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GS8161Z36BD

产品描述512K X 36 ZBT SRAM, 6.5 ns, PBGA165
产品类别存储   
文件大小608KB,共37页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
下载文档 详细参数 全文预览

GS8161Z36BD概述

512K X 36 ZBT SRAM, 6.5 ns, PBGA165

512K × 36 ZBT 静态随机存储器, 6.5 ns, PBGA165

GS8161Z36BD规格参数

参数名称属性值
功能数量1
端子数量165
最大工作温度85 Cel
最小工作温度-40 Cel
最大供电/工作电压2.7 V
最小供电/工作电压2.3 V
额定供电电压2.5 V
最大存取时间6.5 ns
加工封装描述13 × 15 MM, 1 MM PITCH, FBGA-165
状态EOL/LIFEBUY
工艺CMOS
包装形状矩形的
包装尺寸GRID 阵列, 低 PROFILE
表面贴装Yes
端子形式BALL
端子间距1 mm
端子涂层锡 铅
端子位置BOTTOM
包装材料塑料/环氧树脂
温度等级INDUSTRIAL
内存宽度36
组织512K × 36
存储密度1.89E7 deg
操作模式同步
位数524288 words
位数512K
内存IC类型ZBT 静态随机存储器
串行并行并行

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Preliminary
GS8161Z18B(T/D)/GS8161Z32B(D)/GS8161Z36B(T/D)
Commercial Temp
Industrial Temp
Features
18Mb Pipelined and Flow Through
Synchronous NBT SRAM
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
• User-configurable Pipeline and Flow Through mode
• NBT (No Bus Turn Around) functionality allows zero wait
read-write-read bus utilization
• Fully pin-compatible with both pipelined and flow through
NtRAM™, NoBL™ and ZBT™ SRAMs
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 2.5 V or 3.3 V +10%/–10% core power supply
• LBO pin for Linear or Interleave Burst mode
• Pin-compatible with 2M, 4M, and 8M devices
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• ZZ pin for automatic power-down
• JEDEC-standard 100-lead TQFP and 165-bump FP-BGA
packages
• Pb-Free 100-lead TQFP package available
rail for proper operation. Asynchronous inputs include the
Sleep mode enable, ZZ and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-
chip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.
The GS8161Z18B(T/D)/GS8161Z32B(D)/GS8161Z36B(T/D)
may be configured by the user to operate in Pipeline or Flow
Through mode. Operating as a pipelined synchronous device,
in addition to the rising-edge-triggered registers that capture
input signals, the device incorporates a rising-edge-triggered
output register. For read cycles, pipelined SRAM output data is
temporarily stored by the edge triggered output register during
the access cycle and then released to the output drivers at the
next rising edge of clock.
The GS8161Z18B(T/D)/GS8161Z32B(D)/GS8161Z36B(T/D)
is implemented with GSI's high performance CMOS
technology and is available in JEDEC-standard 100-pin TQFP
and 165-bump FP-BGA packages.
Functional Description
The GS8161Z18B(T/D)/GS8161Z32B(D)/GS8161Z36B(T/D)
is an 18Mbit Synchronous Static SRAM. GSI's NBT SRAMs,
like ZBT, NtRAM, NoBL or other pipelined read/double late
write or flow through read/single late write SRAMs, allow
utilization of all available bus bandwidth by eliminating the
need to insert deselect cycles when the device is switched from
read to write cycles.
Because it is a synchronous device, address, data inputs, and
read/ write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
Parameter Synopsis
-250
Pipeline
3-1-1-1
t
KQ
(x18/x36)
tCycle
Curr
(x18)
Curr
(x32/x36)
t
KQ
tCycle
Curr
(x18)
Curr
(x32/x36)
2.5
4.0
280
330
5.5
5.5
210
240
-200
3.0
5.0
230
270
6.5
6.5
185
205
-150
3.8
6.7
185
210
7.5
7.5
170
190
Unit
ns
ns
mA
mA
ns
ns
mA
mA
Flow Through
2-1-1-1
Rev: 1.00 9/2004
1/37
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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