Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> CM8064601575205S R1QZ

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CM8064601575205S R1QZ: 产品描述CPU - Central Processing Units 64BIT MPU; 产品类别半导体嵌入式处理器和控制器; 文件大小3MB，共126页; 制造商Intel(英特尔); 官网地址http://www.intel.com/; 标准

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CM8064601575205S R1QZ概述

CPU - Central Processing Units 64BIT MPU

CM8064601575205S R1QZ规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	Intel(英特尔)
产品种类 Product Category	CPU - Central Processing Units
RoHS	Details
系列 Packaging	Tray
工厂包装数量 Factory Pack Quantity	1

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Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and

Desktop Intel

Celeron

Processor

Family

Datasheet – Volume 1 of 2

March 2015

Order No.: 328897-010

Contents—Processor

Contents

Revision History..................................................................................................................9

1.0 Introduction................................................................................................................10

1.1

1.2

1.3

1.4

1.5

1.6

1.7

Supported Technologies.........................................................................................11

Interfaces............................................................................................................ 12

Power Management Support...................................................................................12

Thermal Management Support................................................................................13

Package Support...................................................................................................13

Terminology.........................................................................................................13

Related Documents............................................................................................... 16

2.0 Interfaces................................................................................................................... 18

2.1 System Memory Interface...................................................................................... 18

2.1.1 System Memory Technology Supported.......................................................19

2.1.2 System Memory Timing Support................................................................. 20

2.1.3 System Memory Organization Modes........................................................... 21

2.2 PCI Express* Interface.......................................................................................... 23

2.2.1 PCI Express* Support................................................................................ 23

2.2.2 PCI Express* Architecture.......................................................................... 24

2.2.3 PCI Express* Configuration Mechanism........................................................ 24

2.3 Direct Media Interface (DMI).................................................................................. 26

2.4 Processor Graphics................................................................................................28

2.5 Processor Graphics Controller (GT)..........................................................................28

2.5.1 3D and Video Engines for Graphics Processing.............................................. 29

2.5.2 Multi Graphics Controllers Multi-Monitor Support........................................... 31

2.6 Digital Display Interface (DDI)................................................................................31

2.7 Intel

Flexible Display Interface (Intel

FDI)............................................................ 37

2.8 Platform Environmental Control Interface (PECI)....................................................... 37

2.8.1 PECI Bus Architecture................................................................................37

3.0 Technologies............................................................................................................... 39

3.1 Intel

Virtualization Technology (Intel

VT)............................................................. 39

3.2 Intel

Trusted Execution Technology (Intel

TXT)..................................................... 43

3.3 Intel

Hyper-Threading Technology (Intel

HT Technology)....................................... 44

3.4 Intel

Turbo Boost Technology 2.0..........................................................................45

3.5 Intel

Advanced Vector Extensions 2.0 (Intel

AVX2)................................................45

3.6 Intel

Advanced Encryption Standard New Instructions (Intel

AES-NI).......................46

3.7 Intel

Transactional Synchronization Extensions - New Instructions (Intel

TSX-NI)..... 46

3.8 Intel

64 Architecture x2APIC................................................................................ 47

3.9 Power Aware Interrupt Routing (PAIR).................................................................... 48

3.10 Execute Disable Bit..............................................................................................48

3.11 Supervisor Mode Execution Protection (SMEP)........................................................48

4.0 Power Management.................................................................................................... 49

4.1 Advanced Configuration and Power Interface (ACPI) States Supported......................... 50

4.2 Processor Core Power Management......................................................................... 51

4.2.1 Enhanced Intel

SpeedStep

Technology Key Features..................................51

4.2.2 Low-Power Idle States............................................................................... 52

Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and Desktop Intel

Celeron

Processor Family

March 2015

Datasheet – Volume 1 of 2

Order No.: 328897-010

Processor—Contents

4.3

4.4

4.5

4.6

4.2.3 Requesting Low-Power Idle States...............................................................53

4.2.4 Core C-State Rules....................................................................................54

4.2.5 Package C-States......................................................................................55

4.2.6 Package C-States and Display Resolutions.................................................... 59

Integrated Memory Controller (IMC) Power Management............................................60

4.3.1 Disabling Unused System Memory Outputs................................................... 60

4.3.2 DRAM Power Management and Initialization..................................................61

4.3.3 DRAM Running Average Power Limitation (RAPL) .........................................63

4.3.4 DDR Electrical Power Gating (EPG).............................................................. 63

PCI Express* Power Management............................................................................63

Direct Media Interface (DMI) Power Management...................................................... 63

Graphics Power Management..................................................................................64

4.6.1 Intel

Rapid Memory Power Management (Intel

RMPM)................................64

4.6.2 Graphics Render C-State............................................................................64

4.6.3 Intel

Graphics Dynamic Frequency............................................................ 64

5.0 Thermal Management................................................................................................. 65

5.1 Desktop Processor Thermal Profiles......................................................................... 67

5.1.1 Processor (PCG 2013D and PCG 2014) Thermal Profile................................... 68

5.1.2 Processor (PCG 2013C) Thermal Profile........................................................69

5.1.3 Processor (PCG 2013B) Thermal Profile........................................................ 70

5.1.4 Processor (PCG 2013A) Thermal Profile........................................................ 72

5.2 Thermal Metrology................................................................................................ 73

5.3 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1.............................. 73

5.4 Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0.............................. 75

5.5 Thermal Specifications...........................................................................................76

5.6 Processor Temperature..........................................................................................78

5.7 Adaptive Thermal Monitor...................................................................................... 78

5.8 THERMTRIP# Signal.............................................................................................. 81

5.9 Digital Thermal Sensor.......................................................................................... 81

5.9.1 Digital Thermal Sensor Accuracy (Taccuracy)................................................82

5.10 Intel

Turbo Boost Technology Thermal Considerations............................................82

5.10.1 Intel

Turbo Boost Technology Power Control and Reporting.........................82

5.10.2 Package Power Control.............................................................................83

5.10.3 Turbo Time Parameter............................................................................. 84

6.0 Signal Description....................................................................................................... 86

6.1 System Memory Interface Signals........................................................................... 86

6.2 Memory Reference Compensation Signals.................................................................88

6.3 Reset and Miscellaneous Signals............................................................................. 89

6.4 PCI Express* Interface Signals............................................................................... 90

6.5 Display Interface Signals....................................................................................... 90

6.6 Direct Media Interface (DMI).................................................................................. 90

6.7 Phase Locked Loop (PLL) Signals.............................................................................91

6.8 Testability Signals.................................................................................................91

6.9 Error and Thermal Protection Signals....................................................................... 92

6.10 Power Sequencing Signals.................................................................................... 92

6.11 Processor Power Signals.......................................................................................93

6.12 Sense Signals..................................................................................................... 93

6.13 Ground and Non-Critical to Function (NCTF) Signals.................................................93

6.14 Processor Internal Pull-Up / Pull-Down Terminations................................................ 93

Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and Desktop Intel

Celeron

Processor Family

Datasheet – Volume 1 of 2

March 2015

Order No.: 328897-010

Contents—Processor

7.0 Electrical Specifications.............................................................................................. 94

7.1

7.2

7.3

7.4

7.5

7.6

7.7

7.8

Integrated Voltage Regulator..................................................................................94

Power and Ground Lands ...................................................................................... 94

Voltage Identification (VID).............................................................................. 94

Reserved or Unused Signals................................................................................... 99

Signal Groups.......................................................................................................99

Test Access Port (TAP) Connection........................................................................ 101

DC Specifications............................................................................................... 101

Voltage and Current Specifications........................................................................ 102

7.8.1 Platform Environment Control Interface (PECI) DC Characteristics................. 107

7.8.2 Input Device Hysteresis........................................................................... 108

Processor Component Keep-Out Zone.................................................................... 109

Package Loading Specifications............................................................................. 109

Package Handling Guidelines................................................................................ 110

Package Insertion Specifications............................................................................110

Processor Mass Specification.................................................................................110

Processor Materials............................................................................................. 110

Processor Markings............................................................................................. 111

Processor Land Coordinates.................................................................................. 111

Processor Storage Specifications........................................................................... 113

8.0 Package Mechanical Specifications........................................................................... 109

8.1

8.2

8.3

8.4

8.5

8.6

8.7

8.8

8.9

9.0 Processor Ball and Signal Information...................................................................... 115

Desktop 4th Generation Intel

Core

™

Processor Family, Desktop Intel

Pentium

Processor Family, and Desktop Intel

Celeron

Processor Family

March 2015

Datasheet – Volume 1 of 2

Order No.: 328897-010

CM8064601575205S R1QZ相似产品对比

	CM8064601575205S R1QZ	CM8064601575332S-R1R5	CM8064601575206S R1R0	BX80646G3470 S R1K4	CM8064601575331S R1R4	BX80646E31231V3S R1R5	BX80646G3440 S R1P9
描述	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU
Product Attribute	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value
制造商 Manufacturer	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)
产品种类 Product Category	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units
RoHS	Details	Details	Details	-	Details	-	-
系列 Packaging	Tray	Tray	Tray	Bulk	Tray	-	Bulk
工厂包装数量 Factory Pack Quantity	1	1	1	5	1	-	5

CM8064601575205S R1QZ

CM8064601575205S R1QZ概述

CM8064601575205S R1QZ规格参数

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