Processors - Application Specialized MCIMX6X3EVN10AB/LFBGA400///STANDARD MARKING * TRAY
| 参数名称 | 属性值 |
| Brand Name | Freescale |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| Reach Compliance Code | compliant |
| MCIMX6X3EVN10AB | MCIMX6X3EVK10AB | MCIMX6X1EVK10AB | MCIMX6X4EVM10AB | MCIMX6X3EVO10AB | |
|---|---|---|---|---|---|
| 描述 | Processors - Application Specialized MCIMX6X3EVN10AB/LFBGA400///STANDARD MARKING * TRAY | Processors - Application Specialized i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 800MHz, ARM Cortex-M4 core, 166MHz, BGA 400 | Processors - Application Specialized i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 800MHz, ARM Cortex-M4 core, 166MHz, BGA 400 | Processors - Application Specialized MCIMX6X4EVM10AB/LFBGA529///STANDARD MARKING * TRAY | Processors - Application Specialized MCIMX6X3EVO10AB/LFBGA400///STANDARD MARKING * TRAY |
| Brand Name | Freescale | Freescale | Freescale | Freescale | Freescale |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| 包装说明 | - | LFBGA, | LFBGA, | LFBGA, | - |
| 其他特性 | - | 24MHZ NOMINAL FREQ AVAILABLE | 24MHZ NOMINAL FREQ AVAILABLE | 24MHZ NOMINAL FREQ AVAILABLE | - |
| JESD-30 代码 | - | S-PBGA-B400 | S-PBGA-B400 | S-PBGA-B529 | - |
| JESD-609代码 | - | e1 | e1 | e1 | - |
| 长度 | - | 14 mm | 14 mm | 19 mm | - |
| 湿度敏感等级 | - | 3 | 3 | 3 | - |
| 端子数量 | - | 400 | 400 | 529 | - |
| 最高工作温度 | - | 105 °C | 105 °C | 105 °C | - |
| 最低工作温度 | - | -20 °C | -20 °C | -20 °C | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | LFBGA | LFBGA | LFBGA | - |
| 封装形状 | - | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | - |
| 座面最大高度 | - | 1.3 mm | 1.3 mm | 1.5 mm | - |
| 最大供电电压 | - | 1.5 V | 1.5 V | 1.5 V | - |
| 最小供电电压 | - | 1.35 V | 1.35 V | 1.35 V | - |
| 表面贴装 | - | YES | YES | YES | - |
| 技术 | - | CMOS | CMOS | CMOS | - |
| 温度等级 | - | OTHER | OTHER | OTHER | - |
| 端子面层 | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - |
| 端子形式 | - | BALL | BALL | BALL | - |
| 端子节距 | - | 0.8 mm | 0.8 mm | 0.8 mm | - |
| 端子位置 | - | BOTTOM | BOTTOM | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | - | 40 | 40 | 40 | - |
| 宽度 | - | 14 mm | 14 mm | 19 mm | - |
| uPs/uCs/外围集成电路类型 | - | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | - |
| Base Number Matches | - | 1 | 1 | 1 | - |
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