MCU 32-bit ARM Cortex M3 RISC 384KB Flash 2.5V/3.3V 64-Pin WLCSP T/R
参数名称 | 属性值 |
欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.31.00.01 |
Family Name | STM32F |
Instruction Set Architecture | RISC |
Device Core | ARM Cortex M3 |
Core Architecture | ARM |
Maximum CPU Frequency (MHz) | 72 |
Maximum Clock Rate (MHz) | 72 |
Data Bus Width (bit) | 32 |
Program Memory Type | Flash |
Program Memory Size | 384KB |
RAM Size | 64KB |
Maximum Expanded Memory Size | 4GB |
Programmability | Yes |
接口类型 Interface Type | CAN/I2C/SPI/USART/USB |
Number of I/Os | 51 |
No. of Timers | 8 |
PWM | 2 |
Number of ADCs | Triple |
ADC Channels | 16/16/16 |
ADC Resolution (bit) | 12/12/12 |
Number of DACs | Dual |
DAC Channels | 2/2 |
DAC Resolution (bit) | 12/12 |
USART | 5 |
UART | 0 |
USB | 1 |
SPI | 3 |
I2C | 2 |
I2S | 0 |
CAN | 1 |
Ethernet | 0 |
Watchdog | 2 |
Parallel Master Port | No |
Special Features | CAN Controller |
Minimum Operating Supply Voltage (V) | 2 |
Typical Operating Supply Voltage (V) | 2.5|3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Maximum Power Dissipation (mW) | 400 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
系列 Packaging | Tape and Reel |
Supplier Package | WLCSP |
Pin Count | 64 |
Standard Package Name | BGA |
Mounting | Surface Mount |
Package Height | 0.36 |
Package Length | 4.47 |
Package Width | 4.4 |
PCB changed | 64 |
Lead Shape | Ball |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved