电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-B0202AA-00-3001-D

产品描述Resistor Networks & Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics
下载文档 详细参数 全文预览

WBC-B0202AA-00-3001-D在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-B0202AA-00-3001-D - - 点击查看 点击购买

WBC-B0202AA-00-3001-D概述

Resistor Networks & Arrays

WBC-B0202AA-00-3001-D规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
Resistor Networks & Arrays

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
基于BA3121解决音频信号地噪声的经验
分享一个实际项目中遇到的一个音频问题。 在嵌入式产品、机器人等设计中,音频功放设计有时候必不可少,我们对音频的要求不高,只要音量足够,声音听起来更干净,清晰,没有噪音即可,毕竟 ......
fish001 模拟与混合信号
尝一下DE1-SoC—HPS--FPGA
尝一下DE1-SoC—HPS--FPGA static/image/hrline/4.gifhttps://dl2.eeworld.com.cn/bbs/static/image/hrline/4.gif 关键词:Cyclone V 、5CSEMA5、 DE1-SoC 学习DE1-SoC也有三个 ......
574433742 FPGA/CPLD
MYD-AM335X_J 开发板上面的pmic按键能不能改成重启的功能
MYD-AM335X_J 开发板上面的pmic按键能不能改成重启的功能 ...
susu DSP 与 ARM 处理器
evc 下用一个sdk编写了 建立了一个 对话框工程,卸载这个sdk,安装另外一个sdk后,此程序 能直接编译通过吗
evc 下用一个sdk编写了 建立了一个 对话框工程,卸载这个sdk,安装另外一个sdk后,此程序 能直接编译通过吗? 应该如何处理理? 不会是 在后一个sdk下 重新建立一个工程,用原来那个sdk建立的 ......
johnners 嵌入式系统
ESP32S3 ubuntu+vscode环境搭建及使用内部USB-JTAG(builtin)调试程序
(一)环境搭建 ESP32系列开发环境部署难度一直为人所诟病,首当其冲的是C站上各种各样的坑人教程,其中大部分是抄袭极其老旧的教程,已经跟不上ESP系列库快速的发展步伐。 要论哪里有靠 ......
tinnu DigiKey得捷技术专区
TFT可采用液态硅旋转涂布工艺生产
精工爱普生公司(Seiko Epson)与JSR公司共同开发了一种采用液态涂布和喷墨成形工艺的硅薄膜。这种硅薄膜是一种低温多晶硅TFT(薄膜晶体管),其性能可与采用传统CVD(化学气相沉积)方法生产的 ......
leslie PCB设计

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 393  2502  229  2857  2377  48  27  33  37  13 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved