Pb Free Plating Product
ISSUED DATE :2005/12/16
REVISED DATE :
GU50L02
N-CHANNEL ENHANCEMENT MODE POWER MOSFET
BV
DSS
R
DS(ON)
I
D
25V
17m
40A
The GU50L02 provide the designer with the best combination of fast switching, ruggedized device design, low
on-resistance and cost-effectiveness.
The TO-263 package is universally preferred for all commercial-industrial surface mount applications and
suited for low voltage applications such as DC/DC converters.
*Low Gate Charge
*Simple Drive Requirement
*Fast Switching Characteristic
Description
Features
Package Dimensions
REF.
A
b
L4
c
L3
L1
E
Millimeter
REF.
Min.
Max.
4.40
4.80
c2
0.76
1.00
b2
0.00
0.30 B D
0.36
0.5
e
1.50 REF.
L
2.29
2.79
9.80
10.4
L2
Millimeter
Min.
Max.
1.25
1.45
1.17
1.47
8.6
9.0
2.54 REF.
14.6
15.8
0˚
8˚
1.27 REF.
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, V
GS
@10V
Continuous Drain Current, V
GS
@10V
Pulsed Drain Current
1
Total Power Dissipation
Linear Derating Factor
Operating Junction and Storage Temperature Range
Symbol
V
DS
V
GS
I
D
@T
C
=25 :
I
D
@T
C
=100 :
I
DM
P
D
@T
C
=25 :
Tj, Tstg
Ratings
25
±20
40
27
140
44.6
0.36
-55 ~ +150
Unit
V
V
A
A
A
W
W/ :
:
Thermal Data
Parameter
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Max.
Max.
Symbol
Rthj-c
Rthj-a
Value
2.8
62
Unit
:
/W
: /W
GU50L02
Page: 1/5
ISSUED DATE :2005/12/16
REVISED DATE :
Electrical Characteristics (Tj = 25 : unless otherwise specified)
Parameter
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature Coefficient
Symbol
BV
DSS
BV
DSS
/
Tj
Min.
25
-
1.0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ.
-
0.037
-
10
-
-
-
-
-
11.5
2.1
8.4
7
60
17
9
390
245
100
Max.
-
-
3.0
-
±100
1
25
17
35
-
-
-
-
-
-
-
-
-
-
Unit
V
V/ :
V
S
nA
uA
uA
m
Test Conditions
V
GS
=0, I
D
=250uA
Reference to 25 : , I
D
=1mA
V
DS
=V
GS
, I
D
=250uA
V
DS
=10V, I
D
=20A
V
GS
= ±20V
V
DS
=25V, V
GS
=0
V
DS
=20V, V
GS
=0
V
GS
=10V, I
D
=20A
V
GS
=4.5V, I
D
=10A
I
D
=20A
V
DS
=20V
V
GS
=5V
V
DS
=15V
I
D
=20A
V
GS
=10V
R
G
=3.3
R
D
=0.75
V
GS
=0V
V
DS
=25V
f=1.0MHz
Gate Threshold Voltage
Forward Transconductance
Gate-Source Leakage Current
Drain-Source Leakage Current(Tj=25 : )
Drain-Source Leakage Current(Tj=
150 :
)
V
GS(th)
g
fs
I
GSS
I
DSS
Static Drain-Source On-Resistance
Total Gate Charge
2
Gate-Source Charge
Gate-Drain (“Miller”) Change
Turn-on Delay Time
2
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
R
DS(ON)
Q
g
Q
gs
Q
gd
T
d(on)
T
r
T
d(off)
T
f
C
iss
C
oss
C
rss
nC
ns
pF
Source-Drain Diode
Parameter
Forward On Voltage
2
Continuous Source Current (
Body Diode
)
Pulse Source Current (
Body Diode
)
1
Symbol
V
SD
I
S
I
SM
Min.
-
-
-
Typ.
-
-
-
Max.
1.26
40
140
Unit
V
A
A
Test Conditions
I
S
=40A, V
GS
=0V, Tj=25 :
V
D
=V
G
=0V, V
S
=1.26V
Notes: 1. Pulse width limited by safe operating area.
2. Pulse width 300us, duty cycle 2%.
GU50L02
Page: 2/5
ISSUED DATE :2005/12/16
REVISED DATE :
Characteristics Curve
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
Fig 5. Maximum Drain Current
v.s. Case Temperature
GU50L02
Fig 6. Type Power Dissipation
Page: 3/5
ISSUED DATE :2005/12/16
REVISED DATE :
Fig 7. Maximum Safe Operating Area
Fig 8. Effective Transient Thermal Impedance
Fig 9. Gate Charge Characteristics
Fig 10. Typical Capacitance Characteristics
Fig 11. Forward Characteristics of
Reverse Diode
GU50L02
Fig 12. Gate Threshold Voltage v.s.
Junction Temperature
Page: 4/5
ISSUED DATE :2005/12/16
REVISED DATE :
Fig 13. Switching Time Circuit
Fig 14. Switching Time Waveform
Fig 15. Gate Charge Circuit
Fig 16. Gate Charge Waveform
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM.
GTM reserves the right to make changes to its products without notice.
GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems.
GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Taiwan:
No. 17-1 Tatung Rd. Fu Kou Hsin-Chu Industrial Park, Hsin-Chu, Taiwan, R. O. C.
TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785
China:
(201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China
TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165
GU50L02
Page: 5/5
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