电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-R0202AS-01-7321-B

产品描述Resistor Networks & Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics
下载文档 详细参数 全文预览

WBC-R0202AS-01-7321-B在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-R0202AS-01-7321-B - - 点击查看 点击购买

WBC-R0202AS-01-7321-B概述

Resistor Networks & Arrays

WBC-R0202AS-01-7321-B规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
Resistor Networks & Arrays

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
汽车电子实用资料合辑,限时免积分下载
当前,中国汽车产业正处于高速增长期,消费者对车量的要求也在日益增高,如汽车安全性、娱乐性、舒适性等,有此为汽车电子技术带来了广阔的应用市场。 本文集收录了一批汽车电子相关资料 ......
arui1999 下载中心专版
分析一下到底是上升沿还是下降沿读写数据
在看芯片pdf文档的时候总是容易被迷糊,总结一下,通过看时序图了解到底是上升沿还是下降沿读写数据! 首先必须明白的几个术语: 1.Read和Write:Read和Write均是指MCU的读和写。 2.Ou ......
Aguilera 微控制器 MCU
container_of()宏
container_of()宏 在学习Linux驱动的过程中,遇到一个宏叫做container_of。该宏定义在include/linux/kernel.h中,首先来贴出它的代码:/*** container_of - cast a member of a str ......
zhouning201 Linux开发
Visual Studio2005 与Wince6.0的问题
Error: C:\WINCE600\public\common\oak\lib\ARMV4Ietail\ppp2app.res : fatal error LNK1123: failure during conversion to COFF: file invalid or corrupt 出现的现象:CVTRES.exe 访问 ......
jiaojiao0626 嵌入式系统
让人崩溃的Californium (Cf) CoAP framework ,总算解决,可以调试
本帖最后由 dan158185 于 2015-12-7 01:34 编辑 前面的帖子和视频已经讨论过了使用CoAP协议(CC2538/CC2530 6LOWPAN/ZIGBEE)的意义,也确实实际例程测试过了; 但是使用的时libcoap这种she ......
dan158185 无线连接
关于在CCS v5下MSP-FET430UIF Debugger 固件升级
可以从如下链接找到FET固件的相关说明: http://processors.wiki.ti.com/index.php/MSP_Debug_Stack 关于升级固件的软件在附件中。在升级固件的过程中,需要对FET仿真器进行一次插拔,在我 ......
hansonhe 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2715  2252  1928  373  1700  5  29  30  11  7 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved