High Speed Operational Amplifiers Dual Hi Perf VTG Feedback 325MHz
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, TSSOP8,.19 |
| 针数 | 8 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 2.5 µA |
| 25C 时的最大偏置电流 (IIB) | 2.5 µA |
| 标称共模抑制比 | 60 dB |
| 频率补偿 | YES |
| 最大输入失调电压 | 5000 µV |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 低-偏置 | NO |
| 低-失调 | NO |
| 微功率 | NO |
| 湿度敏感等级 | 1 |
| 负供电电压上限 | -6.3 V |
| 标称负供电电压 (Vsup) | -5 V |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 240 |
| 功率 | NO |
| 电源 | 5/+-5 V |
| 可编程功率 | NO |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 标称压摆率 | 1150 V/us |
| 最大压摆率 | 15 mA |
| 供电电压上限 | 6.3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 最小电压增益 | 180 |
| 宽带 | YES |
| 宽度 | 3 mm |
| AD8058ARM-REEL7 | AD8057AR-REEL | AD8057AR-EBZ | AD8057AR | AD8057AR-REEL7 | AD8057ART-REEL7 | |
|---|---|---|---|---|---|---|
| 描述 | High Speed Operational Amplifiers Dual Hi Perf VTG Feedback 325MHz | High Speed Operational Amplifiers SGL Hi Perf VTG Feedback 325MHz | Amplifier IC Development Tools AD8057 Eval Brd | High Speed Operational Amplifiers SGL Hi Perf VTG Feedback 325MHz | High Speed Operational Amplifiers SGL Hi Perf VTG Feedback 325MHz | High Speed Operational Amplifiers SGL Hi Perf VTG Feedback 325MHz |
| 是否无铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | TSSOP | SOIC | - | SOIC | SOIC | SOT-23 |
| 包装说明 | TSSOP, TSSOP8,.19 | MS-012AA, SOIC-8 | - | MS-012AA, SOIC-8 | MS-012AA, SOIC-8 | LSSOP, TSOP5/6,.11,37 |
| 针数 | 8 | 8 | - | 8 | 8 | 5 |
| Reach Compliance Code | not_compliant | not_compliant | - | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 2.5 µA | 2.5 µA | - | 2.5 µA | 2.5 µA | 2.5 µA |
| 25C 时的最大偏置电流 (IIB) | 2.5 µA | 2.5 µA | - | 2.5 µA | 2.5 µA | 2.5 µA |
| 标称共模抑制比 | 60 dB | 60 dB | - | 60 dB | 60 dB | 60 dB |
| 频率补偿 | YES | YES | - | YES | YES | YES |
| 最大输入失调电压 | 5000 µV | 5000 µV | - | 5000 µV | 5000 µV | 5000 µV |
| JESD-30 代码 | S-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G5 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 |
| 长度 | 3 mm | 4.9 mm | - | 4.9 mm | 4.9 mm | 2.9 mm |
| 低-偏置 | NO | NO | - | NO | NO | NO |
| 低-失调 | NO | NO | - | NO | NO | NO |
| 微功率 | NO | NO | - | NO | NO | NO |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 |
| 负供电电压上限 | -6.3 V | -6.3 V | - | -6.3 V | -6.3 V | -6.3 V |
| 标称负供电电压 (Vsup) | -5 V | -5 V | - | -5 V | -5 V | -5 V |
| 功能数量 | 2 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | - | 8 | 8 | 5 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | - | SOP | SOP | LSSOP |
| 封装等效代码 | TSSOP8,.19 | SOP8,.25 | - | SOP8,.25 | SOP8,.25 | TSOP5/6,.11,37 |
| 封装形状 | SQUARE | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | - | - | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 240 | 240 | - | 240 | 240 | 240 |
| 功率 | NO | NO | - | NO | NO | NO |
| 电源 | 5/+-5 V | 5/+-5 V | - | 5/+-5 V | 5/+-5 V | 5/+-5 V |
| 可编程功率 | NO | NO | - | NO | NO | NO |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.75 mm | - | 1.75 mm | 1.75 mm | 1.45 mm |
| 标称压摆率 | 1150 V/us | 1150 V/us | - | 1150 V/us | 1150 V/us | 1150 V/us |
| 最大压摆率 | 15 mA | 7.5 mA | - | 7.5 mA | 7.5 mA | 7.5 mA |
| 供电电压上限 | 6.3 V | 6.3 V | - | 6.3 V | 6.3 V | 6.3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | YES | YES | YES |
| 技术 | BIPOLAR | BIPOLAR | - | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 0.95 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | 30 | 30 |
| 最小电压增益 | 180 | 310 | - | 310 | 310 | 310 |
| 宽带 | YES | YES | - | YES | YES | YES |
| 宽度 | 3 mm | 3.9 mm | - | 3.9 mm | 3.9 mm | 1.6 mm |
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