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GS78108AGB-15I: 产品描述1M x 8 8Mb Asynchronous SRAM; 产品类别存储存储; 文件大小443KB，共11页; 制造商GSI Technology; 官网地址http://www.gsitechnology.com/; 标准

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GS78108AGB-15I概述

1M x 8 8Mb Asynchronous SRAM

GS78108AGB-15I规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	GSI Technology
零件包装代码	BGA
包装说明	BGA,
针数	119
Reach Compliance Code	compli
ECCN代码	3A991.B.2.B
最长访问时间	15 ns
其他特性	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT
JESD-30 代码	R-PBGA-B119
JESD-609代码	e1
长度	22 mm
内存密度	8388608 bi
内存集成电路类型	STANDARD SRAM
内存宽度	8
湿度敏感等级	3
功能数量	1
端子数量	119
字数	1048576 words
字数代码	1000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	1MX8
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY
并行/串行	PARALLEL
峰值回流温度（摄氏度）	260
认证状态	Not Qualified
座面最大高度	1.99 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	TIN SILVER COPPER
端子形式	BALL
端子节距	1.27 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	14 mm

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GS78108AB

BGA

Commercial Temp

Industrial Temp

Features

• Fast access time: 8, 10, 12 ns

• CMOS low power operation: 240/190/170 mA at minimum

cycle time

• Single 3.3 V ± 0.3 V power supply

• All inputs and outputs are TTL-compatible

• Fully static operation

• Industrial Temperature Option: –40° to 85°C

• 14 mm x 22 mm, 119-bump, 1.27 mm Pitch Ball Grid Array

package

• RoHS-compliant package available

1M x 8

8Mb Asynchronous SRAM

8, 10, 12 ns

3.3 V V

Symbol

to A

to DQ

Pin Descriptions

Description

Address input

Data input/output

Chip enable input

Write enable input

Output enable input

+3.3 V power supply

Ground

No connect

Description

The GS78108A is a high speed CMOS Static RAM organized

as 1,048,576-words by 8-bits. Static design eliminates the need

for external clocks or timing strobes. The GS78108operates on

a single 3.3 V power supply, and all inputs and outputs are

TTL-compatible. The GS7810A8 is available in a

14 mm x 22 mm BGA package.

Block Diagram

Address

Input

Buffer

Row

Decoder

Memory Array

Column

Decoder

Control

I/O Buffer

Rev: 1.04 5/2006

1/11

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS78108AGB-15I相似产品对比

	GS78108AGB-15I	GS78108AB	GS78108AB-12	GS78108AB-8	GS78108AGB-8I	GS78108AGB-10I	GS78108AB-15I	GS78108AB-12I
描述	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM	1M x 8 8Mb Asynchronous SRAM
是否无铅	不含铅	-	含铅	含铅	不含铅	不含铅	含铅	含铅
是否Rohs认证	符合	-	不符合	不符合	符合	符合	不符合	不符合
厂商名称	GSI Technology	-	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology
零件包装代码	BGA	-	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	BGA,	-	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
针数	119	-	119	119	119	119	119	119
Reach Compliance Code	compli	-	compli	compli	compli	compli	compli	compli
ECCN代码	3A991.B.2.B	-	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
最长访问时间	15 ns	-	12 ns	8 ns	8 ns	10 ns	15 ns	12 ns
其他特性	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT	-	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT	THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT
JESD-30 代码	R-PBGA-B119	-	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119
JESD-609代码	e1	-	e0	e0	e1	e1	e0	e0
长度	22 mm	-	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm
内存密度	8388608 bi	-	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi	8388608 bi
内存集成电路类型	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	8	-	8	8	8	8	8	8
湿度敏感等级	3	-	3	3	3	3	3	3
功能数量	1	-	1	1	1	1	1	1
端子数量	119	-	119	119	119	119	119	119
字数	1048576 words	-	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
字数代码	1000000	-	1000000	1000000	1000000	1000000	1000000	1000000
工作模式	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	-	70 °C	70 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-	-	-	-40 °C	-40 °C	-40 °C	-40 °C
组织	1MX8	-	1MX8	1MX8	1MX8	1MX8	1MX8	1MX8
封装主体材料	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	-	BGA	BGA	BGA	BGA	BGA	BGA
封装形状	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
并行/串行	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	260	-	NOT SPECIFIED	NOT SPECIFIED	260	260	NOT SPECIFIED	NOT SPECIFIED
认证状态	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.99 mm	-	1.99 mm	1.99 mm	1.99 mm	1.99 mm	1.99 mm	1.99 mm
最大供电电压 (Vsup)	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	3 V	-	3 V	3 V	3 V	3 V	3 V	3 V
标称供电电压 (Vsup)	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	-	YES	YES	YES	YES	YES	YES
技术	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	-	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	TIN SILVER COPPER	-	TIN LEAD	TIN LEAD	TIN SILVER COPPER	TIN SILVER COPPER	TIN LEAD	TIN LEAD
端子形式	BALL	-	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	14 mm	-	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
Factory Lead Time	-	-	25 weeks 5 days	25 weeks 5 days	12 weeks	12 weeks	-	25 weeks 5 days

GS78108AGB-15I

GS78108AGB-15I概述

GS78108AGB-15I规格参数

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