Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> SIM3L167-C-GQ

SIM3L167-C-GQ: 产品描述ARM Microcontrollers - MCU 256KB, DC-DC, 40x4 LCD, AES, TQFP80; 产品类别半导体嵌入式处理器和控制器; 文件大小2MB，共91页; 制造商Silicon Laboratories; 标准

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SIM3L167-C-GQ概述

ARM Microcontrollers - MCU 256KB, DC-DC, 40x4 LCD, AES, TQFP80

SIM3L167-C-GQ规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	Silicon Laboratories
产品种类 Product Category	ARM Microcontrollers - MCU
RoHS	Details
安装风格 Mounting Style	SMD/SMT
封装 / 箱体 Package / Case	TQFP-80
Core	ARM Cortex M3
Data Bus Width	32 bit
Maximum Clock Frequency	50 MHz
Program Memory Size	256 kB
Data RAM Size	32 kB
ADC Resolution	12 bit
Number of I/Os	62 I/O
工作电源电压 Operating Supply Voltage	3 V
最小工作温度 Minimum Operating Temperature	- 40 C
最大工作温度 Maximum Operating Temperature	+ 85 C
接口类型 Interface Type	I2C, SPI
系列 Packaging	Tray
高度 Height	1.2 mm
长度 Length	14 mm
Program Memory Type	Flash
宽度 Width	14 mm
Data RAM Type	SRAM
I/O Voltage	3 V
Moisture Sensitive	Yes
Number of ADC Channels	24
Number of Timers/Counters	3 Timer
Processor Series	SiM3L1xx
工厂包装数量 Factory Pack Quantity	119
电源电压-最大 Supply Voltage - Max	3.8 V
电源电压-最小 Supply Voltage - Min	1.98 V
单位重量 Unit Weight	0.018117 oz

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SiM3L1xx

High-Performance, Low-Power, 32-Bit Precision32™

MCU Family with up to 256 kB of Flash

32-bit ARM Cortex-M3 CPU

50 MHz maximum frequency

Single-cycle multiplication, hardware division support

Nested vectored interrupt control (NVIC) with 8 priority levels

Memory

32–256 kB flash, in-system programmable

8–32 kB SRAM with configurable low power retention

Clock Sources

Internal oscillator with PLL: 23–50 MHz

Low power internal oscillator: 20 MHz

Low frequency internal oscillator (LFO): 16.4 kHz

External real-time clock (RTC) crystal oscillator

External oscillator: Crystal, RC, C, CMOS clock

Power Management

Three adjustable low drop-out (LDO) regulators

Power-on reset circuit and brownout detectors

DC-DC buck converter allows dynamic voltage scaling for

maximum efficiency (250 mW output)

Multiple power modes supported for low power optimization

Analog Peripherals

12-Bit Analog-to-Digital Converter: Up to 250 ksps 12-bit mode

2 x Low-current comparators

or 1 Msps 10-bit mode

10-Bit Current-mode Digital-to-Analog Converter

Digital and Communication Peripherals

1 x USART with IrDA and ISO7816 Smartcard support

1 x UART that operates in low power mode

2 x SPIs, 1 x I2C, 16/32-bit CRC

128/192/256-bit Hardware AES Encryption

Encoder/Decoder: Manchester and Three-out-of-Six

Integrated LCD Controller: up to 160 segments (40x4), auto-

contrast and low power operation

Timers/Counters

3 x 32-bit or 6 x 16-bit timers with capture/compare

16-bit, 6-channel counter with capture/compare/PWM and

dead-time controller with differential outputs

16-bit low power timer/advanced capture counter operational in

the lowest power mode

32-bit real time clock (RTC) with multiple alarms

Low Power Features

75 nA typical current in Power Mode 8

Low-current RTC (180 nA from LFO, 300 nA from crystal)

4 µs wakeup, register state retention and no reset required from

140 µA/MHz at 3.6 V executing from SRAM

Specialized on-chip charge pump reduces power consumption

Process/Voltage/Temperature (PVT) Monitor

5 V Tolerant Flexible I/O

Up to 62 contiguous 5 V tolerant GPIO with one priority cross-

bar providing flexibility in pin assignments

lowest power mode

175 µA/MHz at 3.6 V executing from flash

Watchdog timer

Low power mode advanced capture counter (ACCTR)

Data Transfer Peripherals

10-Channel DMA Controller

3 Channel Data Transfer Manager manages complex DMA

transfers without core intervention

On-Chip Debugging

Serial wire debug (SWD) with serial wire viewer (SWV) or JTAG

(no boundary scan) allow debug and programming

Cortex-M3 embedded trace macrocell (ETM)

Temperature Range: –40 to +85 °C

Supply Voltage: 1.8 to 3.8 V

Power

Scalable Digital LDO

Scalable Memory LDO

Scalable Analog LDO

DC-DC Buck Converter

Low Power Mode Charge Pump

Power Management Unit

32/64/128/256 kB Flash

Package Options

QFN options: 40-pin (6 x 6 mm), 64-pin (9 x 9 mm)

TQFP options: 64-pin (10 x 10 mm), 80-pin (12 x 12 mm)

Core / Memory / Support

ARM Cortex M3 (50 MHz)

8/16/32 kB Retention

RAM

Analog Peripherals

SAR ADC

(12-bit 250 ksps / 10-bit 1 Msps)

Voltage Reference

Current-Source DAC

2 x Low Current Comparators

Advanced Capture Counter

Flexible Pin Muxing

10-Ch DMA Controller + 3x Data Transfer Mgr.

Watchdog

Supply Monitor

Serial Wire or JTAG Debug / Programming + ETM

Clocking / Oscillators

50 MHz PLL

Real-Time Clock w/ Dedicated Crystal Oscillator

16 kHz Low Frequency Oscillator

20 MHz Low Power Oscillator

External Clock (XTAL / RC / C / CMOS)

Clock Selection

and Gating

1 x I2C

Digital Peripherals

2 x SPI

AES

CRC

Priority Crossbar

Encoder

3 x 32-bit Timers (6 x 16-bit)

1 x UART, 1 x USART w/ IrDA/SmartCard

Encoder/Decoder

6-Channel PWM

Low-Power Timer

LCD Controller

Rev 1.1 11/14

62 Multi-Function 5V-Tolerant I/O Pins

SiM3L1xx

SiM3L1xx

Ta b l e o f C o n t e n ts

1. Related Documents and Conventions ...............................................................................5

1.1. Related Documents........................................................................................................5

1.1.1. SiM3L1xx Reference Manual.................................................................................5

1.1.2. Hardware Access Layer (HAL) API Description ....................................................5

1.1.3. ARM Cortex-M3 Reference Manual.......................................................................5

1.2. Conventions ...................................................................................................................5

2. Typical Connection Diagrams ............................................................................................6

2.1. Power .............................................................................................................................6

3. Electrical Specifications......................................................................................................8

3.1. Electrical Characteristics ................................................................................................8

3.2. Thermal Conditions ...................................................................................................... 30

3.3. Absolute Maximum Ratings..........................................................................................31

4. Precision32™ SiM3L1xx System Overview.....................................................................32

4.1. Power ........................................................................................................................... 34

4.1.1. DC-DC Buck Converter (DCDC0)........................................................................ 34

4.1.2. Three Low Dropout LDO Regulators (LDO0) ...................................................... 35

4.1.3. Voltage Supply Monitor (VMON0) ....................................................................... 35

4.1.4. Power Management Unit (PMU).......................................................................... 35

4.1.5. Device Power Modes........................................................................................... 35

4.1.6. Process/Voltage/Temperature Monitor (TIMER2 and PVTOSC0)....................... 38

4.2. I/O................................................................................................................................. 39

4.2.1. General Features.................................................................................................39

4.2.2. Crossbar .............................................................................................................. 39

4.3. Clocking........................................................................................................................ 40

4.3.1. PLL (PLL0)........................................................................................................... 41

4.3.2. Low Power Oscillator (LPOSC0) ......................................................................... 41

4.3.3. Low Frequency Oscillator (LFOSC0)................................................................... 41

4.3.4. External Oscillators (EXTOSC0).......................................................................... 41

4.4. Integrated LCD Controller (LCD0)................................................................................ 42

4.5. Data Peripherals...........................................................................................................43

4.5.1. 10-Channel DMA Controller................................................................................. 43

4.5.2. Data Transfer Managers (DTM0, DTM1, DTM2) ................................................. 43

4.5.3. 128/192/256-bit Hardware AES Encryption (AES0) ............................................ 43

4.5.4. 16/32-bit Enhanced CRC (ECRC0) .....................................................................44

4.5.5. Encoder / Decoder (ENCDEC0) .......................................................................... 44

4.6. Counters/Timers........................................................................................................... 45

4.6.1. 32-bit Timer (TIMER0, TIMER1, TIMER2)........................................................... 45

4.6.2. Enhanced Programmable Counter Array (EPCA0) ............................................. 45

4.6.3. Real-Time Clock (RTC0) ..................................................................................... 46

4.6.4. Low Power Timer (LPTIMER0)............................................................................46

4.6.5. Watchdog Timer (WDTIMER0)............................................................................46

4.6.6. Low Power Mode Advanced Capture Counter (ACCTR0)................................... 47

4.7. Communications Peripherals ....................................................................................... 48

4.7.1. USART (USART0) ............................................................................................... 48

Rev 1.1

SiM3L1xx

4.7.2. UART (UART0).................................................................................................... 48

4.7.3. SPI (SPI0, SPI1) .................................................................................................. 49

4.7.4. I2C (I2C0) ............................................................................................................ 49

4.8. Analog .......................................................................................................................... 50

4.8.1. 12-Bit Analog-to-Digital Converter (SARADC0)................................................... 50

4.8.2. 10-Bit Digital-to-Analog Converter (IDAC0) ......................................................... 50

4.8.3. Low Current Comparators (CMP0, CMP1) .......................................................... 50

4.9. Reset Sources..............................................................................................................51

4.10.Security ........................................................................................................................ 52

4.11.On-Chip Debugging ..................................................................................................... 52

5. Ordering Information .........................................................................................................53

6. Pin Definitions.................................................................................................................... 55

6.1. SiM3L1x7 Pin Definitions ............................................................................................. 55

6.2. SiM3L1x6 Pin Definitions ............................................................................................. 62

6.3. SiM3L1x4 Pin Definitions ............................................................................................. 69

6.4. TQFP-80 Package Specifications ................................................................................ 74

6.4.1. TQFP-80 Solder Mask Design............................................................................. 77

6.4.2. TQFP-80 Stencil Design ...................................................................................... 77

6.4.3. TQFP-80 Card Assembly..................................................................................... 77

6.5. QFN-64 Package Specifications .................................................................................. 78

6.5.1. QFN-64 Solder Mask Design............................................................................... 80

6.5.2. QFN-64 Stencil Design ........................................................................................ 80

6.5.3. QFN-64 Card Assembly....................................................................................... 80

6.6. TQFP-64 Package Specifications ................................................................................ 81

6.6.1. TQFP-64 Solder Mask Design............................................................................. 84

6.6.2. TQFP-64 Stencil Design ...................................................................................... 84

6.6.3. TQFP-64 Card Assembly..................................................................................... 84

6.7. QFN-40 Package Specifications .................................................................................. 85

6.7.1. QFN-40 Solder Mask Design............................................................................... 87

6.7.2. QFN-40 Stencil Design ........................................................................................ 87

6.7.3. QFN-40 Card Assembly....................................................................................... 87

7. Revision Specific Behavior............................................................................................... 88

7.1. Revision Identification .................................................................................................. 88

Document Change List ........................................................................................................... 90

Contact Information ................................................................................................................ 91

Rev 1.1

SIM3L167-C-GQ相似产品对比

	SIM3L167-C-GQ	SIM3L166-C-GM	SIM3L157-C-GQ	SIM3L146-C-GQ	UPMU-M3L1X-B-EK	SIM3L156-C-GQ	SIM3L146-C-GM	SIM3L166-C-GQ
描述	ARM Microcontrollers - MCU 256KB, DC-DC, 40x4 LCD, AES, TQFP80	ARM Microcontrollers - MCU 256KB, DC-DC, 32x4 LCD, AES, QFN64	ARM Microcontrollers - MCU 128KB, DC-DC, 40x4 LCD, AES, TQFP80	ARM Microcontrollers - MCU 64KB, DC-DC, 32x4 LCD, AES, QFN64	Daughter Cards & OEM Boards UDP SiM3L1xx MCU Card (no LCD)	ARM Microcontrollers - MCU 128KB, DC-DC, 32x4 LCD, AES, QFN64	ARM Microcontrollers - MCU 64KB, DC-DC, 32x4 LCD, AES, QFN64	ARM Microcontrollers - MCU 256KB, DC-DC, 32x4 LCD, AES, TQFP64
Product Attribute	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value
制造商 Manufacturer	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories	Silicon Laboratories
产品种类 Product Category	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	Daughter Cards & OEM Boards	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU
RoHS	Details	Details	Details	Details	Details	Details	Details	Details
Core	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3	ARM Cortex M3
Data Bus Width	32 bit	32 bit	32 bit	32 bit	32 bit	32 bit	32 bit	32 bit
最小工作温度 Minimum Operating Temperature	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C	- 40 C
最大工作温度 Maximum Operating Temperature	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C	+ 85 C
接口类型 Interface Type	I2C, SPI	I2C, SPI	I2C, SPI	I2C, SPI	I2C, SPI, UART	I2C, SPI, UART, USART	I2C, SPI	I2C, SPI
Moisture Sensitive	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
工厂包装数量 Factory Pack Quantity	119	260	119	160	1	160	260	160
安装风格 Mounting Style	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT	-	SMD/SMT	SMD/SMT	SMD/SMT
封装 / 箱体 Package / Case	TQFP-80	QFN-64	TQFP-80	TQFP-64	-	TQFP-64	QFN-64	TQFP-64
Maximum Clock Frequency	50 MHz	50 MHz	50 MHz	50 MHz	-	50 MHz	50 MHz	50 MHz
Program Memory Size	256 kB	256 kB	128 kB	64 kB	-	128 kB	64 kB	256 kB
Data RAM Size	32 kB	32 kB	32 kB	16 kB	-	32 kB	16 kB	32 kB
ADC Resolution	12 bit	12 bit	12 bit	12 bit	-	12 bit	12 bit	12 bit
Number of I/Os	62 I/O	51 I/O	62 I/O	51 I/O	-	-	51 I/O	51 I/O
工作电源电压 Operating Supply Voltage	3 V	3 V	3 V	3 V	-	1.25 V to 3.8 V	3 V	3 V
系列 Packaging	Tray	Tray	Tray	Tray	-	Tray	Tray	Tray
高度 Height	1.2 mm	0.9 mm	1.2 mm	1.2 mm	-	0.95 mm	0.9 mm	1.2 mm
长度 Length	14 mm	9 mm	14 mm	12 mm	-	10 mm	9 mm	12 mm
Program Memory Type	Flash	Flash	Flash	Flash	-	-	Flash	Flash
宽度 Width	14 mm	9 mm	14 mm	12 mm	-	10 mm	9 mm	12 mm
Data RAM Type	SRAM	SRAM	SRAM	SRAM	-	-	SRAM	SRAM
I/O Voltage	3 V	3 V	3 V	3 V	-	-	3 V	3 V
Number of ADC Channels	24	23	24	23	-	-	23	23
Number of Timers/Counters	3 Timer	3 Timer	3 Timer	3 Timer	-	-	3 Timer	3 Timer
Processor Series	SiM3L1xx	SiM3L1xx	SiM3L1xx	SiM3L1xx	-	SiM3L1xx	SiM3L1xx	SiM3L1xx
电源电压-最大 Supply Voltage - Max	3.8 V	3.8 V	3.8 V	3.8 V	-	3.8 V	3.8 V	3.8 V
电源电压-最小 Supply Voltage - Min	1.98 V	1.98 V	1.98 V	1.98 V	-	1.25 V	1.98 V	1.98 V
单位重量 Unit Weight	0.018117 oz	0.007277 oz	0.018117 oz	0.012720 oz	-	0.012720 oz	0.007277 oz	0.012720 oz

SIM3L167-C-GQ

SIM3L167-C-GQ在线购买

SIM3L167-C-GQ概述

SIM3L167-C-GQ规格参数

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SIM3L167-C-GQ相似产品对比

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