电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-B0202AA-00-1151-C

产品描述Resistor Networks & Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics
下载文档 详细参数 全文预览

WBC-B0202AA-00-1151-C在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-B0202AA-00-1151-C - - 点击查看 点击购买

WBC-B0202AA-00-1151-C概述

Resistor Networks & Arrays

WBC-B0202AA-00-1151-C规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics
产品种类
Product Category
Resistor Networks & Arrays

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
cc1100的发射和接受都有问题
发射貌似没有问题。但是接受问题很大。。。。。。。。。那位高手能不能发个参考程序给我看看。。。万分感激、、。。 330159656@qq.com 再次谢谢...
cy330206 无线连接
msp430g2553的串口发送程序
#include #include #include #define uint unsigned int#define LCD_EN_PORT P1OUT //以下2个要设为同一个口#define LCD_EN_DDR P1DIR#define LCD_RS_PORT P1OUT //以下2个要设为同一个口 ......
fish001 微控制器 MCU
工程师带你嵌入式linux入门
ARM+LINUX路线,主攻嵌入式Linux操作系统及其上应用软件开发目标: (1) 掌握主流嵌入式微处理器的结构与原理(初步定为arm9) (2) 必须掌握一个嵌入式操作系统 (初步定为uclinux或linu ......
edu1182016 Linux开发
普通贴片叠层电感可以用作DC-DC升压电路的芯片电感吗?
如题所示,准备在之前做过的东西上加上电源与DC-DC升压供电电路。采用3V锂电池,用TI的DC-DC升压芯片TPS61097A-3.3给CC2541蓝牙单片机3.3V供电,根据芯片的DataSheet及建议电路图选了几个自认为 ......
zouke8036914 PCB设计
BMI160测试
BMI160是博世的6轴陀螺仪传感器,它的体积小,灵敏度高,支持I2C或SPI接口。 https://ae-bst.resource.bosch.com/media/_tech/bilder/products/motion/inertial/bmi160/material_10/02sensor ......
dcexpert DIY/开源硬件专区
关于MSP430 launchpad串口的问题???
对比了一下,以上3个版本的MSP-EXP430G2,发现有些地方有所改动。不过有一点不太明白,就是关于串口的问题: G2553是自带USCI是可以实现串口通行的,我运行串口例程的时候,却发现USCI实现的串 ......
wzjhuohua 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 751  1919  1034  1829  857  59  23  11  44  49 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved