1 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.10 Vrms, 0.0 Adc
2 Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating
is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat
generating components will affect the temperature rise. It is recommended the part temperature not exceed
+125
°C under worst case operating conditions verified in the end application.
4 Isat: Peak current for approximately 20% rolloff at +25 °C.
5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L *
ΔI
: (Gauss), K: (K-factor
from table), L: (inductance in
μH), ΔI
(peak-to-peak ripple current in amps).
6 Part Number Definition: HCP0704-xxx-R
• HCP0704 = Product code and size
• xxx= Inductance value in
μH,
R = decimal point. If no “R” is present, then third
character = # of zeros
• “-R” suffix = RoHS compliant
Dimensions (mm)
T op V iew
S ide V iew
H C P 0704-R 40 to 1R 0= 4.20 m ax
H C P 0704-1R 8 to 4R 7= 4.00 m ax
B ottom V iew
H C P 0704-R 40 to 2R 3= 1.20 +/- 0.2
H C P 0704-3R 3 to 4R 7= 1.00 +/- 0.2
R ecom m ended P ad Layout
7.60
2.50(2x)
S chem atic
6.80 M ax
3.3±0.3
H C P0704
xxx
1
w w llyy R
2
2
1
4.00(2x)
6.80 M ax
1
2
The nominal DCR test point is in the middle of the terminal
xxx = Inductance value in
μH.
(R = Decimal point). If no “R” is present, then last character is # of zeros
Part Marking: HCP0704
wwllyy = Date code
R = Revision level
Do not route traces or vias underneath the inductor
Packaging information
(mm)
Supplied in tape and reel packaging, 1000 parts per 13” diameter reel.
1.5 Dia
min.
4.0
2.0
1.5 Dia.
+0.1/-0.0
A
1.75
Section A-A
1
7.5
7.50
HCP0704
xxx
wwllyy R
16.0
±0.3
2
HCP0704-R40 to 1R0= 4.2
HCP0704-1R8 to 4R7= 4.0
6.9
12.0
A
User direction of feed
2
www.eaton.com/electronics
HCP0704
High current power inductors
Technical Data
4348
Effective
July
2017
Temperature rise vs. total loss
60
50
Te mpe ta ture R is e (°C)
40
30
20
10
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Tota l Los s (W)
Core loss vs. Bp-p
5 0 0 kHz
1 MHz
1 0 0 kHz
10
2 5 0 kHz
C ore L os s ( W )
1
0. 1
0. 01
0. 001
10
100
1000
10000
B p-p ( G aus s )
www.eaton.com/electronics
3
Technical Data
4348
Effective
July
2017
HCP0704
High current power inductors
Inductance characteristics
% o f O C L v s % o f I sat
100%
80%
25°C
% o f O CL
60%
40%
20%
0%
0%
20%
40%
60%
80%
100%
120%
140%
160%
% o f I sat
4
www.eaton.com/electronics
HCP0704
High current power inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Technical Data
4348
Effective
July
2017
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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