NLU1GT04
Single Inverter, TTL Level
LSTTL−Compatible Inputs
The NLU1GT04 MiniGatet is an advanced CMOS high−speed
inverting buffer in ultra−small footprint.
The device input is compatible with TTL−type input thresholds and
the output has a full 5.0 V CMOS level output swing.
The NLU1GT04 input and output structures provide protection
when voltages up to 7 V are applied, regardless of the supply voltage.
Features
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MARKING
DIAGRAMS
UDFN6
MU SUFFIX
CASE 517AA
1
ULLGA6
1.0 x 1.0
CASE 613AD
1
ULLGA6
1.2 x 1.0
CASE 613AE
1
ULLGA6
1.45 x 1.0
CASE 613AF
1
N or 2
M
= Device Marking
= Date Code
M
N
•
•
•
•
•
•
•
•
High Speed: t
PD
= 3.8 ns (Typ) @ V
CC
= 5.0 V
Low Power Dissipation: I
CC
= 1
mA
(Max) at T
A
= 25°C
TTL−Compatible Input: V
IL
= 0.8 V; V
IH
= 2.0 V
CMOS−Compatible Output:
V
OH
> 0.8 V
CC
; V
OL
< 0.1 V
CC
@ Load
Power Down Protection Provided on inputs
Balanced Propagation Delays
Ultra−Small Packages
These are Pb−Free Devices
NM
NM
NC
1
6
V
CC
M
2
IN A
2
5
NC
GND
3
4
OUT Y
Figure 1. Pinout
(Top View)
IN A
1
OUT Y
1
2
3
4
5
6
PIN ASSIGNMENT
NC
IN A
GND
OUT Y
NC
V
CC
Figure 2. Logic Symbol
FUNCTION TABLE
A
L
H
Y
H
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2010
August, 2010
−
Rev. 2
1
Publication Order Number:
NLU1GT04/D
NLU1GT04
MAXIMUM RATINGS
Symbol
V
CC
V
IN
V
OUT
I
IK
I
OK
I
O
I
CC
I
GND
T
STG
T
L
T
J
MSL
F
R
V
ESD
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Moisture Sensitivity
Flammability Rating Oxygen
ESD Withstand Voltage
Index: 28 to 34
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
V
IN
< GND
V
OUT
< GND
Parameter
Value
−0.5
to +7.0
−0.5
to +7.0
−0.5
to +7.0
−20
±20
±12.5
±25
±25
−65
to +150
260
150
Level 1
UL 94 V−0 @ 0.125 in
> 2000
> 200
N/A
±500
V
Unit
V
V
V
mA
mA
mA
mA
mA
°C
°C
°C
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 125
°C
(Note 5)
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22−A114−A.
3. Tested to EIA / JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
V
OUT
T
A
Dt/DV
Positive DC Supply Voltage
Digital Input Voltage
Output Voltage
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
V
CC
= 3.3 V
±
0.3 V
V
CC
= 5.0 V
±
0.5 V
Parameter
Min
1.65
0
0
−55
0
0
Max
5.5
5.5
5.5
+125
100
20
Unit
V
V
V
°C
ns/V
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2
NLU1GT04
DC ELECTRICAL CHARACTERISTICS
V
CC
(V)
1.8
3.0
4.5 to
5.5
V
IL
Low−Level Input Voltage
1.8
3.0
4.5 to
5.5
V
OH
High−Level
Output Voltage
V
IN
= V
IH
or V
IL
I
OH
=
−50
mA
V
IN
= V
IH
or V
IL
I
OH
=
−2
mA
I
OH
=
−4
mA
I
OH
=
−8
mA
V
OL
Low−Level Output
Voltage
V
IN
= V
IH
or V
IL
I
OL
= 50
mA
V
IN
= V
IH
or V
IL
I
OL
= 2 mA
I
OL
= 4 mA
I
OL
= 8 mA
I
IN
I
CC
I
CCT
I
OPD
Input Leakage Current
Quiescent Supply
Current
Quiescent Supply
Current
Output Leakage Current
0
v
V
IN
v
5.5 V
0
v
V
IN
v
V
CC
V
IN
= 3.4 V
V
OUT
= 5.5 V
3.0
4.5
1.8
3.0
4.5
3.0
4.5
1.8
3.0
4.5
0 to
5.5
5.5
5.5
0.0
2.9
4.4
1.40
2.58
3.94
0
0
0.1
0.1
0.36
0.36
0.36
±0.1
1.0
1.35
0.5
3.0
4.5
T
A
= 25
5C
Min
1.2
1.4
2.0
0.3
0.53
0.8
2.9
4.4
1.38
2.48
3.80
0.1
0.1
0.44
0.44
0.44
±1.0
20
1.50
5.0
Typ
Max
T
A
=
+855C
Min
1.2
1.4
2.0
0.3
0.53
0.8
2.9
4.4
1.37
2.34
3.66
0.1
0.1
0.52
0.52
0.52
±1.0
40
1.65
10
mA
mA
mA
mA
V
Max
T
A
=
−555C
to +1255C
Min
1.2
1.4
2.0
0.3
0.53
0.8
V
V
Max
Unit
V
Symbol
V
IH
Parameter
Low−Level Input Voltage
Conditions
AC ELECTRICAL CHARACTERISTICS
(Input t
r
= t
f
= 3.0 ns)
V
CC
(V)
3.0 to
3.6
4.5 to
5.5
C
IN
C
PD
Input Capacitance
Power Dissipation
Capacitance
(Note 6)
5.0
Test
Condition
C
L
= 15 pF
C
L
= 50 pF
C
L
= 15 pF
C
L
= 50 pF
T
A
= 25
5C
Min
Typ
5.0
6.2
3.8
4.2
5
10
Max
10.0
13.5
6.7
7.7
10
T
A
=
+855C
Min
Max
11.0
15.0
7.5
8.5
10
T
A
=
−555C
to
+1255C
Min
Max
13.0
17.5
8.5
9.5
10.0
pF
pF
Unit
ns
Symbol
t
PLH
,
t
PHL
Parameter
Propagation
Delay, Input A to
Output Y
6. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation I
CC(OPR)
= C
PD
•
V
CC
•
f
in
+ I
CC
. C
PD
is used to determine the no−load
dynamic power consumption: P
D
= C
PD
•
V
CC2
•
f
in
+ I
CC
•
V
CC.
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3
NLU1GT04
A or B
V
CC
50%
GND
t
PLH
Y
50% V
CC
t
PHL
Figure 3. Switching Waveforms
INPUT
C
L*
OUTPUT
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for propagation delay tests.
Figure 4. Test Circuit
ORDERING INFORMATION
Device
NLU1GT04MUTCG
NLU1GT04AMX1TCG
NLU1GT04BMX1TCG
NLU1GT04CMX1TCG
Package
UDFN6
(Pb−Free)
ULLGA6, 1.45 x 1.0, 0.5P
(Pb−Free)
ULLGA6, 1.2 x 1.0, 0.4P
(Pb−Free)
ULLGA6, 1.0 x 1.0, 0.35P
(Pb−Free)
Shipping
†
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLU1GT04
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA−01
ISSUE C
EDGE OF PACKAGE
D
A
B
L1
PIN ONE
REFERENCE
2X
E
0.10 C
2X
DETAIL A
Bottom View
(Optional)
EXPOSED Cu
MOLD CMPD
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
0.10 C
(A3)
A
A1
10X
0.08 C
SIDE VIEW
A1
5X
1
3
SEATING
PLANE
C
L
L2
6X
b
0.10 C A B
0.05 C
NOTE 3
6
4
e
BOTTOM VIEW
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5
ÉÉÉ
ÉÉÉ
DETAIL B
Side View
(Optional)
0.40
PITCH
0.10 C
ÉÉ
ÉÉ
ÉÉ
TOP VIEW
A3
MOUNTING FOOTPRINT*
0.42
6X
0.22
6X
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
嵌入式系统
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