电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CM453232-R10ML

产品描述Fixed Inductors .1uH 20% Wirewound
产品类别无源元件    电感器   
文件大小308KB,共3页
制造商Bourns
官网地址http://www.bourns.com
标准
下载文档 详细参数 全文预览

CM453232-R10ML在线购买

供应商 器件名称 价格 最低购买 库存  
CM453232-R10ML - - 点击查看 点击购买

CM453232-R10ML概述

Fixed Inductors .1uH 20% Wirewound

CM453232-R10ML规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明1812
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time12 weeks
Is SamacsysN
大小写代码1812
构造Rectangular
型芯材料FERRITE
直流电阻0.18 Ω
标称电感 (L)0.1 µH
电感器应用RF INDUCTOR
电感器类型GENERAL PURPOSE INDUCTOR
JESD-609代码e3
功能数量1
端子数量2
最高工作温度100 °C
最低工作温度-40 °C
封装高度3.2 mm
封装长度4.5 mm
封装形式SMT
封装宽度3.2 mm
包装方法TR, 7 Inch
最小质量因数(标称电感时)35
最大额定电流0.8 A
自谐振频率300 MHz
形状/尺寸说明RECTANGULAR PACKAGE
屏蔽NO
表面贴装YES
端子面层Matte Tin (Sn)
端子位置DUAL ENDED
端子形状WRAPAROUND
测试频率25.2 MHz
容差20%
Base Number Matches1

文档预览

下载PDF文档
PL
IA
NT
Features
n
High resistance to heat and humidity
OM
*R
oH
S
LE
AD
F
RE
E
pressure
n
Accurate dimensions for automatic
surface mounting
n
Wide inductance range (1.0 nH to 1000 µH)
n
RoHS compliant*
n
Resistance to mechanical shock and
C
22
0K
CM45 Series SMT Chip Inductors
General Specifications
Temperature Rise ...................................................................................................................................................................... 20 ˚C max.
Ambient Temperature .............................................................................................................................................................. 100 ˚C max.
Operating Temperature....................................................................................................................................................-40 °C to +125 °C
Storage Temperature .......................................................................................................................................................-40 °C to +125 °C
Resistance to Soldering Heat .........................................................................................................................................260 ˚C, 5 seconds
Materials
Core Material ............................................................................................................................................................................Ferrite Core
Coil Type...................................................................................................................................................................................Copper wire
Enclosure.................................................................................................................................................................................. Epoxy resin
Terminal ...................................................................................................................................................................................................Sn
CM453232
Product Dimensions
Marking
3.2 ± 0.2
(.125 ± .008)
1.9
(.075)
4.5 ± 0.3
(.177 ± .012)
1.2
(.047)
c
a
b
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Recommended Land Pattern Dimensions
3.2 ± 0.2
(.125 ± .008)
1.0
(.039)
1.0
(.039)
1.7 ± 0.2
(.066 ± .008)
a
2.0 to 2.4
(.079 to .094)
b
5.0 to 5.3
(.197 to .209)
c
1.4 to 1.7
(.055 to .067)
DIMENSIONS:
MM
(INCHES)
Soldering Profile
Temperature
Rising Area
Preheat Area
150~200 °C / 60~180 sec.
Reflow Area
Forced Cooling Area
6 °C / sec. max.
250
245
Temperature (°C)
217
200
60 ~ 150 sec.
20 ~ 40 sec.
Peak Temperature:
250 °C max.
Time at Peak
Temperature -5 °C:
20~40 sec. max.
Time Above 217 °C:
60 ~ 150 sec. max.
200 ~ 250 % Average
Ramp-up Rate:
3 °C / sec. max.
150
100
50
0
50
100
150
200
250
Time (Seconds)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
【verilog语法分析】并行块
在测试块中常用到fork…join块。用并行块能表示以同一个时间起点算起的多个事 件的运行,并行地执行复杂的过程结构,如循环或任务。举例说明如下: module inline_tb; reg data_bus; ......
eeleader FPGA/CPLD
lm3s9b96资料
新手资料...
85639973 微控制器 MCU
有哪位大神用149的片子调过DHT11吗?
表示调了两天还没有出来。...
keil050312223 微控制器 MCU
NUCLEO-L031小吹
本帖最后由 freebsder 于 2016-3-15 11:53 编辑 拿到板子一个多星期,断断续续了解了一下这板子和这颗MCU。板子的所有资料在这里,官方的资料就不倒手凑帖子了,需要的朋友自己可以 ......
freebsder stm32/stm8
cc2530 四个节点互相通信(采集温度)
采集温度 ,互相发送。具体怎么弄,求代码...
yukang_10 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 970  2054  2226  2291  1053  2  40  23  7  8 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved