• Supplied in tape and reel packaging, 700 parts per 13” diameter reel
Product Specifications
OCL
Part Number
HCF1007-R30-R
HCF1007-R42-R
HCF1007-R56-R
HCF1007-R68-R
HCF1007-1R0-R
HCF1007-1R5-R
HCF1007-2R2-R
HCF1007-3R3-R
HCF1007-4R7-R
HCF1007-5R6-R
HCF1007-6R8-R
HCF1007-100-R
7
1
FLL
2
µH ± 20%
0.30
0.42
0.56
0.68
1.0
1.5
2.2
3.3
4.7
5.6
6.8
10.0
Min (µH)
0.21
0.30
0.40
0.49
0.72
1.08
1.57
2.37
3.38
4.03
4.90
7.20
Irms
3
Amps
30
26
26
26
16
13
10.7
10
9.4
9.4
9.4
9.4
Isat1
4
Amps @25°C
48
45
36
29
26
22
18
14.5
12
9.4
7.8
5.3
Isat2
5
Amps @125°C
35
36
28
23
21
17
14
11
8.9
7.5
6.1
4.2
DCR mΩ
@20°C
0.90±10%
1.30±7%
1.30±7%
1.30±7%
2.65±6%
4.15±6%
6.35±6%
7.50±6%
8.65±6%
8.65±6%
8.65±6%
8.65±6%
K-factor
6
279.9
186.6
186.6
186.6
139.9
112.0
93.30
79.97
69.97
69.97
69.97
69.97
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in the
end application.
4 Isat1: Peak current for approximately 20% rolloff at +25°C.
5 Isat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L *
ΔI.
Bp-p:(Gauss), K:
(K-factor from table), L: (Inductance in
μH), ΔI
(peak-to-peak ripple current in amps).
7 Part Number Definition:HCF1007-xxx-R
• HCF1007 = Product code and size
• xxx= Inductance value in
μH,
R = decimal point.
If no “R” is present then third character =# of zeros
• -R suffix = RoHS compliant
0910
BU-SB10928
Page 1 of 4
Data Sheet 4361
Dimensions - mm
T o p V iew
7.8
± 0.3
S id e V iew
6 .6 5
m ax
1.3
± 0.3
2.4
± 0.3
1 .8 0
re f
B o tto m V iew
2.3
± 0.3
2
R e co m m ended P ad Layout
Test DCR at
the bend points
3.0
2
2.0
2.9
S ch e m atic
1 0 .10
± 0.2
1
H C F 1007
XXX
w w llyy R
2
1
6.0
± 0.5
1
8 .6 0 3 .6 1
1
2
3.6
4.2
± 0.5
Part Marking: Coiltronics logo
HCF1007
xxx = Inductance value in
μH.
(R = Decimal point). If no “R” is present, then last character is # of zeros
yyllww = Date code
R = Revision level
Packaging Information - mm
1.5 dia
2.0
4.0
1.5 dia
A
1.75
11.5
1
HCF1007
XXX
wwllyy R
10.50
24.0
± 0.3
2
6.70
8.20
12.0
A
User direction of feed
S ection A -A
Supplied in tape-and-reel packaging, 700 parts per reel, 13” diameter reel.
Temperature Rise vs. Total Loss
60
50
T em p eratu re R ise (°C )
40
30
20
10
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
T o tal L o ss (W )
0910
BU-SB10928
Page 2 of 4
Data Sheet 4361
Core Loss
10
C o re L o s s v s . B p -p
1M H z
500kH z
300kH z
200kH z
1
100kH z
C o re L o ss(W )
0.1
0.01
0.001
0.0001
0.00001
100
1000
10000
B
p -p
(G au ss)
Inductance Characteristics
% o f O C L vs. % o f I
sat
1
100%
80%
-40°C
% o f O CL
60%
+25°C
40%
+125
20%
0%
0%
20%
40%
60%
80%
100%
120%
140%
160%
% o f I
sat
1
0910
BU-SB10928
Page 2 of 4
Data Sheet 4361
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
T
smin
t
s
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Time
Volume
mm
3
<350
260°C
260°C
250°C
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Reference JDEC J-STD-020D
Profile Feature
Preheat
and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
6°C/ Second
Max.
6
Minutes Max.
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
3°C/
Second
Max.
217°C
60-150 Seconds
Table 2
30
Seconds**
6°C/ Second
Max.
8 Minutes Max.
*
Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
**
Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
我最近在《华尔街日报》看到一篇题为“我们需要能维修自己的电子小玩意儿的权利(We need the right to repair our gadgets)”的文章(参考原文：)，作者对于众多电子产品看来是“有计画的废弃(planned obsolescence)”之现象非常愤怒，认为大众应该要求电子产品可以被维修。 但实际的情况是，举例来说，家家都有的电视机如果故障了，修理费用可能...[详细]
创意市集
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
