256K X 32 STANDARD SRAM, 8 ns, PBGA119
256K × 32 标准存储器, 8 ns, PBGA119
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | GSI Technology |
| 零件包装代码 | BGA |
| 包装说明 | BGA, |
| 针数 | 119 |
| Reach Compliance Code | compli |
| ECCN代码 | 3A991.B.2.B |
| 最长访问时间 | 15 ns |
| 其他特性 | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. |
| JESD-30 代码 | R-PBGA-B119 |
| JESD-609代码 | e1 |
| 长度 | 22 mm |
| 内存密度 | 8388608 bi |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 32 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 119 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256KX32 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.99 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN SILVER COPPER |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 14 mm |
| GS78132AGB-15I | GS78132AB | GS78132AGB-8 | GS78132AGB-12 | GS78132AGB-10I | GS78132AB-8I | GS78132AB-15I | |
|---|---|---|---|---|---|---|---|
| 描述 | 256K X 32 STANDARD SRAM, 8 ns, PBGA119 | 256K X 32 STANDARD SRAM, 8 ns, PBGA119 | 256K X 32 STANDARD SRAM, 8 ns, PBGA119 | 256K X 32 STANDARD SRAM, 8 ns, PBGA119 | 256K X 32 STANDARD SRAM, 8 ns, PBGA119 | 256K X 32 STANDARD SRAM, 8 ns, PBGA119 | 256K X 32 STANDARD SRAM, 8 ns, PBGA119 |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 119 | 119 | 119 | 119 | 119 | 119 | 119 |
| 组织 | 256KX32 | 256K X 32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
| 表面贴装 | YES | Yes | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 不符合 | 不符合 |
| 厂商名称 | GSI Technology | - | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology |
| 零件包装代码 | BGA | - | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | BGA, | - | BGA, | BGA, | BGA, | BGA, | BGA, |
| 针数 | 119 | - | 119 | 119 | 119 | 119 | 119 |
| Reach Compliance Code | compli | - | compli | compli | compli | compli | compli |
| ECCN代码 | 3A991.B.2.B | - | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| 最长访问时间 | 15 ns | - | 8 ns | 12 ns | 10 ns | 8 ns | 15 ns |
| 其他特性 | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. | - | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. | THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT. |
| JESD-30 代码 | R-PBGA-B119 | - | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 |
| JESD-609代码 | e1 | - | e1 | e1 | e1 | e0 | e0 |
| 长度 | 22 mm | - | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm |
| 内存密度 | 8388608 bi | - | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi | 8388608 bi |
| 内存集成电路类型 | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 湿度敏感等级 | 3 | - | 3 | 3 | 3 | 3 | 3 |
| 字数 | 262144 words | - | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | - | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | - | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | - | BGA | BGA | BGA | BGA | BGA |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | - | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.99 mm | - | 1.99 mm | 1.99 mm | 1.99 mm | 1.99 mm | 1.99 mm |
| 最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | TIN SILVER COPPER | - | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN LEAD | TIN LEAD |
| 端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 14 mm | - | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| Factory Lead Time | - | - | 10 weeks | 10 weeks | 10 weeks | 12 weeks | - |
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