Gate Drivers 125V 2A Half-Bridge MOSFET Driver
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | SOIC |
包装说明 | SOP, SOP8,.25 |
针数 | 8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 1 week |
高边驱动器 | YES |
接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e3 |
长度 | 4.9 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
标称输出峰值电流 | 2 A |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
电源 | 12 V |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电压 | 12.6 V |
最小供电电压 | 8 V |
标称供电电压 | 12 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
断开时间 | 0.063 µs |
接通时间 | 0.063 µs |
宽度 | 3.9 mm |
MAX5062AASA+ | MAX5062BASA-T | MAX5062DASA+ | MAX5062AASA-T | MAX5062DASA+T | MAX5062DASA-T | MAX5062CASA | MAX5062BASA+ | |
---|---|---|---|---|---|---|---|---|
描述 | Gate Drivers 125V 2A Half-Bridge MOSFET Driver | Gate Drivers 125V 2A Half-Bridge MOSFET Driver | Gate Drivers 125V 2A Half-Bridge MOSFET Driver | Gate Drivers 125V 2A Half-Bridge MOSFET Driver | Gate Drivers 125V 2A Half-Bridge MOSFET Driver | Gate Drivers 125V 2A Half-Bridge MOSFET Driver | Gate Drivers 125V 2A Half-Bridge MOSFET Driver | Gate Drivers 125V 2A Half-Bridge MOSFET Driver |
是否无铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 |
是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 不符合 | 符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
包装说明 | SOP, SOP8,.25 | SOP, SOP8,.25 | HLSOP, SOP8,.25 | SOP, SOP8,.25 | HLSOP, SOP8,.25 | HLSOP, SOP8,.25 | HLSOP, SOP8,.25 | SOIC-8 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | not_compliant | compliant | not_compliant | compliant | not_compliant | not_compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
高边驱动器 | YES | YES | YES | YES | YES | YES | YES | YES |
接口集成电路类型 | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER | HALF BRIDGE BASED MOSFET DRIVER |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e3 | e0 | e3 | e0 | e3 | e0 | e0 | e3 |
长度 | 4.9 mm | 4.9 mm | 4.89 mm | 4.9 mm | 4.89 mm | 4.89 mm | 4.89 mm | 4.9 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
标称输出峰值电流 | 2 A | 2 A | 2 A | 2 A | 2 A | 2 A | 2 A | 2 A |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | HLSOP | SOP | HLSOP | HLSOP | HLSOP | SOP |
封装等效代码 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | 245 | 260 | 245 | 260 | 245 | 245 | 260 |
电源 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.75 mm | 1.68 mm | 1.75 mm | 1.68 mm | 1.68 mm | 1.68 mm | 1.75 mm |
最大供电电压 | 12.6 V | 12.6 V | 12.6 V | 12.6 V | 12.6 V | 12.6 V | 12.6 V | 12.6 V |
最小供电电压 | 8 V | 8 V | 8 V | 8 V | 8 V | 8 V | 8 V | 8 V |
标称供电电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
断开时间 | 0.063 µs | 0.063 µs | 0.063 µs | 0.063 µs | 0.063 µs | 0.063 µs | 0.063 µs | 0.063 µs |
接通时间 | 0.063 µs | 0.063 µs | 0.063 µs | 0.063 µs | 0.063 µs | 0.063 µs | 0.063 µs | 0.063 µs |
宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
湿度敏感等级 | 1 | - | 1 | - | 1 | 1 | 1 | 1 |
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