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GS8161Z18BD-150I

产品描述512K X 36 ZBT SRAM, 6.5 ns, PBGA165
产品类别存储    存储   
文件大小608KB,共37页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
下载文档 详细参数 全文预览

GS8161Z18BD-150I概述

512K X 36 ZBT SRAM, 6.5 ns, PBGA165

512K × 36 ZBT 静态随机存储器, 6.5 ns, PBGA165

GS8161Z18BD-150I规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称GSI Technology
零件包装代码BGA
包装说明13 X 15 MM, 1 MM PITCH, FBGA-165
针数165
Reach Compliance Code_compli
ECCN代码3A991.B.2.B
最长访问时间7.5 ns
其他特性FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
JESD-30 代码R-PBGA-B165
JESD-609代码e0
长度15 mm
内存密度18874368 bi
内存集成电路类型ZBT SRAM
内存宽度18
功能数量1
端子数量165
字数1048576 words
字数代码1000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织1MX18
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
座面最大高度1.4 mm
最大供电电压 (Vsup)2.7 V
最小供电电压 (Vsup)2.3 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度13 mm

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Preliminary
GS8161Z18B(T/D)/GS8161Z32B(D)/GS8161Z36B(T/D)
Commercial Temp
Industrial Temp
Features
18Mb Pipelined and Flow Through
Synchronous NBT SRAM
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
• User-configurable Pipeline and Flow Through mode
• NBT (No Bus Turn Around) functionality allows zero wait
read-write-read bus utilization
• Fully pin-compatible with both pipelined and flow through
NtRAM™, NoBL™ and ZBT™ SRAMs
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 2.5 V or 3.3 V +10%/–10% core power supply
• LBO pin for Linear or Interleave Burst mode
• Pin-compatible with 2M, 4M, and 8M devices
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• ZZ pin for automatic power-down
• JEDEC-standard 100-lead TQFP and 165-bump FP-BGA
packages
• Pb-Free 100-lead TQFP package available
rail for proper operation. Asynchronous inputs include the
Sleep mode enable, ZZ and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-
chip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.
The GS8161Z18B(T/D)/GS8161Z32B(D)/GS8161Z36B(T/D)
may be configured by the user to operate in Pipeline or Flow
Through mode. Operating as a pipelined synchronous device,
in addition to the rising-edge-triggered registers that capture
input signals, the device incorporates a rising-edge-triggered
output register. For read cycles, pipelined SRAM output data is
temporarily stored by the edge triggered output register during
the access cycle and then released to the output drivers at the
next rising edge of clock.
The GS8161Z18B(T/D)/GS8161Z32B(D)/GS8161Z36B(T/D)
is implemented with GSI's high performance CMOS
technology and is available in JEDEC-standard 100-pin TQFP
and 165-bump FP-BGA packages.
Functional Description
The GS8161Z18B(T/D)/GS8161Z32B(D)/GS8161Z36B(T/D)
is an 18Mbit Synchronous Static SRAM. GSI's NBT SRAMs,
like ZBT, NtRAM, NoBL or other pipelined read/double late
write or flow through read/single late write SRAMs, allow
utilization of all available bus bandwidth by eliminating the
need to insert deselect cycles when the device is switched from
read to write cycles.
Because it is a synchronous device, address, data inputs, and
read/ write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
Parameter Synopsis
-250
Pipeline
3-1-1-1
t
KQ
(x18/x36)
tCycle
Curr
(x18)
Curr
(x32/x36)
t
KQ
tCycle
Curr
(x18)
Curr
(x32/x36)
2.5
4.0
280
330
5.5
5.5
210
240
-200
3.0
5.0
230
270
6.5
6.5
185
205
-150
3.8
6.7
185
210
7.5
7.5
170
190
Unit
ns
ns
mA
mA
ns
ns
mA
mA
Flow Through
2-1-1-1
Rev: 1.00 9/2004
1/37
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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