RF Receiver 315MHz/434MHz Superheterodyne Rcvr
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, |
| 针数 | 32 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 商用集成电路类型 | CONSUMER CIRCUIT |
| JESD-30 代码 | S-XQCC-N32 |
| JESD-609代码 | e3 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 5 mm |
| MAX1473ETJ+T | MAX1473EUI-V- | MAX1473EUI-G05 | MAX1473EUI/V+T | MAX1473EUI-T | MAX1473ETJ+ | |
|---|---|---|---|---|---|---|
| 描述 | RF Receiver 315MHz/434MHz Superheterodyne Rcvr | RF Receiver 315MHz/434MHz Superheterodyne Rcvr | RF Receiver 315MHz/434MHz Superheterodyne Rcvr | RF Receiver 315MHz/434MHz Superheterodyne Rcvr | RF Receiver 315MHz/433MHz ASK Superheterodyne Receiver with Extended Dynamic Range | RF Receiver 315MHz/434MHz Superheterodyne Rcvr |
| 是否无铅 | 不含铅 | - | 含铅 | - | 含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | 不符合 | 符合 | 不符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 包装说明 | HVQCCN, | - | TSSOP, | TSSOP, TSSOP28,.25 | 4.40 MM, TSSOP-28 | HVQCCN, |
| Reach Compliance Code | compliant | - | compliant | compliant | not_compliant | compliant |
| 商用集成电路类型 | CONSUMER CIRCUIT | - | CONSUMER CIRCUIT | - | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
| JESD-30 代码 | S-XQCC-N32 | - | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | S-XQCC-N32 |
| 长度 | 5 mm | - | 9.7 mm | - | 9.7 mm | 5 mm |
| 功能数量 | 1 | - | 1 | - | 1 | 1 |
| 端子数量 | 32 | - | 28 | 28 | 28 | 32 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | HVQCCN | - | TSSOP | TSSOP | TSSOP | HVQCCN |
| 封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | - | NOT SPECIFIED | - | 240 | 260 |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | 1.1 mm | - | 1.1 mm | 0.8 mm |
| 最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | - | 3 V | - | 3 V | 3 V |
| 表面贴装 | YES | - | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | - | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | - | 0.65 mm | 0.635 mm | 0.65 mm | 0.5 mm |
| 端子位置 | QUAD | - | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | - | NOT SPECIFIED | - | 20 | 30 |
| 宽度 | 5 mm | - | 4.4 mm | - | 4.4 mm | 5 mm |
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