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72V283L10PF

产品描述FIFO 3.3V CONFIG 64KX9/32KX18
产品类别存储    存储   
文件大小287KB,共45页
制造商IDT (Integrated Device Technology)
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72V283L10PF概述

FIFO 3.3V CONFIG 64KX9/32KX18

72V283L10PF规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码TQFP
包装说明LQFP, QFP80,.64SQ
针数80
制造商包装代码PN80
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间6.5 ns
其他特性IT CAN ALSO BE CONFIGURED AS 64K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
备用内存宽度9
最大时钟频率 (fCLK)100 MHz
周期时间10 ns
JESD-30 代码S-PQFP-G80
JESD-609代码e0
长度14 mm
内存密度589824 bit
内存集成电路类型OTHER FIFO
内存宽度18
湿度敏感等级3
功能数量1
端子数量80
字数32768 words
字数代码32000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织32KX18
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装等效代码QFP80,.64SQ
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)240
电源3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.015 A
最大压摆率0.035 mA
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm

文档预览

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3.3 VOLT HIGH-DENSITY SUPERSYNC II™ NARROW BUS FIFO
512 x 18/1,024 x 9, 1,024 x 18/2,048 x 9
IDT72V223, IDT72V233
IDT72V243, IDT72V253
2,048 x 18/4,096 x 9, 4,096 x 18/8,192 x 9
IDT72V263, IDT72V273
8,192 x 18/16,384 x 9, 16,384 x 18/32,768 x 9
IDT72V283, IDT72V293
32,768 x 18/65,536 x 9, 65,536 x 18/131,072 x 9
LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018
FEATURES:
Choose among the following memory organizations:
IDT72V223
512 x 18/1,024 x 9
IDT72V233
1,024 x 18/2,048 x 9
IDT72V243
2,048 x 18/4,096 x 9
IDT72V253
4,096 x 18/8,192 x 9
IDT72V263
8,192 x 18/16,384 x 9
IDT72V273
16,384 x 18/32,768 x 9
IDT72V283
32,768 x 18/65,536 x 9
IDT72V293
65,536 x 18/131,072 x 9
Functionally compatible with the IDT72V255LA/72V265LA and
IDT72V275/72V285 SuperSync FIFOs
Up to 166 MHz Operation of the Clocks
User selectable Asynchronous read and/or write ports (BGA Only)
User selectable input and output port bus-sizing
- x9 in to x9 out
- x9 in to x18 out
- x18 in to x9 out
- x18 in to x18 out
Pin to Pin compatible to the higher density of IDT72V2103/72V2113
Big-Endian/Little-Endian user selectable byte representation
5V tolerant inputs
Fixed, low first word latency
Zero latency retransmit
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Program programmable flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
JTAG port, provided for Boundary Scan function (BGA Only)
Independent Read and Write Clocks (permit reading and writing
simultaneously)
Available in a 80-pin Thin Quad Flat Pack (TQFP) or a 100-pin Ball
Grid Array (BGA) (with additional features)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts available, see ordering information
FUNCTIONAL BLOCK DIAGRAM
*Available on the
BGA package only.
D
0
-D
n
(x9 or x18)
WEN
WCLK/WR
*
INPUT REGISTER
LD SEN
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
*
ASYW
WRITE CONTROL
LOGIC
WRITE POINTER
RAM ARRAY
512 x 18 or 1,024 x 9
1,024 x 18 or 2,048 x 9
2,048 x 18 or 4,096 x 9
4,096 x 18 or 8,192 x 9
8,192 x 18 or 16,384 x 9
16,384 x 18 or 32,768 x 9
32,768 x 18 or 65,536 x 9
65,536 x 18 or 131,072 x 9
FLAG
LOGIC
READ POINTER
BE
IP
IW
OW
MRS
PRS
TCK
*
TRST
*
TMS
**
TDI
*
TDO
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
RM
ASYR
*
RCLK/RD
JTAG CONTROL
(BOUNDARY SCAN)
*
OE
Q
0
-Q
n
(x9 or x18)
REN
*
4666 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The SuperSync II FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©2018
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
MARCH 2018
DSC-4666/18

 
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