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89HPES3T3ZBBC

产品描述PCI Interface IC PCI EXPRESS SWITCH
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小330KB,共31页
制造商IDT (Integrated Device Technology)
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89HPES3T3ZBBC概述

PCI Interface IC PCI EXPRESS SWITCH

89HPES3T3ZBBC规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码CABGA
包装说明13 X 13 MM, CABGA-144
针数144
制造商包装代码BC144
Reach Compliance Codenot_compliant
ECCN代码EAR99
地址总线宽度
总线兼容性PCI
最大时钟频率100 MHz
外部数据总线宽度
JESD-30 代码S-PBGA-B144
JESD-609代码e0
长度13 mm
湿度敏感等级3
端子数量144
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA144,12X12,40
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)225
电源1,3.3 V
认证状态Not Qualified
座面最大高度1.5 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度13 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI

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3-Lane 3-Port
PCI Express® Switch
®
89HPES3T3
Data Sheet
The 89HPES3T3 is a member of IDT’s PRECISE™ family of PCI
Express switching solutions. The PES3T3 is a 3-lane, 3-port peripheral
chip that performs PCI Express Base switching. It provides connectivity
and switching functions between a PCI Express upstream port and up to
four downstream ports and supports switching between downstream
ports.
Device Overview
u
u
Features
u
u
u
High Performance PCI Express Switch
– Three 2.5Gbps PCI Express lanes
– Three switch ports
– x1 Upstream port
– Two x1 Downstream ports
– Low latency cut-through switch architecture
– Support for Max payload sizes up to 256 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion on all lanes
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
u
u
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates three 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Power Management
– Utilizes advanced low-power design techniques to achieve low
typical power consumption
– Supports PCI Power Management Interface specification (PCI-
PM 1.2)
– Unused SerDes are disabled.
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in Pseudo-Random Bit Stream (PRBS) generator
– Numerous SerDes test modes
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
Block Diagram
3-Port Switch Core / 3 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
Figure 1 Internal Block Diagram
(Port 3)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 31
2014 Integrated Device Technology, Inc.
June 12, 2014

89HPES3T3ZBBC相似产品对比

89HPES3T3ZBBC 89HPES3T3ZBBCGI8 89HPES3T3ZBBCG8 89HPES3T3ZBBCGI 89HPES3T3ZBBC8 89HPES3T3ZBNQG8 89HPES3T3ZBBCI
描述 PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 不含铅 不含铅 不含铅 含铅 不含铅 含铅
是否Rohs认证 不符合 符合 符合 符合 不符合 符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 CABGA CABGA CABGA CABGA CABGA VFQFPN CABGA
包装说明 13 X 13 MM, CABGA-144 LBGA, BGA144,12X12,40 CABGA-144 13 X 13 MM, GREEN, CABGA-144 CABGA-144 QFN-132 13 X 13 MM, CABGA-144
针数 144 144 144 144 144 132 144
制造商包装代码 BC144 BCG144 BCG144 BCG144 BC144 NQG132 BC144
Reach Compliance Code not_compliant compliant compliant compliant not_compliant compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
总线兼容性 PCI PCI; SMBUS PCI; SMBUS PCI PCI; SMBUS PCI; SMBUS PCI
JESD-30 代码 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-XQCC-N132 S-PBGA-B144
JESD-609代码 e0 e1 e1 e1 e0 e3 e0
长度 13 mm 13 mm 13 mm 13 mm 13 mm 10 mm 13 mm
湿度敏感等级 3 3 3 3 3 3 3
端子数量 144 144 144 144 144 132 144
最高工作温度 70 °C 85 °C 70 °C 85 °C 70 °C 70 °C 85 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY
封装代码 LBGA LBGA LBGA LBGA LBGA HVQCCN LBGA
封装等效代码 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 LGA132,20X20,20 BGA144,12X12,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度) 225 260 260 260 225 260 225
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm 0.9 mm 1.5 mm
最大供电电压 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Matte Tin (Sn) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL BALL NO LEAD BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 0.65 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM QUAD BOTTOM
处于峰值回流温度下的最长时间 20 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED 20
宽度 13 mm 13 mm 13 mm 13 mm 13 mm 10 mm 13 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches - 1 - 1 - 1 1
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