH12R

MK22FN128CAH12R

64 WLCSP (AH)

3.36 x 3.33 x 0.56 Pitch 0.4 mm

Performance

• 120 MHz ARM® Cortex®-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per MHz

Memories and memory interfaces

• Up to 256 KB of embedded flash and 48 KB of RAM

• Serial programming interface (EzPort)

• Preprogrammed Kinetis flashloader for one-time, in-

system factory programming

System peripherals

• Flexible low-power modes, multiple wake up sources

• 16-channel DMA controller

• Independent external and software watchdog monitor

Analog modules

• Two 16-bit SAR ADCs (1.2 MS/s in 12-bit mode)

• One 12-bit DAC

• Two analog comparators (CMP) with 6- bit DAC

• Accurate internal voltage reference

Communication interfaces

• USB LS/FS OTG 2.0 with on-chip transceiver and

USB LDO voltage regulator

• USB full-speed device crystal-less operation

• Two SPI modules

• Three UART modules and one low-power UART

• Two I2C: Support for up to 1 Mbps operation

• I2S module

Clocks

Timers

• Two crystal oscillators: 32 kHz (RTC) and 32-40 kHz or

• One 8-ch general-purpose PWM timer

3-32 MHz

• Two 2-ch general-purpose timers with quadrature

• Three internal oscillators: 32kHz, 4MHz, and 48MHz

decoder functionality

• Multipurpose clock generator with PLL and FLL

• Periodic interrupt timers

• 16-bit low-power timer

Security and integrity modules

• Real-time clock with independent power domain

• Hardware CRC module

• Programmable delay block

• 128-bit unique identification (ID) number per chip

• Hardware random-number generator

Operating Characteristics

• Flash access control to protect proprietary software

• Voltage range (including flash writes): 1.71 to 3.6 V

• Temperature range (ambient): -40 to 85°C

Human-machine interface

• Up to 40 general-purpose I/O (GPIO)

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................6

2.2.1 Voltage and current operating requirements....... 6

2.2.2 LVD and POR operating requirements................7

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 9

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 17

2.2.7 Designing with radiated emissions in mind..........18

2.2.8 Capacitance attributes.........................................18

2.3 Switching specifications...................................................18

2.3.1 Device clock specifications..................................18

2.3.2 General switching specifications......................... 19

2.4 Thermal specifications..................................................... 20

2.4.1 Thermal operating requirements......................... 20

2.4.2 Thermal attributes................................................20

3 Peripheral operating requirements and behaviors.................. 21

3.1 Core modules.................................................................. 21

3.1.1 SWD electricals .................................................. 21

3.1.2 JTAG electricals.................................................. 22

3.2 System modules.............................................................. 25

3.3 Clock modules................................................................. 25

3.3.1 MCG specifications..............................................25

3.3.2 IRC48M specifications.........................................28

3.3.3 Oscillator electrical specifications........................28

3.3.4 32 kHz oscillator electrical characteristics........... 31

3.4 Memories and memory interfaces................................... 31

3.4.1 Flash electrical specifications.............................. 31

3.4.2 EzPort switching specifications........................... 33

3.5 Security and integrity modules........................................ 34

3.6 Analog............................................................................. 34

3.6.1

3.6.2

ADC electrical specifications............................... 34

CMP and 6-bit DAC electrical specifications....... 38

3.6.3 12-bit DAC electrical characteristics....................41

3.6.4 Voltage reference electrical specifications.......... 44

3.7 Timers..............................................................................45

3.8 Communication interfaces............................................... 45

3.8.1 USB electrical specifications............................... 46

3.8.2 USB VREG electrical specifications.................... 46

3.8.3 DSPI switching specifications (limited voltage

range).................................................................. 47

DSPI switching specifications (full voltage

range).................................................................. 49

3.8.5 Inter-Integrated Circuit Interface (I2C) timing...... 50

3.8.6 UART switching specifications............................ 52

3.8.7 I2S/SAI switching specifications.......................... 52

4 Dimensions............................................................................. 58

4.1 Obtaining package dimensions....................................... 58

5 Pinout...................................................................................... 59

5.1 K22F Signal Multiplexing and Pin Assignments.............. 59

5.2 Recommended connection for unused analog and

digital pins........................................................................61

5.3 K22F Pinouts................................................................... 62

6 Part identification.....................................................................63

6.1 Description.......................................................................63

6.2 Format............................................................................. 63

6.3 Fields............................................................................... 64

6.4 Example...........................................................................64

6.5 64-pin WLCSP part marking............................................ 65

7 Terminology and guidelines.................................................... 65

7.1 Definitions........................................................................ 65

7.2 Examples......................................................................... 65

7.3 Typical-value conditions.................................................. 66

7.4 Relationship between ratings and operating

requirements....................................................................66

7.5 Guidelines for ratings and operating requirements..........67

8 Revision History...................................................................... 67

3.8.4