Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features
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ULTRAFAST RECTIFIERS
2 AMPERES, 150−200 VOLTS
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
Low Forward Voltage Drop (0.77 V Max @ 2.0 A, T
J
= 150C)
Low Forward Voltage Drop (0.71 V Max @ 1.0 A, T
J
= 150C)
AEC−Q101 Qualified and PPAP Capable
SURA8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb-Free*
Mechanical Characteristics:
SMA
CASE 403D
PLASTIC
MARKING DIAGRAM
Case: Epoxy, Molded
Weight: 70 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
U5x
AYWW
G
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
Polarity: Polarity Band Indicates Cathode Lead
ESD Protection:
Human Body Model > 4000 V (Class 3)
Machine Model > 400 V (Class C)
U5x = Device Code
x = C for MURA215T3
= D for MURA220T3
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
ORDERING INFORMATION
Device
MURA215T3G
SURA8215T3G
MURA220T3G
SURA8220T3G
Package
Shipping
†
SMA
5,000/Tape & Reel
(Pb−Free)
SMA
5,000/Tape & Reel
(Pb−Free)
SMA
5,000/Tape & Reel
(Pb−Free)
SMA
5,000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
Preferred
devices are recommended choices for future use
and best overall value.
January, 2012
−
Rev. 5
1
Publication Order Number:
MURA215T3/D
MURA215T3G, SURA8215T3G, MURA220T3G, SURA8220T3G
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
MURA215T3G/SURA8215T3G
MURA220T3G/SURA8220T3G
Average Rectified Forward Current
@ T
L
= 155C
@ T
L
= 135C
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature Range
Symbol
V
RRM
V
RWM
V
R
Value
Unit
V
150
200
1.0
2.0
40
−65
to +175
A
I
F(AV)
I
FSM
T
J
A
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (T
L
= 25C) (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)
Symbol
Psi
JL
(Note 2)
R
qJA
Max
24
216
Unit
C/W
1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4.
2. In compliance with JEDEC 51, these values (historically represented by R
qJL
) are now referenced as Psi
JL
.
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
(i
F
= 2.0 A, T
J
= 25C)
(i
F
= 2.0 A, T
J
= 150C)
Maximum Instantaneous Reverse Current (Note 3)
(Rated DC Voltage, T
J
= 25C)
(Rated DC Voltage, T
J
= 150C)
Maximum Reverse Recovery Time
(i
F
= 1.0 A, di/dt = 50 A/ms)
3. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
2.0%.
Symbol
v
F
Max
0.95
0.77
2.0
50
35
Unit
V
i
R
mA
t
rr
ns
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2
MURA215T3G, SURA8215T3G, MURA220T3G, SURA8220T3G
100
I
R
, REVERSE CURRENT (mA)
10
1
0.1
0.01
T
J
= 25C
I
R
, REVERSE CURRENT (mA)
T
J
= 175C
100
T
J
= 175C
10
T
J
= 100C
1
T
J
= 25C
T
J
= 100C
0.001
0
20
40
60
80
100 120 140 160 180 200
0.1
0
20
40
60
80
100 120 140 160 180 200
V
R
, REVERSE VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 1. Typical Reverse Current
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
Figure 2. Maximum Reverse Current
10
T
C
= 175C
100C
25C
10
T
C
= 175C
100C
25C
1
1
0.1
0.1
0.01
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
0.01
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
V
F
, INSTANTANEOUS VOLTAGE (VOLTS)
V
F
, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 3. Typical Forward Voltage
Figure 4. Maximum Forward Voltage
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3
MURA215T3G, SURA8215T3G, MURA220T3G, SURA8220T3G
50
45
C, CAPACITANCE (pF)
40
35
30
25
20
15
10
5
0
0
4
8
12
16
20
24
28
32
36
40
NOTE: TYPICAL
CAPACITANCE AT
0 V = 45 pF
50
45
C, CAPACITANCE (pF)
40
35
30
25
20
15
10
5
0
0
4
8
12
16
20
24
28
32
36
40
NOTE: MAXIMUM
CAPACITANCE AT
0 V = 47 pF
V
R
, REVERSE VOLTAGE (VOLTS)
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 5. Typical Capacitance
Figure 6. Maximum Capacitance
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
5
4
3
2
1
0
dc
SQUARE WAVE
1.5
1.25
1
0.75 SQUARE WAVE
0.5
0.25
0
0
20
40
60
80
100
120
140
160
180
dc
80 90
100 110 120 130 140 150 160 170 180
T
L
, LEAD TEMPERATURE (C)
T
A
, AMBIENT TEMPERATURE (C)
Figure 7. Current Derating, Lead
Figure 8. Current Derating, Ambient
(FR−4 Board with Minimum Pad)
P
F
, AVERAGE POWER DISSIPATION (W)
3
2.5
2
1.5
1
0.5
0
0
0.5
1
1.5
2
2.5
3
3.5
SQUARE WAVE
dc
I
F(AV)
, AVERAGE FORWARD CURRENT (AMPS)
Figure 9. Power Dissipation
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4
MURA215T3G, SURA8215T3G, MURA220T3G, SURA8220T3G
PACKAGE DIMENSIONS
SMA
CASE 403D−02
ISSUE F
H
E
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.
DIM
A
A1
b
c
D
E
H
E
L
MIN
1.97
0.05
1.27
0.15
2.29
4.06
4.83
0.76
MILLIMETERS
NOM
MAX
2.10
2.20
0.10
0.15
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
MIN
0.078
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.083
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.087
0.006
0.064
0.016
0.115
0.180
0.220
0.060
b
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
A
A1
L
c
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
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Email:
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For additional information, please contact your local
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