Freescale Semiconductor, Inc.
Data Sheet: Technical Data
KL04P48M48SF1
Rev 4 03/2014
Kinetis KL04 32 KB Flash
48 MHz Cortex-M0+ Based Microcontroller
Designed with efficiency in mind. Features a size efficient, small
package, energy efficient ARM Cortex-M0+ 32-bit performance.
Shares the comprehensive enablement and scalability of the
Kinetis family.
This product offers:
• Run power consumption down to 45 μA/MHz in very low
power run mode
• Static power consumption down to 2 μA with full state
retention and 4 μs wakeup
• Ultra-efficient Cortex-M0+ processor running up to 48MHz
with industry leading throughput
• Memory option is up to 32 KB Flash and 4 KB RAM
• Energy-saving architecture is optimized for low power with
90 nm TFS technology, clock and power gating techniques,
and zero wait state flash memory controller
MKL04ZxxVFK4
MKL04ZxxVLC4
MKL04ZxxVFM4
MKL04ZxxVLF4
24-pin QFN (FK)
32-pin QFN (FM)
4 x 4 x 1 Pitch 0.5 mm 5 x 5 x 1 Pitch 0.5 mm
32-pin LQFP (LC)
7 x 7 x 1.4 Pitch 0.8
mm
48-pin LQFP (LF)
7 x 7 x 1.4 Pitch 0.5
mm
Performance
• 48 MHz ARM
®
Cortex
®
-M0+ core
Memories and memory interfaces
• Up to 32 KB program flash memory
• Up to 4 KB SRAM
Human-machine interface
• Up to 41 general-purpose input/output (GPIO)
Communication interfaces
• One 8-bit SPI module
• One low power UART module
• One I2C module
System peripherals
• Nine low-power modes to provide power optimization
Analog Modules
based on application requirements
• 12-bit SAR ADC
• COP Software watchdog
• Analog comparator (CMP) containing a 6-bit DAC
• 4-channel DMA controller, supporting up to 63 request
and programmable reference input
sources
• Low-leakage wakeup unit
Timers
• SWD debug interface and Micro Trace Buffer
• Six channel Timer/PWM (TPM)
• Bit Manipulation Engine
• One 2-channel Timer/PWM module
• Periodic interrupt timers
Clocks
• 16-bit low-power timer (LPTMR)
• 32 kHz to 40 kHz or 3 MHz to 32 MHz crystal oscillator
• Real time clock
• Multi-purpose clock source
• 1 kHz LPO clock
Security and integrity modules
Operating Characteristics
• Voltage range: 1.71 to 3.6 V
• Flash write voltage range: 1.71 to 3.6 V
• Temperature range (ambient): -40 to 105°C
• 80-bit unique identification number per chip
Freescale reserves the right to change the detail specifications as may be required to
permit improvements in the design of its products. © 2012–2014 Freescale
Semiconductor, Inc. All rights reserved.
Ordering Information
Part Number
Flash (KB)
MKL04Z8VFK4
MKL04Z16VFK4
MKL04Z32VFK4
MKL04Z8VLC4
MKL04Z16VLC4
MKL04Z32VLC4
MKL04Z8VFM4
MKL04Z16VFM4
MKL04Z32VFM4
MKL04Z16VLF4
MKL04Z32VLF4
8
16
32
8
16
32
8
16
32
16
32
Memory
SRAM (KB)
1
2
4
1
2
4
1
2
4
2
4
22
22
22
28
28
28
28
28
28
41
41
Maximum number of I\O's
Related Resources
Type
Selector Guide
Product Brief
Reference Manual
Data Sheet
Chip Errata
Package drawing
Description
The Freescale Solution Advisor is a web-based tool that features interactive application wizards and
a dynamic product selector.
The Product Brief contains concise overview/summary information to enable quick evaluation of a
device for design suitability.
The Reference Manual contains a comprehensive description of the structure and function
(operation) of a device.
The Data Sheet includes electrical characteristics and signal connections.
The chip mask set Errata provides additional or corrective information for a particular device mask
set.
Package dimensions are provided in package drawings.
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Freescale Semiconductor, Inc.
Kinetis KL04 32 KB Flash, Rev4 03/2014.
Table of Contents
1 Ratings..................................................................................4
1.1 Thermal handling ratings...............................................4
1.2 Moisture handling ratings...............................................4
1.3 ESD handling ratings.....................................................4
1.4 Voltage and current operating ratings............................4
2 General.................................................................................5
2.1 AC electrical characteristics...........................................5
2.2 Nonswitching electrical specifications............................5
2.2.1 Voltage and current operating requirements......5
2.2.2 LVD and POR operating requirements..............6
2.2.3 Voltage and current operating behaviors...........7
2.2.4 Power mode transition operating behaviors.......8
2.2.5 Power consumption operating behaviors...........9
2.2.6 EMC performance..............................................15
2.2.7 Capacitance attributes.......................................16
2.3 Switching specifications.................................................16
2.3.1 Device clock specifications................................16
2.3.2 General switching specifications........................17
2.4 Thermal specifications...................................................17
2.4.1 Thermal operating requirements........................17
2.4.2 Thermal attributes..............................................17
3 Peripheral operating requirements and behaviors................18
3.1 Core modules................................................................18
3.1.1
SWD electricals .................................................18
3.2 System modules............................................................19
3.3 Clock modules...............................................................20
3.3.1 MCG specifications............................................20
3.3.2 Oscillator electrical specifications......................21
3.4 Memories and memory interfaces.................................23
3.4.1 Flash electrical specifications............................23
3.5 Security and integrity modules.......................................25
3.6 Analog............................................................................25
4
5
3.6.1 ADC electrical specifications..............................25
3.6.2 CMP and 6-bit DAC electrical specifications......28
3.7 Timers............................................................................30
3.8 Communication interfaces.............................................30
3.8.1 SPI switching specifications...............................30
3.8.2 Inter-Integrated Circuit Interface (I2C) timing.....34
3.8.3 UART.................................................................36
Dimensions...........................................................................36
4.1 Obtaining package dimensions......................................36
Pinout....................................................................................36
5.1 KL04 signal multiplexing and pin assignments..............36
5.2 KL04 pinouts..................................................................38
Ordering parts.......................................................................42
6.1 Determining valid orderable parts..................................42
Part identification...................................................................42
7.1 Description.....................................................................42
7.2 Format...........................................................................43
7.3 Fields.............................................................................43
7.4 Example.........................................................................43
Terminology and guidelines..................................................44
8.1 Definition: Operating requirement..................................44
8.2 Definition: Operating behavior.......................................44
8.3 Definition: Attribute........................................................44
8.4 Definition: Rating...........................................................45
8.5 Result of exceeding a rating..........................................45
8.6 Relationship between ratings and operating
requirements..................................................................45
8.7 Guidelines for ratings and operating requirements........46
8.8 Definition: Typical value.................................................46
8.9 Typical value conditions.................................................47
9 Revision history.....................................................................48
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Kinetis KL04 32 KB Flash, Rev4 03/2014.
3
Freescale Semiconductor, Inc.
Ratings
1 Ratings
1.1 Thermal handling ratings
Table 1. Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Table 2. Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Table 3. ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105 °C
Min.
–2000
–500
–100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
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Freescale Semiconductor, Inc.
Kinetis KL04 32 KB Flash, Rev4 03/2014.
General
1.4 Voltage and current operating ratings
Table 4. Voltage and current operating ratings
Symbol
V
DD
I
DD
V
IO
I
D
V
DDA
Description
Digital supply voltage
Digital supply current
IO pin input voltage
Instantaneous maximum current single pin limit (applies to
all port pins)
Analog supply voltage
Min.
–0.3
—
–0.3
–25
V
DD
– 0.3
Max.
3.8
120
V
DD
+ 0.3
25
V
DD
+ 0.3
Unit
V
mA
V
mA
V
2 General
2.1 AC electrical characteristics
Unless otherwise specified, propagation delays are measured from the 50% to the 50%
point, and rise and fall times are measured at the 20% and 80% points, as shown in the
following figure.
Figure 1. Input signal measurement reference
All digital I/O switching characteristics, unless otherwise specified, assume the output
pins have the following characteristics.
• C
L
=30 pF loads
• Slew rate disabled
• Normal drive strength
2.2 Nonswitching electrical specifications
Kinetis KL04 32 KB Flash, Rev4 03/2014.
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Freescale Semiconductor, Inc.
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