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7014S20JI

产品描述SRAM 4K x 9 Dual-Port RAM
产品类别存储    存储   
文件大小92KB,共11页
制造商IDT (Integrated Device Technology)
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7014S20JI概述

SRAM 4K x 9 Dual-Port RAM

7014S20JI规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码PLCC
包装说明0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
针数52
制造商包装代码PL52
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间20 ns
I/O 类型COMMON
JESD-30 代码S-PQCC-J52
JESD-609代码e0
长度19.1262 mm
内存密度36864 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度9
湿度敏感等级1
功能数量1
端口数量2
端子数量52
字数4096 words
字数代码4000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织4KX9
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码QCCJ
封装等效代码LDCC52,.8SQ
封装形状SQUARE
封装形式CHIP CARRIER
并行/串行PARALLEL
峰值回流温度(摄氏度)225
电源5 V
认证状态Not Qualified
座面最大高度4.572 mm
最大压摆率0.26 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式J BEND
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度19.1262 mm
Base Number Matches1

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HIGH-SPEED
4K x 9DUAL-PORT
STATIC RAM
Features:
IDT7014S
LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018
True Dual-Ported memory cells which allow simultaneous
reads of the same memory location
High-speed access
– Commercial: 12/15/20/25ns (max.)
– Industrial: 20ns (max.)
Standard-power operation
– IDT7014S
Active: 750mW (typ.)
Fully asynchronous operation from either port
TTL-compatible; single 5V (±10%) power supply
Available in 52-pin PLCC and a 64-pin TQFP
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
The IDT7014 is a high-speed 4K x 9 Dual-Port Static RAM designed
to be used in systems where on-chip hardware port arbitration is not
needed. This part lends itself to high-speed applications which do not rely
on BUSY signals to manage simultaneous access.
The IDT7014 provides two independent ports with separate control,
address, and I/O pins that permit independent, asynchronous access for
reads or writes to any location in memory. See functional description.
The IDT7014 utilitizes a 9-bit wide data path to allow for parity at the
user's option. This feature is especially useful in data communication
applications where it is necessary to use a parity bit for transmission/
reception error checking.
Fabricated using a high-performance technology, these Dual-Ports
typically operate on only 750mW of power at maximum access times as
fast as 12ns.
The IDT7014 is packaged in a 52-pin PLCC and a 64-pin thin quad
flatpack, (TQFP).
Description:
Functional Block Diagram
R/W
L
R/W
R
OE
L
I/O
0L
- I/O
8L
I/O
CONTROL
I/O
CONTROL
OE
R
I/O
0R
- I/O
8R
A
0L
- A
11L
ADDRESS
DECODER
MEMORY
ARRAY
ADDRESS
DECODER
A
0R
- A
11R
2528 drw 01
OCTOBER 2017
1
©2017 Integrated Device Technology, Inc.
DSC 2528/19

7014S20JI相似产品对比

7014S20JI 7014S15J 7014S20JI8 7014S12JG 7014S20J 7014S20PFI 7014S25J8
描述 SRAM 4K x 9 Dual-Port RAM SRAM 4KX9 DUAL PORT SRAM SRAM 4K x 9 Dual-Port RAM SRAM 4KX9 SYNC DUAL PORT SRAM 4KX9 DUAL PORT SRAM SRAM 4K x 9 Dual-Port RAM SRAM 4KX9 DUAL PORT SRAM
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 含铅 含铅 不含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 PLCC PLCC PLCC PLCC PLCC TQFP PLCC
包装说明 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 QCCJ, LDCC52,.8SQ 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
针数 52 52 52 52 52 64 52
制造商包装代码 PL52 PL52 PL52 PLG52 PL52 PN64 PL52
Reach Compliance Code not_compliant not_compliant not_compliant compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 20 ns 15 ns 20 ns 12 ns 20 ns 20 ns 25 ns
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 S-PQCC-J52 S-PQCC-J52 S-PQCC-J52 S-PQCC-J52 S-PQCC-J52 S-PQFP-G64 S-PQCC-J52
JESD-609代码 e0 e0 e0 e3 e0 e0 e0
长度 19.1262 mm 19.1262 mm 19.1262 mm 19.1262 mm 19.1262 mm 14 mm 19.1262 mm
内存密度 36864 bit 36864 bit 36864 bit 36864 bit 36864 bit 36864 bit 36864 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 9 9 9 9 9 9 9
湿度敏感等级 1 3 1 1 3 3 3
功能数量 1 1 1 1 1 1 1
端口数量 2 2 2 2 2 2 2
端子数量 52 52 52 52 52 64 52
字数 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words 4096 words
字数代码 4000 4000 4000 4000 4000 4000 4000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS ASYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 70 °C 85 °C 70 °C 70 °C 85 °C 70 °C
组织 4KX9 4KX9 4KX9 4KX9 4KX9 4KX9 4KX9
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QCCJ QCCJ QCCJ QCCJ QCCJ LQFP QCCJ
封装等效代码 LDCC52,.8SQ LDCC52,.8SQ LDCC52,.8SQ LDCC52,.8SQ LDCC52,.8SQ QFP64,.66SQ,32 LDCC52,.8SQ
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER FLATPACK, LOW PROFILE CHIP CARRIER
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 225 260 225 240 225
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 4.572 mm 4.572 mm 4.572 mm 4.57 mm 4.572 mm 1.6 mm 4.572 mm
最大压摆率 0.26 mA 0.25 mA 0.26 mA 0.25 mA 0.245 mA 0.26 mA 0.24 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 J BEND J BEND J BEND J BEND J BEND GULL WING J BEND
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 0.8 mm 1.27 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 20 NOT SPECIFIED
宽度 19.1262 mm 19.1262 mm 19.1262 mm 19.1262 mm 19.1262 mm 14 mm 19.1262 mm
Base Number Matches 1 - 1 1 - 1 1

 
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