版数
VER.
年月日
D A T E
CN NO.
変 更 内 容
DESCRIPTION
½ 図
DR.
担 ½
CHK.
査 閲
APPD.
承 認
APPD.
20°
PIN 75 (NOTE3)
(PIN 67)
KEY #(TABLE1)
c
d
(COMPONENT HEIGHT)
2.68
3
0.15
±0.05
(×34)
0.2 A
(-)
G- C
L
(+)
D
(COMPONENT
HEIGHT)
PIN 1
1
A- C
L
4
Z (TABLE2)
2.45
±0.05
1.2
DESIGNATION
(NOTE5)
LOT NO.
(NOTE5)
× × × ×
× × × ×
J A E
(VACUUM AREA)
(NOTE4)
(吸着エリア)
3
TOP VIEW
4
min.
1.75
A
0.5
±0.05
3.58
2
±0.15
PIN 74 (NOTE3)
(PIN 66)
PIN 2
7.1
MATING CONDITION
SCALE (10:1)
B
(VACUUM AREA) (NOTE4)
(吸着エリア)
a
18
H
20.15
±0.1
21.9
±0.1
X
±0.03
b
2
0.15
±0.05
(×33)
0.2 A
0.5
R0.5
±0.15
(PITCH)
E
PIN 75 (NOTE2)
(PIN 67)
0.5
0.35
±0.04
(×34)
0.13 D E F
0.05
D
d
18.5
19.85
±0.15
PIN 1
F
0.8
±0.08
(PAD AREA)
(PITCH)
4.1
±0.1
c
5°
20 °
±
(DEFINED BY
DATUM H)
(+)
(-) H- C
L
NOTE5.PRODUCTION LOT No.&MODIFY CODE AS INDICATED.
(Ex. LOT NO.) T 5 Y B
1.83
±0.2
4.5
±0.2
2 0°
±
5°
G
0.3
±0.25
0.3
±0.25
LOT NUMBER OF CURRENT DAY
(SEE TABLE 4)
MONTH (1 TO 9 FOR JAN. TO SEPT,
RESPECTIVELY,
OCT.:0, NOV.:X, DEC.:Y)
YEAR (LAST DIGIT ONLY)
MANUFACTURE CODE
0.5 (PITCH)
0.35
±0.04
(×33)
0.13 D E F
18
b
a
0.9
±0.05
10
±0.025
1.4
±0.05
10
±0.025
0.62
A- C
L
1.72
1.83
2.45
±0.15
5.15
±0.15
(DESIGNATION) S M 3 A
KEY POSITION
TYPE:A,B,E,M
SERIES PREFIX
PIN 74 (NOTE2)
(PIN 66)
PIN 2
DETAIL B
SCALE(10:1)
0.05
D
5.2 min.
FULL R
0.5
±0.05
2.5
±0.15
21.9
±0.1
1.2
±0.03
c
1.55
±0.03
18.5
d
C
2.75
±0.03
0.5
DESIGNATION
SM3ZS067U410※※
SERIES
½ﾘ½½½ﾞ
Z:LIF TYPE
Z:½挿入ﾀ½ﾌﾟ
S:STANDARD
5.875
±0.05
KEY POSITION
TYPE:A,B,E,M
CONTACT FINISH
接点仕上げ
A:Au(0.13μm MIN)
B:Au(0.25μm MIN)
PRODUCT HEIGHT
½品高さ
215:2.15mm
310:3.10mm
410:4.10mm
PIN 1
MODULE SEATING PLANE
PIN 75 (NOTE2)
(PIN 67)
0.3
±0.03
0.1 B
C
BOTTOM VIEW
6
±0.05
NO. OF CONTACTS
芯数
MOUNTING TYPE
実装ﾀ½ﾌﾟ
U:ON BOARD TYPE
TABLE 1
1.2
±0.065
9.1 MAX
9
DETAIL A
SCALE(10:1)
1.1
±0.05
1.6
±0.05
APPLICABLE MODULE DIMENSION(REF.)
SCALE(5:1)
d
14.5
13.5
10.5
2
4
3
2
1
HOLD DOWN
TOP SIDE CONTACT
1.75
KEY#
A
B
E
M
X
+6.625
+5.625
+2.625
-6.125
a
1
2
5
14
b
14.5
13.5
10.5
1.5
c
1.5
2.5
5.5
14
2
COPPER ALLOY
TIN PLATING OVER NI
CONTACT AREA:
REFER TO DESIGNATION
SOLDERING AREA:
Au FLASH OVER Ni
CONTACT AREA:
REFER TO DESIGNATION
SOLDERING AREA:
Au FLASH OVER Ni
仕 上
FINISH
備 考
REMARKS
B
1.55
±0.03
3
±0.05
34 COPPER ALLOY
33 COPPER ALLOY
1
THERMO PLASTIC
材 料
MATERIAL
PIN 2
a
PIN 74 (NOTE2)
(PIN 66)
b
18
10
±0.025
10
±0.025
0.3
±0.03
0.1 B
0.5
C
BOTTOM SIDE CONTACT
INSULATOR
名 称
DESCRIPTION
TABLE 2
COMPONENT HEGHTS
FOR MODULES
1.2 MAX
1.35 MAX
1.5 MAX
Z
4.55 MAX RSS
4.70 MAX RSS
4.85 MAX RSS
符号
NO.
個 数
QTY.
仕様書(SPECIFICATION)
第1版(ORIGINAL DATE)
½図
DR.
08/JAN/2013
尺度(SCALE)
シリーズ(SERIES)
名称(TITLE)
DCF-C-213H(12.08)
NOTE1.
NOTE2.
NOTE3.
NOTE4.
THE COPLANARITY OF CONTACT AND HOLD DOWN SHALL BE 0.1 MAXIMUM ON THE SURFACE TABLE.
THIS NUMBER IS PIN-OUT NUMBER DEFINED BY NGFF SPECIFICATION.
THIS CONNECTOR IS HALOGEN FREE CORRESPONDENCE PRODUCT.
THIS AREA SHALL NOT SHOW ANY BURRS AND UNEVEN SURFACE BY EJECTOR PIN MARK,
TOOL PARTING LINE, AND ANY OTHER FACTORS.
S/W
寸法(DIMENSION)
．
．
．
．
±
0.8
±
0.4
±
0.1
±
角度(ANGLES)
°
’
°
±
±
担½
CHK.
査閲
APPD.
承認
APPD.
S.YAMAGUCHI
R.KATOU
T.SHINDOU
SM3ZS067U410※※
(NGFF
Double-Sided modules)
質量(MASS)
図面番号(DRAWING NO.)
版数
(VER.)
単½(UNIT)：㎜
SJ113503
0
10
20
30
40
50
60
70
80
90
100
JAE Connector DIV. Proprietary.Copyright(C) 2013, Japan Aviation Electronics Industry, LTD.
SIZE
APPLICABLE P.C.B. DIMENSION(REF.)
SCALE(5:1)
一般公差(GENERAL TOLERANCE)
JAPAN AVIATION
ELECTRONICS
INDUSTRY,LTD.
A2
5:1
SM3
日本航空電子工業株式会社
3.5
±0.15
1
2013/01/24
図面番号(DRAWING NO.)
A
SJ113503
10.45
±0.1
18.5
0.5
(PITCH)
10.45
±0.1
9.25
X
±0.05
1.35 max.
1.35 max.
嵌入式系统
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